銅導線上鍍金或鎳/金對遷移性之影響及鍍金層對Sn-0.7Cu與In-48Sn BGA銲料迴銲後之接點強度影響

以作者查詢圖書館館藏

、以作者查詢臺灣博碩士

、以作者查詢全國書目

、勘誤回報

、線上人數：162

、訪客IP：3.144.187.103

姓名

張顧耀(Guh-Yaw Jang) 查詢紙本館藏

畢業系所

機械工程學系

論文名稱

銅導線上鍍金或鎳/金對遷移性之影響及鍍金層對Sn-0.7Cu與In-48Sn BGA銲料迴銲後之接點強度影響
(Effect of Au and Ni/Au coatings on the electrolytic migration of Cu-conductors, and effect of Au coatings on joint strength of BGA for Sn-0.7Cu and In-48Sn solder after reflow)

相關論文

★ 銅導線上鍍鎳或錫對遷移性之影響及鍍金之鎳/銅銲墊與Sn-3.5Ag BGA銲料迴銲之金脆研究	★ 單軸步進運動陽極在瓦茲鍍浴中進行微電析鎳過程之監測與解析
★ 光電化學蝕刻n-型（100）單晶矽獲得矩陣排列之巨孔洞研究	★ 銅箔基板在H2O2/H2SO4溶液中之微蝕行為
★ 助銲劑對迴銲後Sn-3Ag-0.5Cu電化學遷移之影響	★ 塗佈奈米銀p型矽(100)在NH4F/H2O2 水溶液中之電化學蝕刻行為
★ 高效能Ni80Fe15Mo5電磁式微致動器之設計與製作	★ 含氮、硫雜環有機物對鍋爐鹼洗之腐蝕抑制行為研究
★ 銦、錫金屬、合金與其氧化物的陽極拋光行為探討	★ n-型(100)矽單晶巨孔洞之電化學研究
★ 鋁在酸性溶液中孔蝕行為研究	★ 微陽極引導電鍍與監測
★ 鍍金層對Bi-43Sn與Sn-9Zn BGA銲料迴銲後之接點強度影響及二元銲錫在不同溶液之電解質遷移行為	★ 人體血清白蛋白構形改變之電化學及表面電漿共振分析研究
★ 光電化學蝕刻製作n-型(100)矽質微米巨孔陣列及連續壁結構	★ 微陽極導引電鍍法製作微銅柱及銅柵欄之研究

檔案

[Endnote RIS 格式]

[Bibtex 格式]

[相關文章]

[文章引用]

[完整記錄]

[館藏目錄]

至系統瀏覽論文 ( 永不開放)

摘要(中)

本論文在探討銅導線上鍍金或鎳/金對遷移性之影響及鍍金層對Sn-0.7Cu與In-48Sn BGA銲料迴銲後之接點強度影響。銅導線表面電鍍0.1 ~ 1.0 µm金後，分別在蒸餾水、0.01M NaCl及(NH4)2SO4水溶液中，施以5V偏壓，進行遷移研究。結果顯示：表層鍍金之銅導線，具有抑制銅遷移之效果。此鍍金銅導線在250°C持溫300秒後，在較低偏壓情況下，抗遷移性顯著增強；在較高偏壓情況下，熱處理降低鍍金0.1 µm之銅導線的遷移阻抗，當鍍金厚度大於0.5 µm時，則沒有影響。
銅導線表面電鍍5 µm鎳後，隨即電鍍0.1 ~ 1.0 µm金，之後在蒸餾水及(NH4)2SO4水溶液中，施以5V偏壓，進行遷移研究。結果顯示：表層鍍鎳/金之銅導線，同樣具有抑制銅遷移之效果。但此鍍鎳/金銅導線在250°C持溫300秒後，抗遷移性顯著減弱。
在0.01M (NH4)2SO4水溶液中進行陽極動態極化掃描及定電位陽極反應，配合ESCA表面分析，得知金在(NH4)2SO4水溶液中不會發生反應，因此金及鎳/金鍍層能夠有效地抑制銅遷移。
為了探討金層對於BGA銲接點強度影響，先在鍍鎳(5µm)銅銲墊上電鍍0.1 ~ 1.2 µm金層，再分別與Sn-37Pb、Sn-0.7Cu及In-48Sn銲球進行迴銲，迴銲後即進行剪力量測，結果顯示：隨著金鍍層愈厚，Sn-37Pb銲料的強度愈差，而Sn-0.7Cu及In-48Sn銲料的強度則些微增強。

