摻雜銀或銀銅氮氧化鉭薄膜之製備、特性分析及抗菌行為分析

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羅章彥(chang yen lo) 查詢紙本館藏

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機械工程學系

論文名稱

摻雜銀或銀銅氮氧化鉭薄膜之製備、特性分析及抗菌行為分析
(Fabrications and Characterizations of(Ag,Cu)TaON for its Structures and Antibacterial Behavior)

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摘要(中)

本研究以反應式共濺鍍製備摻雜銀或銀銅氮氧化鉭薄膜並研究其薄膜表面析出的情形與抗菌特性，使用Ta、Ag、Cu元素在N2、O2及Ar氛圍下濺鍍，分析其薄膜特性。使用能量散射光譜儀(Energy Dispersive Spectrometers，EDS)檢測不同摻雜含量試片，實驗參數設定銀含量為2 at%、5 at%、7 at%、10 at%，與不同銅銀含量比為1.5 at% - 1.5 at%、2.5 at% - 2.5 at%、5 at% - 5 at%、3 at% - 7 at%、7 at% - 3 at% 來做不同含量及含量由低至高的抗菌分析及微結構分析。濺鍍沉積溫度為300 °C，再使用快速退火爐於氬氣流量於3000 sccm、800 °C、5 min快速退火的熱處理，觀察其不同含量比值下於薄膜表面的析出物及微結構的改變。薄膜微結構使用X光繞射(X-Ray Diffraction，XRD)，表面形貌使用場發射掃瞄式電子顯微鏡(Field-Emission Scanning Electron Microscope，FE-SEM)儀器觀察，再經由穿透式電子顯微鏡(Transmission Electron Microscopy，TEM)，來進行薄膜明暗場分析，發現銅銀摻雜TaON薄膜中，以顆粒的形式析出於表面。使用電漿耦合光譜儀 (ICP-OES)分析薄膜於磷酸鹽緩衝液中可溶解的濃度，抗菌分析菌種選用大腸桿菌，濃度約為3×106，將薄膜置入菌液中可觀察出，當氮氧化鉭薄膜照光後其效率高於未照光的薄膜，表示氮氧化鉭薄膜具光觸媒之效應，氮氧化鉭薄膜摻雜銀後，抗菌效率因銀的摻雜後有提升的效果；進一步摻雜銅銀的氮氧化鉭薄膜，具有三重殺菌效果。並使用抗菌動力學來描述不同含量的銀銅氮氧化鉭薄膜及銅銀離子溶液對大腸桿菌做抗菌行為的描述，發現摻雜銀銅氮氧化鉭薄膜，其抗菌行為擁有光觸媒、銀、及銅的三重抗菌效果，未混合的銅、銀離子溶液及混合後銅銀離子溶液做抗菌分析時，發現混合後的銅銀離子溶液的抗菌效果均要比混合溶液的效果來的好。

摘要(英)

TaON, TaON-Ag, TaON-(Ag,Cu) were prepared by reactive co-sputtering of Ta, Ag and Cu in O2, N2, and Ar plasma. The deposition temperature was 300 °C. The Ag contents in TaON-Ag were 2 at.%, 5 at.%, 7 at.%, 10 at.% and the Ag-Cu contents in TaON-(Ag,Cu) were 1.5 at.% - 1.5 at.%, 2.5 at.% - 2.5 at.%, 5 at.% - 5 at.%, 3 at.% - 7 at.%, 7 at.% - 3 at.% respectively. After deposition, all the samples were annealed at 800 °C for 5 minutes by rapid thermal annealing (RTA). These films were characterized by a variety of techniques including X-ray diffraction, FESEM (field emission scanning electron microscopy), and TEM (transmission electron microscopy). Inductively coupled plasma optical emission spectrometer (ICP-OES) was used to analyze dissolved ion concentrations when the thin films were immersed in the buffer solution. The antibacterial tests were carried out with E-coli. The results show that the un-doped TaON could be used as a visible-light antibacterial photo-catalyst. TaON–Ag films, with or without visible light irradiation, have a significantly improvement in antibacterial behavior. Furthermore, it is found that co-deposition of Ag and Cu into TaON films could lead to a triple bactericidal effect, due to the antibacterial effects of Ag, Cu, and TaON.
At final, antibacterial kinetics was used to analyze the bactericidal effects of these TaON thin films doped with Ag and Ag-Cu with various concentrations. The results confirm that TaON-( Ag, Cu) films have a triple effect on antibacterial efficiency. To further understand the synergistic effect of Ag and Cu ions on bactericidal behaviors, kinetic analyses were also carried out on Ag and/or Cu ions- containing buffer solution, the solution that contained both ions showed much improved antibacterial behaviors, compared with that contained only Ag or Cu ions

