博碩士論文 93323080 詳細資訊




以作者查詢圖書館館藏 以作者查詢臺灣博碩士 以作者查詢全國書目 勘誤回報 、線上人數:39 、訪客IP:18.226.166.214
姓名 郭思齊(Sy-Chi Kuo)  查詢紙本館藏   畢業系所 機械工程學系
論文名稱 液體冷卻系統中之微熱交換器性能分析與改良
(Performance Analysis and Improvement of Micro Heat Exchanger in Liquid Cooling System)
相關論文
★ 冷卻水溫度與冰水溫度對離心式冰水主機性能影響之實驗分析★ 不同結構與幾何形狀對熱管性能之影響
★ 油冷卻器熱傳與壓降性能實驗分析★ 水對冷媒R22在板式熱交換器內之性能測試分析
★ 水對水在不同板片型式之板式熱交換器性能測試分析與比較★ 油冷卻器性能測試分析與比較
★ 空調機用水簾式暨光觸媒空氣清淨機 研製及測試★ 水對空氣在板式熱交換器之性能測試分析
★ 板片入出口及入出口管路壓降估計對板式熱交換器壓降性能影響分析★ 微熱交換器之設計與性能測試
★ 板式熱交換器之入出口壓降實驗分析★ 直接模擬蒙地卡羅法於高低速流場之模擬
★ 液體微熱交換器之熱傳增強研究★ 冷媒R22在板式熱交換器內之凝結熱傳及壓降性能實驗分析
★ 不同參數對燒結式熱管性能之影響研究★ 使用不同擋板集管之多通道熱交換器流動分佈觀察
檔案 [Endnote RIS 格式]    [Bibtex 格式]    [相關文章]   [文章引用]   [完整記錄]   [館藏目錄]   至系統瀏覽論文 ( 永不開放)
摘要(中) 本實驗主要研究為使用於液體冷卻系統中的微熱交換器,將已知的熱傳增強技術作為流道結構設計。主要參考工業界廣泛使用的山型紋板式熱交換器,利用山型紋來增加流體擾動,以及常用於氣體冷卻之斷續型鰭片,破壞流道內邊界層的成長,利用相同的熱傳增強原理,作為流道結構設計,以提升熱傳性能。而為了降低微熱交換器的壓降,首先更改入出口型式,減少入出口造成的壓降。對於山型紋所造成的壓降,則是製作多層板片的山型紋微熱交換器。各式微熱交換器之壓降與熱傳性能,經由實驗測試皆已了解並討論。
在相同的泵動力下,熱阻由低至高依序為:山型紋30度三層、山型紋30度、翼型斷續型鰭片與山型紋30度四層。山型紋型式,在加熱量100瓦時,仍可以維持中心點溫度在70 oC以下。在相同流量下,山型紋30度的壓降最高,而多層山型紋能有效降低壓降,並且熱傳性能不置於降低太多。斷續型鰭片能與山型紋有相近的熱阻,並且不需製作多層板片,即可降低壓降。各式微熱交換器間具有不同的熱傳與壓降特性,可以根據能提供的泵動力大小以及溫度限制,來選擇適用的型式。
摘要(英) This paper describes a micro heat exchanger of a liquid cooling system. The single-phase heat transfer enhancement techniques are well established for micro heat exchangers. The major techniques include breakup of boundary layer, secondary flow and mixers. There are some methods to decrease pressure drop penalty. First, the inlet and outlet of exchanger. Second, the multilayer exchanger for chevron. The pressure drop and heat transfer characteristics of micro heat exchanger were investigated experimentally.
The experimental results show that at the same pumping power. The thermal resistance of the Chevron30x3 is less than that Chevron30, OSF-Airfoil and Chevron30x4. And the chevron type of exchanger that can keep the maximum temperature below 70 oC. At the same flow rate, the pressure drop of the multilayer exchanger are less than that of the single-layer case, besides the OSF-Airfoil. Every kinds of micro heat exchanger have different performance of the pressure drop and heat transfer. We can choose exchangers that we need by the performance of pumping power and limited of the maximum temperature.
