博碩士論文 92343008 詳細資訊



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姓名 侯光煦(Kung-Hsu Hou)  查詢紙本館藏   畢業系所 機械工程學系
論文名稱 脈衝電流電鑄Ni-P鍍層之磨潤特性研究
(Study on Tribological Characteristics of Ni-P Based CoatingsProduced by Pulse Current Electroforming)
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摘要(中) 本研究藉由脈衝電流電鑄技術，發展Ni-P合金鍍層及Ni-P-SiC複合鍍層的製備，並於常溫、不同昇溫(100~300℃)及無潤滑條件下對其進行磨潤實驗研究。研究結果發現脈衝電鑄Ni-P鍍層的內應力遠低於直流電鑄的Ni-P鍍層；分析發現甫鍍製高磷含量(P > 8 wt.%)之Ni-P電鑄層，其硬度隨著磷含量的增加而降低，隨磷含量的增加，鍍層結構由微結晶態逐漸轉變為X-ray非晶態。常溫磨耗試驗及分析顯示：甫鍍製Ni-P鍍層之磨耗阻抗隨鍍層硬度增加而增加；硬度為主要影響磨耗阻抗的主要性質，甫鍍製Ni-P鍍層磨耗阻抗最高可達Ni鍍層的11倍。經400℃熱處理之Ni-P鍍層存在硬質Ni3P相的析出，此可進一步降低鍍層的磨耗率；熱處理鍍層的磨耗阻抗最高可提昇為甫鍍製鍍層的2.5倍。甫鍍製及熱處理鍍層的磨耗阻抗及硬度均隨晶粒尺寸增大而增加；亦即高磷Ni-P鍍層的強度與晶粒尺寸呈現逆轉Hall-Petch 關係。於溫度100~300℃的磨耗試驗顯示，甫鍍製(P: 8.7wt.% ~13.9wt.%)Ni-P鍍層的磨耗阻抗隨溫度昇高而增加。
在Ni-P-SiC 複合鍍層的研究上，採用0.3μm 的碳化矽微粒引入鍍液中，顯示鍍層之磷含量隨鍍液中的碳化矽微粒濃度增加而降低，且鍍層中沉積之SiC微粒含量隨鍍液中碳化矽濃度增加而增加。脈衝電鑄鍍層之SiC微粒含量為0.2 - 1.5 wt.%高於直流電鑄鍍層之SiC微粒含量0.2 - 0.5 wt.%。磨潤研究顯示脈衝Ni-P-SiC鍍層之耐磨性優於直流Ni-P-SiC電鍍層，且於相同硬度條件下，Ni-P-SiC複合鍍層之磨耗阻抗優於Ni-P鍍層；相同電鑄條件下，Ni-P-SiC複合鍍層之重量磨損可較Ni-P鍍層減少62 %，而Ni-P-SiC複合鍍層的磨耗阻抗最高可達純Ni 的10倍。
摘要(英) In this study, attempt has been made to investigate the wear resistance of Ni-P alloy coatings and Ni-P-SiC composite coatings that manufactured by pulse current (PC) electroforming technology. The tribological tests of such plated coatings were carried out at ambient temperature, evaluated temperature(100~300℃) and without lubricants conditions. The results of this investigation showed that the internal stress of the PC-deposited Ni-P coating is much lower than that of direct current (DC) deposited Ni-P coatings. The analytical results of the high phosphorous contents (P > 8 wt.%) coatings indicate that increasing the phosphorus content in the layer reduces the hardness of the Ni-P electroformed coatings, and the gradually leading to the coatings structure from micro-crystalline transform to X-ray amorphous.
Wear test results of as-plated Ni-P coatings under normal temperature show that the wear resistance of Ni-P alloy layers increases with the hardness of the coatings. The hardness primarily affects the wear resistance of the Ni-P as plated coatings; and the optimum wear resistance of Ni-P coatings can reach 11 times that of Ni coatings. After heat-treatment that would be enhancing the strength of the Ni-P coatings and leads to a lower wear rate for heat-treated coating. The wear resistance of heat-treated coating can be as high as 2.5 times that of as-plated coating. In addition, the wear resistance and hardness increases with the increasing of grain size for both as-plated and heat-treated coatings. It suggests that the strength and grain size of the Ni-P coating with high phosphorus content obeys the inverse Hall-Petch relationship. Under evaluated temperature saturation, the wear tests show that the wear resistance of the as-plated Ni-P (P: 8.7wt.% ~13.9wt.%) coatings was increased with temperature increased.
In the Ni-P-SiC composite coatings, the study attempted to incorporate 0.3μm SiC particles into a Ni-P alloy matrix by pulse current (PC) and direct current (DC) plating. Both plating methods showed that the phosphorus content in the deposit falls with increasing SiC content in the bath, and that the SiC content in the composite coating rises with rising SiC content in the bath. The pulse plating deposit with SiC particles 0.2 - 1.5 wt.% was higher than direct current plating with SiC particles 0.2 - 0.5 wt. % in deposits. The wear-proof shows that the tribological behavior of Ni-P-SiC of the PC plating is better than that of the DC plating deposit. At normal temperature, experimental results show that the wear resistance of Ni-P-SiC composite coatings is superior to Ni-P composite coatings if under the same level of hardness. The wear weight loss of Ni-P-SiC composite coatings is even about 62% less than that of Ni-P composite coatings, in which is based on the same produced condition. Further more, both the hardness and wear resistance of Ni-P-SiC composite coatings are superior to pure Ni coating, wherein its wear resistance is even up to 10 times better than the pure that of Ni coating.