關鍵字(中)

★ 反應式濺鍍
★ 摻雜
★ 光觸媒
★ 抗菌特性
★ 抗菌動力學

關鍵字(英)

論文目次

英文摘要.ii
誌謝.iii
目錄.iv
表目錄v
圖目錄.vi
第一章簡介.1
1-1 氮氧化鉭薄膜簡介1
1-1.1 TaON薄膜特性1
1-2 光觸媒簡介2
1-2.1半導體光觸媒.2
1-2.2半導體光催化.3
1-3 微生物簡介5
1-3.1 細菌簡介.5
1-3.2 大腸桿菌.5
1-3.3 金屬離子抗菌機制.6
1-3.4 抗菌動力學.7
1-3.5 抗菌材料應用.8
第二章薄膜特性及抗菌性質探討.9
2-1 實驗架構9
2-2 濺鍍製程10
2-2.1 濺鍍原理.10
2-2.2 薄膜製程所需材料.10
2-2.3 濺鍍系統簡介.10
2-2.4 濺鍍步驟與實驗參數.11
2-3 薄膜退火後處理12
2-4 薄膜微結構分析13
2-4.1 薄膜微結構分析(X光繞射分析儀).13
2-4.2 薄膜微結構分析(能量散射光譜儀).14
2-4.3 薄膜微結構分析(場發射電子顯微鏡).14
2-4.4 薄膜微結構分析(穿透式電子顯微鏡).14
2-5 溶解度測試15
2-5.1 感應式耦合電漿放射光譜儀.15
2-5.2 溶解度分析所需材料.16
2-5.3 溶解度測試步驟.16
2-6 抗菌測試16
2-6.1 抗菌實驗所需材料.16
2-6.2 養菌及抗菌步驟.17
2-7薄膜性質分析18
2-8 TaON薄膜Ｘ光繞射分析.18
2-9 TaON薄膜能量散射儀分析.20
2-10 場發射掃描式電子顯微鏡分析.22
2-11 穿透式電子顯微鏡分析(TEM).25
2-11.1 TaON薄膜退火後 TEM分析25
2-11.2 TaON-Ag退火前後TEM分析25
2-11.3 TaON-(Cu、Ag)退火前後TEM分析.26
2-12 溶解度測試.27
2-13 薄膜抗菌測試.28
2-13.1 TaON及TaON-Ag 薄膜抗菌測試29
2-13.2 TaON-(Ag ,Cu) 薄膜抗菌測試29
2-14 薄膜抗菌動力學分析.30
第三章溶液抗菌性質探討.32
3-1電化學溶解32
3-1.1電化學實驗儀器簡介.33
3-2 溶解度測試33
3-2 溶解度測試33
3-3 抗菌實驗33
3-4 電化學分析34
3-5 溶液抗菌分析34
3-5.1 銀溶液抗菌分析.34
3-5.2 銅溶液抗菌分析.35
3-5.3 銀銅離子抗菌分析.36
3-6 銀銅離子溶液抗菌動力學分析37
第四章結論.40
參考文獻42

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指導教授

李泉

審核日期

2013-1-21

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