摘要(英)

Effects of Au and Ni/Au coatings on the electrolytic migration of copper conductors have been studied. The migration of the copper conductors in dionized water, 0.01M NaCl and (NH4)2SO4 solutions at a bias of 5V was inhibited by coating a layer of Au in thickness of 0.1 ~ 1.0 μm. When Au-coated copper conductors are under a lower bias (e.g. < 0.5VSCE), heat treatment (at 250 ℃ for 300 seconds) enhances the migration resistance. To the opposite, under a higher bias (e.g. > 1.4VSCE), heat treatment diminishes the migration resistance for the specimen coated with only 0.1 μm Au, but causes no influence with the thickness of Au-coats greater than 0.5 μm.
The migration inhibition is more efficient with increasing thickness of the Au-coats from 0.1 to 1.0 μm in the case of Ni/Au-coated copper conductors. However, it is less efficient when the Ni/Au-coated conductors have been heat-treated at 250 ℃ for 300 seconds.
Electrochemical polarization such as potentiodynamic and potentiostatic experiments were conducted. The ESCA analysis for the anode indicates that gold is un-reactive for Au-coated copper conductors and Ni/Au-coated copper conductors in the 0.01M (NH4)2SO4 solution.
Effect of Au coatings on joint strength of ball grid array (BGA) estimated by conducting the shear test of the soldered system where Sn-37Pb, Sn-0.7Cu and In-48Sn solders have been reflowed, respectively, onto the Au-deposited Ni/Cu pads. The thickness of Au-deposits is ranging from 0.1 to 1.2 µm and that for Ni-coat is 5µm. The Sn-37Pb alloy had a slight decrement in ball shear strength with increasing the thickness of gold coat from 0.1 μm to 1.0 μm. The strength however was degraded drastically while the gold coat is 1.2 μm. On the other hand, the two lead free systems had a slight increment in ball shear strength with increasing the thickness of gold coat.

關鍵字(中)

★ 銅電解質遷移
★ 鍍金銅導線
★ 鍍鎳/金銅導線
★ 陽極極化
★ Sn-0.7Cu銲料
★ In-48Sn銲料
★ 剪應力強度

關鍵字(英)

★ anodic polarization
★ Ni/Au-coated copper conductors
★ Au-coated copper conductors
★ copper electrolytic migration
★ shear strength
★ Sn-0.7Cu solder
★ In-48Sn solder