關鍵字(中) ★ 多層結構
★ 斷續型鰭片
★ 山型紋
★ 微熱交換器
關鍵字(英) ★ Micro Heat Exchanger
★ Multilayer
★ Offset Strip Fin
★ Chevron
論文目次 頁次
摘 要 i
目 錄 ii
表 目 錄 v
圖 目 錄 vi
符 號 說 明 x
第一章、前言 1
1.1 研究動機與背景 1
1.2 研究目的 2
第二章、文獻回顧 7
2.1 直線矩形流道 7
2.2 非矩形流道 12
第三章、實驗方法與板片設計 28
3.1 微熱交換器設計 28
3.1.1 山型紋微熱交換器 28
3.1.2 斷續型鰭片微熱交換器 29
3.2 微熱交換器製作 31
3.2.1 板片蝕刻 33
3.2.2 板片尺寸量測 33
3.2.3 板片接合 33
3.3 實驗系統 34
3.3.1 測試段 34
3.3.2 循環系統 34
3.4 實驗步驟 35
3.5 實驗量測儀器與設備 35
3.5.1 溫度量測 35
3.5.2 差壓量測 36
3.5.3 流量量測 36
3.5.4 資料擷取系統 36
3.6 數據換算 37
3.6.1 加熱瓦數 37
3.6.2 熱阻 37
3.6.3 泵動力(Pumping Power) 38
第四章、實驗結果與討論 64
4.1 入出口之影響 64
4.1.1 壓降 64
4.1.2 熱傳 65
4.2 多層山型紋微熱交換器 66
4.2.1 壓降 66
4.2.2 熱傳 66
4.3 各式微熱交換器之性能比較 67
第五章、結論 81
第六章、參考文獻 82
附錄、實驗誤差分析 86
參考文獻 Baumann, H., Heinemeyer, P., Staiger, W., Topfer, M., Unger, K., and Muller, D., 2001, ”Optimized Cooling Systems for High-Power Semiconductor Devices,” IEEE Transactions on Industrial Electronics, Vol. 48, No. 2, pp. 298-306
Chu, R. C., 1999, ” A Review of IBM Sponsored Research and Develop
-ment Projects for Computer Cooling,” Semiconductor Thermal Measurement and Management Symposium, Fifteenth Annual IEEE 9-11 , pp. 151-165
Colgan, E. G., Furman, B., Gaynes, M., Graham, W., Labianca, N., Magerlein, J.H., Polastre, R.J., and Royhwell, M.B., 2005, ”A Practical Implementation of Silicon Microchannel Coolers for High Power Chips,” Proceedings of 21st IEEE SEMI-THERM Symposium, San Jose, CA, pp. 1-7
Curamik® electronics, 2004, PolarXstream Cooler,
http://www.polarXstream.com
Exel, K., and Juergen, S. H., 1998, ”Water Cooled DBC Direct Bonded Copper Substrates,” IEEE, pp. 2350-2354
Gschwind, P., Gaiser, G., Zimmerer, C., and Kottke, V., 2001, “Transport Phenomena in Micro Heat Exchangers with Corrugated Wals,” Microscale Thermophysical Engineering, Vol. 5, No. 4, pp. 285-292
Harm, T. M., Kazmierczak, M. J., and Gerner, F. M., 1999, “Developing Convective Heat Transfer in Deep Rectangular Microchannels,” International Journal of Heat and Mass Transfer, Vol. 20, pp. 149-157
Holman, J. P., 2001, Experimental Methods for Engineers, McGraw-Hill, New York
Kandlikar, S. G., and Grande, W. J., 2004, ”Evaluation of Single Phase Flow in Microchannels for High Heat Flux Chip Cooling-Thermohydraulic Performance Enhancement and Fabrication Technology,” Heat Transfer Engineering, Vol. 25, No. 8, pp. 5-16
Kandlikar, S. G., and Upadhye, H. R., 2005, ”Extending the Heat Flux Limit with Enhanced Microchannels in Direct Single Phase Cooling of Computer Chips,” Proceedings of 21st IEEE SEMI-THERM Symposium, San Jose, CA, pp. 8-15
Lu, M. C., and W, C. C., 2005, ”Effect of the Inlet Location on the Performance of Parallel-Channel Cold-Plate,” IEEE Transactions on Components and Packaging Technologies, pp.
