複合電鍍琴鋼線應用於高速鋼切削之研究

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姓名

陳泳良(Yung-liang Chen) 查詢紙本館藏

畢業系所

機械工程學系

論文名稱

複合電鍍琴鋼線應用於高速鋼切削之研究
(A Study of Composite Plating Piano Wire Used in High-Speed Steel Cutting)

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摘要(中)

本研究主要改善傳統游離磨料線鋸加工時，因磨粒並未利用完全便隨切削屑及磨漿排出，使其所需加工時間增長且線鋸上的磨料廢棄率高，而相對所需之成本也較高等缺點進行改善。因此，本研究研發一種以複合電鍍法的方式將鎳-鑽石披覆於琴鋼線上，使琴鋼線本身即具有切削性質之工具，希望藉此能有效改善傳統游離磨料鋸切加工的問題，進而降低製程上之成本。
研究主要分為兩大部分，第一部分為琴鋼線複合線材的製備：將鎳-鑽石複合電鍍液以電鍍方式披覆於琴鋼線材上。實驗結果顯示，隨著電流密度、電鍍時間的增加，鍍層厚度也隨之增加。在電流密度7 A/dm2 與鑽石濃度100 g/L 等參數進行電鍍實驗時，琴鋼線複合線材具有較佳鍍層厚度及鑽石披覆。第二部分則利用田口實驗設計針對高速鋼棒進行切削，探討各參數對切削深度的影響。由實驗結果得知，較佳製程參數組合為：切削荷重500 g、工件轉速3000 rpm、進給速率3.5 mm / min、線張力1500 g 和琴鋼線於電鍍時間10 min、電流密度7 A/dm2、鑽石濃度100 g/L 進行切削加工，切削深度可達27.01 μm。

摘要(英)

This study was to improve the traditional free-abrasive wire saw machining,due to the abrasive doesn’t completely will immediately cutting debris andrefining discharged.High abrasive waste so that the required processing time of growth on the wire saw, the relative costs to be incurred higher shortcomings toimprove. In this study, the evelopment of composite plating nickel - diamond coated to the piano wire, the research study of piano wire itself cutting of the tool, hoping to effectively improve the traditional free-abrasive sawing, therebyreducing the cost of the process.
The study divided into two parts, the first part of the preparation of piano wire: nickel - diamond composite lating solution to plating coated on the piano wire. Experimental results show that, with the increase of current density and plating time, the coating thickness increases. Current density of 7 A/dm2 and diamond concentration of 100 g/L, the parameters of the plating experiments, piano wire has a better coating thickness and diamond coated. The second part of the Taguchi experimental design for high-speed steel cutting, explore the impact of various parameters on the depth of cut. From the experimental results, better process parameters combination: Cutting load 500 g, workpiece rotation 3000 rpm, feed rate 3.5 mm/min, thread tension 1500 g, co-deposition time 10 min, current density 7 A/dm2 and diamond concentration 100 g/L for cutting, cutting depth up to 27.01 μm.

關鍵字(中)

★ 琴鋼線
★ 切削深度
★ 複合電鍍沉積
★ 線鋸加工

關鍵字(英)

★ composite plating deposition
★ wire sawing
★ depth of cut
★ piano wire

論文目次

目錄
摘要 ............................................................................................................. i
Abstract ....................................................................................................... ii
謝誌 ........................................................................................................... iii
目錄 ........................................................................................................... iv
圖目錄 ..................................................................................................... vii
表目錄 ....................................................................................................... x
第一章緒論 ................................................................................................ 1
1-1 研究背景 ............................................................................................... 1
1-2 研究動機與目的 ................................................................................... 3
1-3 文獻回顧 .............................................................................................. 4
1-3-1 複合電鍍 ........................................................................................... 4
1-3-2 線鋸切削 ........................................................................................... 5
1-3-3 田口實驗法探討 ............................................................................... 6
1-4 研究方法 .............................................................................................. 8
第二章基本原理 ....................................................................................... 9
2-1 電鍍原理 .............................................................................................. 9
2-1-1 電極電位 (Electro Potential) ........................................................... 10
2-1-2 極化 ................................................................................................. 10
2-1-3 電雙層 ............................................................................................. 11
2-2 複合電鍍原理 ..................................................................................... 12
2-3 線鋸切削原理 ..................................................................................... 15
2-3-1 線鋸切削 ......................................................................................... 15
2-3-2 多線式線鋸切技術 ......................................................................... 17
2-4 田口品質工程原理 ............................................................................. 18
第三章實驗設備、機構與流程 .............................................................. 22
3-1 實驗相關設備 .................................................................................... 22
3-2 實驗材料 ............................................................................................ 30
3-2-1 氨基磺酸鎳鍍液 ............................................................................. 30
3-2-2 琴鋼線 ............................................................................................. 31
3-2-3 鑽石磨粒 ......................................................................................... 32
3-2-4 高速鋼 ............................................................................................. 33
3-2-5 電解液 ............................................................................................ 33
3-3 實驗機構 ........................................................................................... 34
3-3-1 琴鋼線複合電鍍機構與加工方法 ................................................ 34
3-3-2 琴鋼線切削機構與加工方法 ......................................................... 36
3-4 實驗參數設定 .................................................................................... 38
3-4-1 琴鋼線複合電鍍實驗設定 ............................................................. 38
3-4-2 複合線材切削實驗設定 ................................................................. 39
3-5 實驗流程 ............................................................................................ 41
第四章結果與討論 .................................................................................. 43
4-1 製程參數對鍍層厚度影響 ................................................................ 43
4-1-1 時間對鍍層厚度影響 ..................................................................... 43
4-1-2 電流對鍍層厚度影響 ..................................................................... 47
4-1-3 濃度對鍍層厚度影響 ..................................................................... 50
4-2 製程參數對磨粒附著之影響 ............................................................ 53
4-2-1 時間對磨粒附著之影響.................................................................. 53
4-2-2 電流密度對磨粒附著之影響 ......................................................... 56
4-2-3 濃度對磨粒附著之影響.................................................................. 59
4-3 利用田口實驗探討切削深度及切削參數 ......................................... 61
4-3-1 實驗結果分析 ................................................................................. 62
4-3-2 驗證實驗 ......................................................................................... 66
4-4 對切削深度的顯著因子驗證 ............................................................. 69
4-4-1 實驗條件與實驗規劃 ...................................................................... 69
4-4-2 工件轉速與切削深度之關係 .......................................................... 70
4-4-3 進給速率與切削深度之關係 .......................................................... 74
第五章結論 ............................................................................................... 78
參考文獻 .................................................................................................... 80

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指導教授

顏炳華(Biing-hwa Yan)

審核日期

2012-7-17

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