論文目次

Chinese Abstract (中文摘要) I
Abstract II
Acknowledgement IV
Contents V
List of Tables X
List of Figures XI
Chapter I Introduction 1
1-1 Effect of Au and Ni/Au coatings on the electrolytic migration of copper conductors 1
1-2 Effect of Ni/Au surface finish on joint strength of BGA 3
Chapter II Literature Review and Theoretical Aspects 6
2-1 Metallic Migration 6
2-1-1 Types of metallic migration 6
2-1-2 Parameters influence on the electrolytic migration 7
2-1-3 Electrolytic migration process 9
2-2 Migration of copper 11
2-3 Corrosion behavior of copper 13
2-4 Oxidation behavior of nickel 14
2-5 Noble characteristic of gold 16
2-6 Reaction of Pb-Sn solder with Ni/Au metallization 17
2-7 Reaction of Lead-free solder with Ni/Au metallization 18
2-7-1 Reaction of Sn-0.7Cu solder with Ni/Au metallization 18
2-7-2 Reaction between In-48Sn solder with Ni/Au metallization 20
Chapter III Materials and Experimetal Procedures 22
3-1 Preparation of specimens 22
3-2 Electroplating and heat treatment of the specimens 23
3-2-1 Au-electroplated and heat treatment of the Au-coated copper conductor 23
3-2-2 Ni/Au-electroplated and heat treatment of the Ni/Au-coated copper conductor 26
3-3 Electrolytic equipments 29
3-3-1 Electrolytic cells and the electrodes 29
3-3-2 Environments of the electrolytic migration testing 30
3-4 Experimental method and operating conditions 31
3-4-1 Electrolytic migration testing 31
3-4-2 Anodic polarization of the conductors in 0.01M (NH4)2SO4 solution 32
3-5 Analysis of the conductors and their reaction products 32
3-6 Shear testing for solder joint between solder ball and BGA substrate 33
3-6-1 Samples preparation 33
3-6-2 Soldering 34
3-6-3 Shear testing 32
Chapter IV Results 36
4-1 Gold-Coated Copper Conductors 36
4-1-1 Surface morphology for the Au-coated copper conductors 36
4-1-2 Effect of the heat treatment on the X-ray diffraction patterns for the Au-coated copper conductors 37
4-1-3 Effect of heat treatment on the SEM cross-sectional structure of the Ni/Au-coated copper conductors 38
4-1-4 Measurement of bridging current for the Au-coated copper conductors 40
4-1-5 The in-situ observation of electrolytic migration for the Au-coated copper conductors 44
4-2 Nickel/Gold-Coated Copper Conductors 48
4-2-1 Surface morphology for the Ni/Au-coated copper conductors 48
4-2-2 Effect of the heat treatment on the X-ray diffraction patterns for the Ni/Au-coated copper conductors 48
4-2-3 Effect of heat treatment on the SEM cross-sectional structure of the Ni/Au-coated copper conductors 50
4-2-4 Measurement of bridging current for the Ni/Au-coated copper conductors 51
4-2-5 The in-situ observation of electrolytic migration for the Ni-coated and Ni/Au-coated copper conductors 55
4-3 Effect of Au coatings on joint strength of BGA after reflow 61
4-3-1 Microstructure of as-bonded solder ball 61
4-3-2 Effect of Au-coat on solder ball joint strength 63
Chapter V Discussion 64
5-1 Gold-Coated Copper Conductors 64
5-1-1 Anodic potentiodynamic polarization of the bare copper conductors in different concentration (NH4)2SO4 solution 64
5-1-2 Comparison for the anodic potentiodynamic polarization for copper conductors coated with gold in different thickness 65
5-1-3 Anodic potentiodynamic polarization of the Au-coated copper conductors in 0.01M (NH4)2SO4 solution 66
5-1-4 Anodic current at constant potentials for Au-coated copper conductors in 0.01M (NH4)2SO4 solution 71
5-1-5 ESCA analysis of the reaction products on the anode 73
5-2 Nickel/Gold-Coated Copper Conductors 78
5-2-1 Comparison for the anodic potentiodynamic polarization of Ni/Au-coated copper conductors with different thickness of gold coats 78
5-2-2 Anodic potentiodynamic polarization of the Ni/Au-coated copper conductors in 0.01M (NH4)2SO4 solution 79
5-2-3 Anodic current at constant potentials for Ni/Au-coated copper conductors in 0.01M (NH4)2SO4 solution 82
5-2-4 ESCA analysis of the reaction products on the anode 83
Chapter VI Conclusions 87
References 88

