流程導向為基礎之協同設計鏈作業參考模型－以半導體IC基板為例

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姓名

張博鈞(Bo-Jyun Chang) 查詢紙本館藏

畢業系所

工業管理研究所

論文名稱

流程導向為基礎之協同設計鏈作業參考模型－以半導體IC基板為例
(A Process-oriented Based Collaborative Design Chain Operations Reference Model-A Case Study of Semiconductor IC Substrate.)

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摘要(中)

新產品開發為一個具有高度互動性的流程，隨著電子產品所需處理的複雜度不斷上升之趨勢下，使得新產品的開發越來越為困難。而產品的生命週期卻越來越短，往往僅有六個月，近八成的利潤來自於新產品推出的前三個月，新產品需能即時上市，以因應市場多變化之需求。因此產品開發流程需要透過協同設計的方式來進行。
設計鏈作業參考模型（Design-Chain Operations Reference- model, DCOR）主張能透過該模式幫助企業進行設計鏈分析與促進成員溝通，企業可以用其提供之共通專業術語，分析和設計其設計鏈作業所需之架構與流程，並建立設計鏈之基本架構。
本研究以台灣半導體基板（substrate，為半導體下游產業晶片封裝之關鍵零組件）為主要探討對象，以流程導向及階層式之架構手法，分析基板設計與驗證之流程，並透過DCOR與設計結構矩陣（Design Structure Matrix, DSM）發掘問題並提出改善建議，以簡化設計流程及設計時不必要的浪費，以提升基板設計鏈效率。

摘要(英)

New product development is a highly interactive process, with the trend of rising complexity of electronic products, new product development is increasingly difficult. Product life cycle become shorter only remaining six months, 80% of the profits from first three months of launch new product. New products needs onto the market immediately to response the demand. Therefore, new product development must through the collaborative design to improvement process.
DCOR can help enterprises to analyze the design chain and facilitating member communication. Enterprise can use the standard language to analyze the design chain operations required and establish the basic structure of design chain.
This study is a case study for Taiwan semiconductor substrate. Substrate is the key of the package for semiconductor downstream industries. We used the process-oriented and hierarchical architecture practices to analyze the design and verification substrate process. Through the DCOR and DSM to explore problem and give suggestion, in order to simplify the process of unnecessary waste and enhance the efficiency of substrate design chain.

關鍵字(中)

★ 新產品開發
★ 協同設計
★ 設計鏈作業參考模型
★ 設計結構矩陣
★ 基板

關鍵字(英)

★ new product development
★ DCO
★ collaborative design

論文目次

摘要 i
目錄 iii
圖目錄 v
表目錄 vi
第一章. 緒論 1
1.1 研究背景與動機 1
1.2 研究目的 2
1.3 研究限制 3
1.4 論文架構 3
第二章. 文獻探討 5
2.1 協同產品開發 5
2.1.1 產品開發的協同設計 5
2.1.2 提早參與 9
2.2 設計結構矩陣 10
2.2.1 設計結構矩陣介紹 10
2.2.2 設計結構矩陣的分割 13
2.3 設計鏈作業參考模型 16
2.3.1 DCOR的三大類流程型態 16
2.3.2 DCOR的五大基本流程 17
2.3.3 DCOR各項層級模型 19
第三章. 基板設計鏈 25
3.1 積體電路（integrated circuit, IC）基板與封裝 25
3.1.1 晶片封裝技術 28
3.2 台灣現階段基板設計流程 29
3.3 現階段基設計鏈之問題 32
第四章. 基板設計鏈作業參考模型 34
4.1 基板設計鏈作業參考模型之建構 34
4.1.1 S-DCOR第一階層模型之建構 35
4.1.2 S-DCOR第二階層模型之建構 37
4.1.3 S-DCOR第三階層模型之建構 39
4.1.4 S-DCOR第四階層模型之建構 42
4.2 設計結構矩陣與DCOR之應用 45
第五章. 效益分析 47
5.1 協同設計資訊觀點 48
5.2 BPR專案管理觀點 49
5.3 企業流程再造角度觀點 50
5.4 標準流程觀點 50
第六章. 結論與未來研究 52
6.1 結論 52
6.2 未來研究 54
參考文獻 55

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指導教授

王啟泰(Chi-tai Wang)

審核日期

2012-7-12

推文