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姓名 黃天佑(Tien-yu Huang)  查詢紙本館藏   畢業系所 光電科學與工程學系
論文名稱 具垂直分岔光路之10-Gbps雙輸出矽基光學連接模組
(Silicon-Based 10-Gbps Optical Interconnect Module with Two Output Ports Using Vertically Splitting Optical Paths)
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摘要(中) 在此論文提出一個具有垂直分岔光路的雙輸出矽基光學連接模組,此模組將高分子聚合物光波導與數個矽基45°微反射面整合形成一組垂直分光器,此分光器具有將光訊號一分為二的功能,為此光學連接模組提供了兩組可進行三維光學傳輸的光學通道。此光學連接模組具有用來分光的三組45°微反射面,高頻傳輸線、雷射封裝所使用的銀銦焊料,以及導光的高分子聚合物光波導。
在光學特性上,此光學連接模組的總耗損為-6.6 dB,分光比例為0.124 : 0.095。此一分為二的垂直分光器使得矽基光學平台得以具有雙輸出通道。模組高頻電特性(high-frequency response)量測上,證明兩個通道均能通過10-G Ethernet的眼罩測試,由此可驗證此光學連接模組具備雙通道10-Gbps的資料傳輸能力。
摘要(英) In this thesis, the silicon-based 10-Gbps optical interconnect module with two vertically splitting output ports is demonstrated. The 1 × 2 vertically splitting configuration is realized using polymer waveguides integrated with several 45°silicon micro–reflectors. The proposed silicon-based splitter with two out-of-plane outputs is designed for 3-dimensional on-chip optical interconnects. The proposed vertically splitting paths combined with high-frequency transmission lines and Ag/In bonding pads are developed for integrating the vertical-cavity-surface-emitting-laser (VCSEL) on it to form a optical interconnect module.
The optical characteristics of proposed structure including the insertion loss of -6.6 dB and the splitting ratio of 0.124 : 0.095 is obtained. For the high-frequency characteristics of 1 × 2 optical splitting module, The clear eye patterns operated at a data rate of 10Gbps verifies that the silicon-based 1 × 2 vertical optical splitter successfully transmits the optical signal at such a high data rate.
關鍵字(中) ★ 分光器
★ 光連接
★ 高分子聚合物
關鍵字(英) ★ Optical splitter
★ polymer waveguide
★ optical interconnect
論文目次 中文摘要 i
英文摘要 ii
目錄 iii
圖目錄 v
表目錄 ix
第一章 緒論 1
1-1 研究動機與目的 1
第二章 垂直分岔雙輸出光路之矽基光連接模組設計 9
2-1 光電元件之特性量測 9
2-2 垂直分岔雙輸出之高分子聚合物光波導設計 12
2-2.1 垂直分岔雙輸出之光波導尺寸設計 12
2-2.2 垂直分岔雙輸出之矽基光學平台之光學訊號分析 16
2-3 高頻傳輸線散射參數之模擬與分析 19
第三章 垂直分岔雙輸出矽基光學連接模組製作開發 24
3-1 矽基光學平台之製程與開發 24
3-2 金屬製程與矽基光學平台之整合 27
3-2.1 45°微反射面之高反射率金屬層製程開發 27
3-2.2 10-GHz高頻傳輸線之製程開發 30
3-2.3 覆晶封裝之金屬焊料製程開發 33
3-3 具分光結構之高分子聚合物光波導製作 36
3-4 面射型雷射之覆晶封裝製程 39
第四章 垂直分岔雙輸出之光連接模組量測與分析 41
4-1 覆晶封裝製程對元件造成之影響分析 41
4-2 垂直分岔雙輸出之光波導量測與分析 43
4-3 垂直分岔雙輸出之光連接模組高頻特性量測 48
4-3.1 高頻傳輸線散射參數之量測 48
4-3.2 垂直分岔雙輸出之光連接模組高頻特性量測 51
第五章 結論 54
參考文章 56
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指導教授 伍茂仁(Mount-learn Wu) 審核日期 2012-7-17
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