參考文獻

[ABT] M. Abtew and G. Selvaduray, “Lead-Free Solders in Microelectronics”, Materials Science and Engineering, Vol. 27, (2000) 95-141.
[BAR] A. J. Bard, “Electrochemical Methods: Fundmentals and Applications”, John Wiley & Sons. Inc., U. S. A., (1980) 119.
[BOC] J. O. Bockris and A. K. Reddy, “Modern Electrochemistry”, New York, NY: Plenum, (1973) ch. 4 and 10.
[CAS] I. G. Casella, M. Gatta, “Anodic Electrodeposition of Copper Oxide / Hydroxide Films by Alkaline Solutions Containing Cuprous Cyanide Ions”, Journal of Electroanalytical Chemistry, Vol. 494, (2000) 12-20.
[CHU] 陳俊堯(J. Y. Chuang), “鈀含量對銀鈀厚膜導體遷移抑制之影響”, 國立中央大學機械工程學系碩士論文，指導教授：林景崎博士 (1994)。
[DAE] D. H. Daebler, “An Overview of Gold Intermetallics in Solder Joints”, Surface Mount Technology, (1991) 43-46.
[DAV] D. E. Davies and W. Barker, “Influence of pH on Corrosion and Passivation of Nickel”, Corrosion, Vol. 20, (1964) 47-53.
[DUM] P. Dumoulin, J. P. Seurin and P. Marce, “Metal Migrations Outside the Package During Accelerated Life Tests”, IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol. chmt-5, No. 4, (1982) 479-486.
[GRO] C. R. M. Grovenor, “Microelectronic Materials”, Institue of Physics Publishing Bristol and Philadelphia, U. S. A., (1989) ch. 7.
[HAR1] G. Harsányi, “Electrochemical Processes Resulting in Migrated Short Failures in Microcircuits”, IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A, Vol. 18, No. 3, (1995) 602-610.
[HAR2] G. Harsányi, “Irregular Effect of Chloride Impurities on Migration Failure Reliability: Contradictions or Understandable? ”, Microelectronics Reliability, Vol. 39, (1999) 1407-1411.
[HAR3] G. Harsányi, “Copper May Destroy Chip-Level Reliability: Handle with Care – Mechanism and Conditions for Copper Migrated Resistive Short Formation”, IEEE Electron Device Letters, Vol. 20, No. 1, (1999) 5-8.
[HAR4] G. Harsányi and G. Inzelt, “Comparing Migratory Resistive Short Formation Abilities of Conductor Systems Applied Advanced Interconnection”, Microelectronics Reliability, Vol. 41, (2001) 229-237.
[HEC] D. Hecht, H. H. Strehblow, “XPS Investigations of the Electrochemical Double Layer on Silver in Alkaline Chloride Solutions”, Journal of Electroanalytical Chemistry, Vol. 440, (1997) 211-217.
[HUN] S. C. Hung, P. J. Zheng, S. C. Lee and J. J. Lee, “The Effect of Au Plating Thickness of BGA Substrates on Ball Shear Strength Under Reliability Tests”, Electronics Manufacturing Technology Symposium, 24th IEEE/CPMT, (1999) 7-15.
[JCP1] JCPDS card: 1-1258.
[JCP2] JCPDS card: 2-1095.
[JUO] K. Juodkazis, J. Juodkazyte, V. Jasulaitiene, A. Lukinskas, B. Sebeka, “XPS Studies on the Gold Oxide Surface Layer Formation”, Electrochemistry Communications, Vol. 2, (2000) 503-507.
[KAW] T. Kawanobe, and K. Otsuka, “Metal Migration in Electronic Components”, IEEE Transactions on Components, Hybrids and Manufacturing Technology, (1982) 220-228.
[KIM] K. S. Kim and N. Winograd, “X-Ray Photoelectron Spectroscopic Studies of Nickel-Oxygen Surfaces Using Oxygen and Argon Ion- Bombardment”, Surface Science, Vol. 43, (1974) 625-643.
