|| E.M. Davis, W.E. Harding, R.S. Schwartz, and J.J. Corning, IBM J. Res. Develop., 1964|
 J.H. Lau, McGraw-Hill, “Ball Grid Array Technology,” New York, 1995.
 Pat Thompson, “Chip Scale Packaging,” IEEE Spectrum, Aug. 1997.
 Advanced Electronic Packaging, Second Edition, Richard K. Ulrich and William D. Brown, 2006.
 Navas Khan, John H. Lau, “Development of 3-D Silicon Module With TSV for System in Packaging,” IEEE Transactions on Components and Packaging Technologies, vol. 33, no. 1, Mar. 2010.
 Y. Arai, M. Sato, H.T. Yamada, T. Hamada, K. Nagai and H. I. Fujishiro, “60 GHz flip-chip assembled MIC design considering chip-substrate effect,” IEEE Trans. on Microwave Theory and Techniques, vol.45, pp. 2261-2266, Dec. 1997.
 T. Hirose K. Makiyama, K. Ono, T. M. Shimura, S. Aoki, Y. Ohashi, S. Yokokawa and Y. Watanabe, “ A flip-chip MMIC design with CPW technology in the W-band,” IEEE MTT-S Int. Microwave Symp. Dig., pp. 525-528, June 1998.
 劉佑安, “利用單石微波積體電路與覆晶技術製作之Ka頻段振盪器”, 碩士論文, 國立中央大學, 民國94年。
 Yumin Koh, Ungbi Son, Sangsub Song, and Kwang-Seok Seo, “A Micromachined Air-Cavity Oscillator for 94 GHz Applications,” International Conference on Solid State Devices and Materials, pp. 474-475, 2009.
 N. Tanzi, J. Dykstra and K. Hustchinson, “A 1-Watt Doubly Balanced 5GHz Flip-chip SiGe Power Amplifier,” RFIC Symposium, pp. 141–144, 2003.
 P.D. Tseng, , L.Y. Zhang, G.B. Gao, M.F. Chang and W.-K. Chen, “A Monolithic SiGe Power Amplifier for Dual-Mode (CDMA/AMPS) Cellular Handset Applications,” Proc. of Bipolar/BiCMOS Circuits and Tech. Meeting, pp. 153-156, 1999.
 M. Maiore, G. Berretta, G. Conti, E. Pirrone and C. Campisi. “A 63% PAE and 10:1 VSWR at 3.3V power amplifier in 0.25 mm SiGe BiCMOS for DCS and PCS applications,” Radio and Wireless Symposium, pp. 247-250, 2006.
 N.-H. Huynh, W. Heinrich, K. Hirche, W. Scholz, M. Warth and W. Ehrlinger, “Optimized flip-chip interconnect for 38GHz thin-film microstrip multichip modules,” IEEE MTT-S Int. Microwave Symp. Dig., pp. 69-72, June 2004.
 S. Song, Y. Kim, J. Maeng, H. Lee, Y. Kwon and K.-S. Seo, “A millimeter-wave system-on-package technology using a thin-film substrate with a flip-chip interconnection,” IEEE Trans. on Advanced Packaging, vol. 32, pp. 101-108, Feb. 2009.
 Jerry Jordna, “Gold Stud Bumps in Flip-Chip Application”, IEEE International Electronics Manufacturing Technology Symposium, July 2002.
 C.-C. Lin, P.-C. Yeh, and H.-K. Chiou, “An evaluation of SiGe/Si HBT high efficiency power amplifiers for dynamic power control range application” Proc. of Circuits and System, Asia-Pacific conf. on., pp. 281-284, 2004.
 Bumman Kim, Jangheon Kim, Ildu Kim, and Jeonghyeon Cha, “The Doherty Power Amplifier,” IEEE Microwave Magazine, Oct. 2006.
 W.H. Doherty, “A new high efficiency power amplifier for modulated waves,” Proc. IRE, vol. 24, no. 9, pp. 1163–1182, 1936.
 RF Power Amplifiers for Wireless Communications, S.C. Cripps, 1999.
 J.-H. Tasi, and T.-W. Huang, “A 38-46 GHz MMIC Doherty power amplifier using post-distortion linearization,” IEEE Microw. and Wireless Compon. Lett., vol. 17, no. 5, pp. 388-390, May 2007.
 C.-Y. Liu, T.-N. Luo, Yi-Jan Emery Chen and Deukhyoun Heo, “A 2.4 GHz CMOS Doherty Power Amplifier,” Microwave Symposium Digest, pp. 885-888, 2006.
 Daekyu Yu, Y.-W. Kim, Kichon Han, J.-H. Shin and Bumman Kim, “Fully integrated Doherty power amplifiers for 5 GHz wireless-LANs,” RFIC Symposium, pp. 141–144, 2006.
 A. Jentzsch, and W. Heinrich, “Optimization of flip-chip interconnects for millimeter-wave frequencies,” IEEE MTT-S Int. Symp. Dig., vol. 2, pp. 637-640, Jun. 1999.
 H. H. M. Ghouz, and E. B. El-Sharawy, “Finite-difference time-domain analysis of flip-chip interconnects with staggered bumps,” IEEE Trans. Microwave Theory Tech., vol. 44, no. 6, pp. 960-963, June 1996.
 W. Heinrich, A. Jentzsch, and H. Richter, “Flip-chip interconnects for frequencies up to W band,” IEEE Electronics Letters, vol. 37, no. 3, pp. 180-181, Feb. 2001.
 F. J. Schmuckle, A. Jentzsch, H. Oppermann, K. Riepe, W. Heinrich, “W-band flip-chip interconnects on thin-film substrate,” IEEE MTT-S Int. Symp. Dig., vol. 3, pp. 1393-1396, Jun. 2002.
 Y.-S. Jiang, J.-H. Tsai and H. Wang, “A 86 to 108 GHz amplifier in 90 nm CMOS,” IEEE Microwave Wireless Components Letter, vol.18, no.2, pp. 124-126, Feb. 2008.
 Y.-S. Jiang, J.-H. Tsai, and H. Wang, "A W-Band medium power amplifier in 90 nm CMOS,” IEEE Microwave Wireless Components Letter, vol.18, no.12, pp. 818-820, Dec. 2008.
 Phased Array Antennas, 2nd Edition, Robert C. Hansen, 2009.
 Che-Chung Kuo, Po-An Lin, Hsin-Chia Lu, Yu-Sian Jiang, Chia-Ming Liu,Yue-Ming Hsin and Huei Wang “W-band Flip-Chip Assembled CMOS Amplifier with Transition Compensation Network for SiP Integration,” IEEE MTT-S Int. Microwave Symp. Dig., pp. 465-468, May 2010.