關鍵字(中) ★ 鎳磷合金鍍層
★ 鎳磷碳化矽複合鍍層
★ 脈衝電流
★ 電鑄
★ 磨潤
★ 磨耗阻抗
★ 磨耗機制		 關鍵字(英) ★ Wear mechanism
★ Wear resistance
★ Tribology
★ Ni-P alloy coatings
★ Ni-P-SiC composite coatings
★ Pulse current
★ Electroforming
論文目次 摘 要 I
ABSTRACT II
謝 誌 IV
目 錄 V
圖目錄 IX
表目錄 XII
第一章 前言 1
1-1 研究背景 1
1-1.1 微機電系統LIGA製程之微電鑄 1
1-1.2 鎳基微電鑄鍍層與磨潤相關之應用 2
1-1.3 Ni-P及Ni-P複合電鑄鍍層 3
1-2 研究目的與研究架構 4
第二章 理論基礎 7
2-1 電沉積製程相關理論 7
2-1.1 電化學沉積金屬的基礎理論 7
2-1.2 電鑄原理 12
2-1.3 電鑄鎳鍍層 13
2-1.4 合金電鍍機制 14
2-1.5 複合鍍共沈積機制與原理 15
2-1.6 脈衝電鍍 17
2-2磨潤相關理論 18
2-2.1 摩擦 18
2-2.2 磨耗 21
2-2.3 潤滑 25
第三章 文獻回顧 28
3-1 NI-P鍍層電沉積效率 28
3-2 NI-P鍍層電沉積機制 28
3-3 NI-P合金之內應力 29
3-4 NI-P合金之微硬度 30
3-5 NI-P合金之鍍層結構 31
3-6 NI-P基複合電鍍之耐磨性 32
第四章 實驗規劃與實驗設備 35
4-1 實驗規劃 35
4-2 儀器設備與實驗藥品 35
4-2.1 電鑄實驗及鍍層分析儀器設備 36
4-2.2 鍍層磨潤實驗及檢測儀器 36
4-2.3鍍層性質檢測儀器 36
4-3 電鑄製程化學藥品 36
4-4 鍍層內應力測試方法 37
4-5鍍層磨潤實驗方法 37
4-6 微硬度量測方法 38
第五章 脈衝電鑄NI-P合金鍍層性質分析 44
5-1 前 言 44
5-2 實驗參數與條件 44
5-3實驗結果與討論 45
5-3.1脈衝電鑄參數對Ni-P 合金鍍層性質的影響 45
5-3.2實驗量測值、預測值的比較及迴歸分析 48
5-3.3 Ni-P鍍層性質間的相關性與信賴度關係 49
5-4結 論 50
第六章 脈衝電鑄NI-P合金鍍層之磨潤研析 58
6-1 脈衝與直流電鑄NI-P鍍層的性質及結構 58
6-1.1 前言 58
6-1.2 實驗參數及條件 59
6-1.3 Ni-P合金鍍層的性質及微結構 60
6-2 NI-P合金鍍層於常溫環境的磨耗研析 64
6-2.1 摩擦係數與磨耗重量損失 64
6-2.2磨損表面之顯微觀察與成份分析 65
6-2.3 磨耗阻抗與鍍層磷含量及硬度的關係 67
6-2.4 氧化鐵膜 vs. 鍍層結構對磨耗特徵的影響 68
6-3 熱處理對NI-P鍍層的結構及磨耗行為影響效應 83
6-3.1 前言 83
6-3.2 熱處理對Ni-P鍍層結構的影響 83
6.3-3熱處理對晶粒尺寸、硬度及磨耗的影響 84
6-3.4 Ni-P鍍層熱處理前、後之磨耗特徵及耐磨性 85
6-4溫度對NI-P鍍層熱穩定及磨耗特徵影響 94
6-4.1前言 94
6-4.2 溫度對Ni-P合金鍍層摩擦係數的影響 94
6-4.3溫度對鍍層磨耗損失與硬度之影響 95
6-4.4溫度對鍍層結構、磨損型態及磨潤機制的探討 96
6-5 結 論 108
第七章 脈衝電鑄NI-P-SIC複合鍍層之磨潤研析 110
7-1 脈衝NI-P-SIC及直流NI-P-SIC複合鍍層的特徵比較 110
7-1.1 前言 110
7-1.2 實驗規劃與設計 110
7-1.3 Ni-P-SiC複合鍍層中SiC微粒的含量與分布 111
7-1.4 磷元素含量對Ni-P-SiC複合鍍層性質的影響 112
7-2 脈衝電鑄NI-P-SIC複合鍍層常溫耐磨性質研析 120
7-2.1 前言 120
7-2.2 實驗規劃與設計 121
7-2.3 電鑄參數對Ni-P-SiC鍍層性質的影響 122
7-2.4 Ni-P-SiC鍍層磨耗實驗結果分析 122
7-2.5 Ni-P-SiC鍍層磨損表面之顯微觀察與分析 123
7-2.6 Ni-P-SiC鍍層之磨耗阻抗與性質的關係 124
7-3 昇溫效應對NI-P-SIC複合鍍層的耐磨特徵影響 134
7-3.1 前言 134
7-3.2 耐溫磨耗之Ni-P-SiC鍍層性質 135
7-3.3 溫度對Ni-P-SiC鍍層之摩擦與磨耗的影響 135
7-3.4 Ni-P-SiC鍍層於昇溫磨耗試驗後的XRD分析 137
7-3.5 Ni-P-SiC鍍層昇溫磨耗表面之顯微觀察 137
7-4 結 論 146
第八章 綜合結論 148
未來研究方向 155
參考文獻 156
博士進修期間發表論著 167
個人簡歷 168
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指導教授 鄭銘章(Ming-Chang Jeng) 審核日期 2007-1-19
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