[KOH] M. Kohara, Y. Mashiko, K. Nakazaki, “Mechanism of Electro-Migration in Ceramic Package Induced by Chip-Coating Polyimide”, Electronic Components and Technology Conference, Vol.2, (1990) 894-899.
[KRU] S. J. Krumbein, “Metallic Electromigration Phenomena”, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 11, No. 1, (1988) 5-15.
[LAC] R. Lachance, H. Lavoie and A. Montanari, “Corrosion / Migration Study of Flip Chip Underfill and Ceramic Overcoating”, IEEE Electronic Components and Technology Conference, (1997) 885-889.
[LIN1] H. C. Ling, and A. M. Jackson, “Correlation of Silver Migration with Temperature-Humidity-Bias (THB) Failures in Multilayer Ceramic Capactors”, IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol. 12, No. 1, (1989) 130-137.
[LIN2] J. K. Lin, A. D. Silva, D. Frear, Y. Guo, J. W. Jang, L. Li, D. Mitchell, B. Yeung and C. Zhang, “Characterization of Lead-Free Solders and Under Bump Metallurgies for Flip-Chip Package”, IEEE Electroic Components and Technology Conference, (2001) 455-462.
[LOB1] R. E. lobnig, R. P. Frankenthal, D. J. Siconolfi and J. D. Sinclair, “The Effect of Submicron Ammonium Sulfate Particles on the Corrosion of Copper”, Journal of the Electrochemical Society, Vol. 140, No. 7, (1993) 1902-1907.
[LOB2] R. E. Lobning, R. P. Frankenthal, D. J. Siconolfi, J. D. Sinclair and M. Stratmann, “Mechanism of Atmospheric Corrosion of Copper in the Presence of Submicron Ammonium Sulfate Particles at 300 and 373 K”, Journal of the Electrochemical Society, Vol. 141, No. 11, (1994) 2935-2941.
[LOW] F. A. Lowenheim, Electroplating, McGraw-Hill book company, New York (1978)
[MAS] T. B. Massalski et al. (eds.) “Binary alloy phase diagram”, Vol. 1-3, 2nd edn; 1990, Materials Park, OH, ASM International.
[MEI] Z. Mei, M. Kaufmann, A. Eslambolchi and P. Johnson, “Brittle Interfacial Fracture of PBGA Packages Soldered on Electroless Nickel / Immersion Gold”, Electronic Components & Technology Conference, 48th IEEE, (1998) 952-961.
[MEL] C. Melton, “Reflow Soldering Evaluation of Lead Free Solder Alloys”, IEEE Electronic Components and Technology Conference, 1993. Proceedings., 43rd, (1993) 1008-1011
[MIL] B. Millet, C. Fiaud, C. Hinnen and E. M. M. Sutter, “A Correlation Between Electrochemical Behavior, Composition and Semiconducting Properties of Naturally Grown Oxide Films on Copper”, Corrosion Science, Vol. 37, No. 12, (1995) 1903-1918.
[MOR] J. E. Morris, Workshop “The Design and Processing Technology of Electronic Packaging”, (1997).
[NIC] M. J. Nicol, “The Anodic behavior of Gold: Part I – Oxidation in Acidic Solutions”, Gold Bulletin, Vol. 13, No. 2, (1980) 46-55.
[NIE] D. A. Nieman, “Effect of Contamination on Copper Migration in TAB Tape Structures”, IEEE Reliability Physics Symposium, 1994. 32nd Annual Proceedings., IEEE International, (1994) 87-92.
[POU1] M. Pourbaix, “Atlas of Electrochemical Equilibria in Aqueous Solutions”, Pergamon Press, Oxford, (1966) 384-389.
[POU2] M. Pourbaix, “Atlas of Electrochemical Equilibria in Aqueous Solutions”, Pergamon Press, Oxford, (1966) 330-334.
[POU3] M. Pourbaix, “Corrosion du fer par les solutions de soude caustique [Thesis, Brussels, 1945 (exact)]”, Bull. Techn. A. I. Br., (1946) 67-86 (1947) 109-120.
