科氏力與預塗薄膜對旋轉塗佈之影響

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姓名

黃發威(Huang Fawei) 查詢紙本館藏

畢業系所

機械工程學系

論文名稱

科氏力與預塗薄膜對旋轉塗佈之影響
(The effects of Coriolis Force and Prewetting during spin coating)

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摘要(中)

摘要
隨著半導體工業的發展，使用大尺寸晶圓已經是現今的趨勢，如何能夠了解並運用不穩定手指狀流的產生，並順利將光阻液塗滿晶圓且塗佈均勻，是旋轉塗佈過程中的重點。
本實驗利用實驗結果與數值模擬分析，探討科氏力應用於大尺寸晶圓的塗佈上，對於不穩定手指狀流所產生的影響，發現科氏力雖然對於薄膜的厚度分布並無太大的影響；但是由於製程中科氏力的介入，使得不穩定手指狀流偏向產生匯流的狀況，使得流體的塗佈面積增大，反而利於旋轉塗佈製程。並且探討預塗薄膜應用於旋轉塗佈的影響，發現預塗薄膜對相對黏滯係數較高的流體影響較大，由於表面張力減小的關係，使得相對黏滯係數較高的流體之臨界半徑較晚產生，而且注液時薄膜波前行進速度較未預塗時加快許多，並且沒有停滯的現象，因此晶圓可以很容易的就被塗佈。

摘要(英)

Spin coating is utilized widely in the microelectronics industry to form thin uniform films of photoresist, spin-on-glass, polyimide, and low dielectric constant materials on silicon wafers. This coating technique is quick and efficient. But, liquids such as photoresist are very expensive. During coating process, the maximum radius that can be coated is limited by a contact line instability, leading to the formation of rivulets or “fingers” at the leading edge. The onset of fingering instability makes the coating process inefficient and significantly affects whether a wafer can be fully coated. One of the most critical roles for spin coating systems is to properly cast a thin film of photoresist on the surface of a silicon wafer.
In this project, a new spin coating process is proposed to overcome the problem of partially coated especially for large size wafer such as the wafer with diameter 300 mm or even 450 mm. The perwetting spin coating decreases the rotational speed of the wafer, thus preventing the wind shear effect. And experimental results show that coriolis force broadens the width of fingers. We can utilize the results to find a new spin coating technique so that a uniform film can be obtained.

關鍵字(中)

★ 科氏力
★ 預塗薄膜
★ 旋轉塗佈

關鍵字(英)

★ coriolis force
★ prewetting
★ spin coating

論文目次

目錄
摘要 I
目錄 II
表目錄 IV
圖目錄 V
第一章緒論 1
1-1 前言 1
1-2 文獻回顧 2
1-3 研究動機 7
第二章實驗設備與方法 9
2-1 注液系統簡介 9
2-2 真空吸引式晶圓變轉速控制系統簡介 10
2-3 影像擷取系統 11
2-4 實驗方法 12
第三章實驗結果與討論 14
3-1 科氏力對旋轉塗佈的影響 14
3-2 預塗薄膜黏滯係數對旋轉塗佈的影響 18
第四章結論 22
參考文獻 24
附表 27
附圖 28
表目錄
表一實驗流體性質表 27
圖目錄
圖一可變流率注液系統 28
圖二真空吸引式晶圓變轉速控制系統 29
圖三影像擷取分析系統…………………………………………30
圖四實驗系統整合示意圖………………………………………31
圖五 Emslie利用Gaussian initial contour所計算之膜厚對時間與半徑的關係圖……………………………………………...32
圖六 Emslie利用Slowly-falling initial ontour所計算之膜厚對時間與半徑的關係圖 33
圖七利用Gaussian initial contour加入科氏力影響所計算之膜厚對時間與半徑的關係圖 34
圖八利用Slowly-falling initial ontour加入科氏力影響所計算之膜厚對時間與半徑的關係圖 35
圖九不穩定手指狀流偏向圖 36
圖十 5、50、500cp之數值偏向角度示意圖 37
圖十一無因次化之Re與θ關係圖 38
圖十二不穩定手指狀流受到科氏力之影響之情形 39
圖十三忽略科氏力影響之旋塗過程 40
圖十四不同預塗薄膜對注液不同黏滯係數矽油之臨界半徑關係圖 41
圖十五不同預塗薄膜對注液不同黏滯係數矽油之臨界半徑產生時間關係圖 42
圖十六注液1000cp之矽油在乾表面與預塗100cp、1000cp之波前與時間的關係圖 43
圖十七注液500cp之矽油在乾表面與預塗100cp、1000cp之波前與時間的關係圖 44
圖十八注液100cp之矽油在乾表面與預塗100cp、1000cp之波前與時間的關係圖 45
圖十九未預塗薄膜與預塗薄膜之不穩定手指狀流之比較 46
圖二十注液100cp與1000cp在預塗100cp上之變注意速率與臨界半徑之關係圖 47
圖二十一注液1000cp在預塗100cp與未預塗表面上之變注意速率與臨界半徑之關係圖 48
圖二十二注液100cp在預塗100cp與未預塗表面上之變注意速率與臨界半徑之關係圖 49

參考文獻

參考文獻
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指導教授

周復初(Fu-Chu Chou)

審核日期

2002-7-5

推文