Missaggia, L. J., Walpole, J. N., Liau, Z. L., and Phillips, R. J., 1989, “Microchannel Heat Sinks for Two-Dimensional High Power Density Diode Laser Arrays,” IEEE Journal of Quantum Electronics, Vol. 25, No. 9, pp. 1988-1992
Munson, B. R., Young, D. F., and Okiishi, T. H., 1990, Fundamentals of Fluid mechanics, John Wiley & Sons, Inc., Canada
Patterson, M. K., Wei, X. J., Joshi, Yogendra., and Prasher, R., 2004, “Numerical Study of Conjugate Heat Transfer in Stacked Microchannels,” 2004 International Society Conference on Thermal Phenomena, pp. 372-380
Steinke, M. E., and Kandlikar, S. G., 2004, “Single-Phase Heat Transfer Enhancement Techniques in Microchannel and Minichannel Flow,” Microchannels and Minichannels
Tuckerman, D. B., and Pease, R. F., 1981, ”High-Performance Heat Sinking for VLSI,” IEEE Electron Device Letters, Vol. Del-2, No. 5, pp. 126-129
Tonomura, O., Kano, M., Hasebe, S., and Hashimoto, Iori., 2002, ”CFD based Analysis of Heat Transfer and Flow Pattern in Plate-Fin Micro Heat Exchangers,” Proceedings of International Symposium on Design, pp. 109-114
US air force, 1989 , http://www.airforce.com
Qu, W., and Mudawar, I., 2002, “Experimental and Numerical Study of Pressure Drop and Heat Transfer in a Single-Phase Micro-Channel Heat Sink,” International Journal of Heat and Mass Transfer, Vol. 45, pp. 2549-2565
Webb, R. L., 1994, Principles of Enhanced Heat Transfer, John Wiley & Sons, New York
Wei, X. J., and Joshi, Yogendra., 2004, “Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components,” Journal of Electronic Packaging, Vol. 126, pp.
Wei, X. J., 2004, ”Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronics Devices,” PhD Dissertation, Georgia Institute of Technology
Zhang, H. Y., Pinjala, D., Wong, T. N. and Joshi, Y. K., 2005, “Development of Liquid Cooling Techniques for Flip Chip Ball Grid Array Packages with High Heat Flux Dissipations,” IEEE Transactions on Components and Packaging Technologies, Vol. 28, No. 1, pp. 127-135
http://www.intel.com
http://www.thermaltake.com.tw
http://www.coolermaster.com.tw
http://www.swiftnets.com
賴耿陽,2000,金屬腐蝕加工技術,復漢出版社有限公司,台南。
王啟川,2001,熱交換器設計,五南圖書出版有限公司,台中。
劉瑋輯,2005,微熱交換器之設計與性能測試,國立中央大學機械工程研究所碩士論文,中壢。
指導教授 楊建裕(Chien-Yuh Yang) 審核日期 2006-7-20
推文 facebook   plurk   twitter   funp   google   live   udn   HD   myshare   reddit   netvibes   friend   youpush   delicious   baidu   
網路書籤 Google bookmarks   del.icio.us   hemidemi   myshare   

若有論文相關問題,請聯絡國立中央大學圖書館推廣服務組 TEL:(03)422-7151轉57407,或E-mail聯絡  - 隱私權政策聲明