| 摘要(英) |
TFT-LCD monitors are manufactured precisely and so far relatively expensive. During transportation, the products are often subjected to unintentional drops, vehicle vibration, shock inputs, and compression loads, etc. These mechanical forces may cause products damages or losing functions. To prevent shock damages, products are usually protected by package systems. The study based on previous work performs the package-system design and modification. The proposed new package system is satisfied for the IEC regulations. Furthermore, the amount of material used by the package system is less than that of original design.
The study includes both the characterizing the damage boundary curve and modifying the package system of the test TFT-LCD monitor. Based on previous work, it is noted that the face_6 drop test cannot fulfill the IEC regulations. Therefore, the package system of the TFT-LCD monitor needs further modification. First, the shock characteristics of the product are determined by conducting the damage boundary test. It includes both critical velocity change and critical acceleration. Moreover, the causes of damage are also numerically analyzed by using the LS-DYNA package. The simulations of drop test for modified package systems are performed. Then, The numerical analysis is validated by practical drop test. After comparison between the drop test and numerical simulation, the package system satisfying the IEC regulations can be achieved.
In the study, the procedures about designing a cushioning package system are provided. The finite element analysis assists in exploring the causes of the damage. The numerical analysis is validated by practical drop test. These tasks help to perform the design or modification of both the TFT-LCD monitor and package system. They can shorten the lead-time of product design, and improve shock resistance as well. |
| 參考文獻 |
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