[POU4] M. Pourbaix, “Atlas of Electrochemical Equilibria in Aqueous Solutions”, Pergamon Press, Oxford, (1966) 399-405.
[POU4] M. Pourbaix, “Atlas of Electrochemical Equilibria in Aqueous Solutions”, Pergamon Press, Oxford, (1966) 399-405.
[RIE] D. E. Riemer, “Meteria Selection and Design Guidelines for Migration-Resistant Thick-Film Circuits with Silver-Bearing Conductors”, IEEE Transactions on Components, Hybrids and Manufacturing Technology, (1981).
[ROT] V. Rothmund, “Ueber den Einfluss der Anionen auf die Passivierbarkeit der Metalle”, Z. Physics and Chemistry, Vol. 110, (1924) 384-392.
[SIN] J. D. Sinclair and L. A. Psota-Kelty, Atmosphere Environment, Vol. 24A, (1990) 627.
[TAG] T. Taguchi, R. Kato and S. Akita, “Lead Free Interfacial Structures and Their Relationship to Au Plating”, IEEE Electronic Components and Technology Conference, (2001) 675-680.
[TAK] T. Takemoto, R. M. Latanision, T. W. Eagar and A. Matsunawa, “Electrochemical Migration Tests of Solder Alloys in Pure Water”, Corrosion Science, Vol. 39, No. 8, (1997) 1415-1430.
[TAN1] S. H. Tan and S. H. Ong, “A Dry Migration? Copper Dendrite Growth in Adhesive Tape During Burn-in”, IEEE Physical and Failure Analysis of Integrated Circuits, 2001. IPFA 2001. Proceeding of the 2001 8th International Symposium on the Singapore, (2001) 178-182
[TAN2] H. Tanaka, M. Tanimoto, A. Matsuda, T. Uno, M. Kurihara and S. Shiga, “Pb-Free Surface-Finishing on Electronic Components’s Terminals for Pb-Free Soldering Assembly”, Journal of Electronic Materials, Vol. 28, No. 11, (1999) 1216-1223.
[TID] J. Tidblad and T. E. Graedel, “GILDES Model Studies of Aqueous Chemistry: IV. Initial (NH4)2SO4-Induced Atmospheric Corrosion of Copper”, Journal of the Electrochemical Society, Vol. 144, No. 8, (1997) 2666-2675.
[TUM1] R. R. Tummala, E. J. Rymaszewski and A. G. Klopfenstein, “Microelectronics Packaging Handbook: Part I”, International Thomson Publishing, (1997) ch. 1.
[TUM2] R. R. Tummala, E. J. Rymaszewski and A. G. Klopfenstein, “Microelectronics Packaging Handbook: Part III”, International Thomson Publishing, (1997) ch. 16.
[VAU] B. K. Vaughen, J. A. Roth and J. J. Steppan, “Electrolytic Copper Migration in Accelerated Tests – 1. Polyethylene Glycol-400 Doped with Ammonium Perchlorate”, Journal of the Electrochemical Society, Vol. 135, No. 8, (1988) 2027-2033.
[VOL] L. M. Voltchkova, L. G. Antonova and A. J. Krasilschikov, “Comportement Anoidique du Nickel dans les Solutions Alcalines”, J. Fiz. Khim. Vol. 23, (1949) 714-718.
[WEB] Website: www.nemi.org/PbFreePUBLIC.
[WEI] 魏大華(D. H. Wei), “銅導線上鍍鎳或錫對遷移性之影響及鍍金之鎳/銅銲墊與Sn-3.5Ag BGA銲料迴銲之金脆研究”, 國立中央大學機械工程學系碩士論文，指導教授：林景崎博士 (2001)。
[YEU] F. Yeung and Y. C. Chan, “Electrical Failure of Multiplayer Ceramic Capacitors Caused by High Temperature and High Humidity Environment”, Electronic Components and Technology Conference, 1994 Proceedings., 44th, (1994) 847-853.
[ZEN] K. Zeng and K. N. Tu, “Six Cases of Reliability Study of Pb-Free Solder Joints in Electronic Packaging Technology”, Materials Science and Engineering: R: Reports, Vol. 38, (2002) 55-105.

指導教授

林景崎(Jing-Chie Lin)

審核日期

2002-7-26

推文