碳系材料/環氧樹脂之導電碳膠的製備及其性質之研究

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姓名

吳建銘(Jian-ming Wu) 查詢紙本館藏

畢業系所

化學工程與材料工程學系

論文名稱

碳系材料/環氧樹脂之導電碳膠的製備及其性質之研究

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摘要(中)

導電碳漿是製備各種電子元件的關鍵功能材料，由於導電碳漿具備優異的導電性、硬度、附著性，也多被用於薄膜開關及印刷線路板。其中，導電相碳粉和樹脂黏結相是導電碳漿的重要組成部分，對導電碳漿的導電性能和機械性能影響很大。

本論文主要研究了導電碳漿的製備及加工過程，通過實驗證明導電相比例為60 wt.% 時，能得到最完整的網版印刷圖形。並進一步研究了不同固化條件(固化時間和溫度)對導電碳漿電阻率的影響，發現當固化溫度為180 ℃及固化時間為60分鐘時，能得到最低的電阻率。並使用三滾桶研磨機，而使導電碳漿之平均粒徑減小而能有效地降低電阻。

不同的碳系材料對導電碳漿之性能產生不同的影響，研究不同類型的碳系材料對導電碳漿電性能、硬度、附著力之影響。通過實驗證明了加入石墨烯在石墨中，可以使導電碳漿具有優良的硬度、附著力，以及具有較低的電阻率可以至5ⅹ10-1 Ω•cm.

摘要(英)

With the rapid development of technology, many researches are putting more emphasis on the conductive carbon ink. Conductive carbon ink is kind of significant functional conducting material which is usually used in membrane switch and printed circuit board. Conductive carbon ink has excellent electrical conductivity and mechanical properties, including hardness and adhesiveness. The conductive phase and resin binder phase are the most influential ingredients in the ink.

The preparation and manufacturing of conductive carbon ink was studied in this thesis, it can be seen from experiments that the optimum composition of conductive phase is 60 wt. %, it has the suitable viscosity to do screen printing。The effect of the curing condition on electrical property also studied at the same time. It can be found that the optimum conditions of curing temperature is 180 ℃, and the optimum curing time is 60 min. Also use the three-roll mills to make the particle size of the carbon ink decreased and has lower resistivity.

The effect of different carbon material on electrical conductivity and mechanical properties of carbon ink was studied in this thesis. Results show that the graphene/ graphite ink has excellent hardness, adhesiveness and lower resistivity of 3.3ⅹ10-1 Ω • cm

關鍵字(中)

★ 導電碳膠
★ 固化反應

關鍵字(英)

★ conductive carbon ink
★ curing reaction

論文目次

摘要 i
Abstract ii
Table of Contents iv
List of Figures vii
List of Tables x
Chapter 1. Introduction 1
Chapter 2. Literature review 4
2.1 Introduction of Conductive Adhesive 4
2.1.1 Classification of Conductive Adhesive 4
2.1.2 Conducting theory of conductive adhesive 8
2.1.3 Selection of conductive substances for conductive adhesive 11
2.2 Composition of conductive carbon adhesive 13
2.2.1 Conductive substance - carbon series filler 13
2.2.2 Resin binding phase 21
2.2.3 Curing agent 24
2.2.4 Solvent 34
2.2.5 Additive 36
2.4 Application of conductive carbon adhesive 40
Chapter 3. Experimental 42
3.1 Chemicals 42
3.2 Materials 43
3.2.1 Epoxy resin 43
3.2.2 Curing agent 44
3.2.3 Polyethylene terephthalate 45
3.3 Experiment instruments 46
3.3.1 Tree-roller mills 46
3.3.2 Screen printer 47
3.4 Preparation of conductive carbon adhesive 47
3.5 Screen printing 49
3.6 Volume resistivity 51
3.7 Adhesion 52
3.8 Hardness 56
3.9 SEM 59
3.10 Alpha step 60

Chapter 4. Results and discussion 61
4.1 Screen-printing 61
4.2 Investigate the resistivity of ink at different curing conditions 65
4.2.1 Investigate the resistivity of ink at different curing temperature 65
4.2.2 Investigate the resistivity of ink at different curing time 66
4.2.3 The SEM of conductive carbon ink at different temperature 68
4.3 Three-roll Mills 69
4.4 The property of conductive ink in different carbon materials 72
4.4.1 SEM 72
4.4.2 Resistivity 73
4.4.3 Hardness 74
4.4.4 Adhesive 75
Chapter 5. Conclusion 76
Reference 77

List of Figures
Figure 2.1 The classification of conductive adhesives 5
Figure 2.2 Percolation theory 9
Figure 2.3 Field emission effect 11
Figure 2.4 The morphology of carbon black 15
Figure 2.5 The structure of carbon nanotubes 15
Figure 2.6 The structure of graphite plate 17
Figure 2.7 The structure of graphene 18
Figure 2.8 The different structure of carbon material 20
Figure 2.9 The gradual hardening and polymerization of epoxy resin 33
Figure 3.1 Multi-meter 51
Figure 3.2 The image of adhesion test by cross-cut method 54
Figure 3.3 SEM 59
Figure 3.4 α-step 60
Figure 4.1 The printing result with different amount of binding phase 64
Figure 4.2 Investigate the resistivity of ink at different curing condition 67
Figure 4.3 The SEM of conductive carbon ink 68
Figure 4.4 The fineness of conductive carbon ink 70
Figure 4.5 The thickness of conductive carbon ink 71
Figure 4.6 The hardness of different carbon material ink 74
Figure 4.7 The adhesive of different carbon material ink 75

List of Tables
Table 2.1 The resistivity of conductive adhesive 13
Table 4.1 The composition of conductive carbon ink 61
Table 4.2 The printing result with different amount of binding phase 62
Table 4.3 The conductivity of ink at different curing temperature and time 67
Table 4.4 The resistivity of different carbon material ink 73
Table 4.5 The hardness of different carbon material ink 74

參考文獻

Y. F. Wang, et al., “Development of electrically conductive ink for screen printing”, by SanYou Macromolecular Technology Co., Ltd., TianJin.

C.J. Yuan, C.L. Hsu, S.C.Wang, K.S. Chang, Eliminating the interference of ascorbic acid and uric acid to the amperometric glucose biosensor by cation exchangers membrane and size exclusion membrane, Electroanalysis 17 (2005) 2239–2245.

SIMMONS J G.. Generalized formula for the electric tunnel effect between similar
Electrodes separated by a thin insulating film. JoumalofAppliedphysies.1963,34(6)

M.E. Ghica, C.M.A. Brett, Development of a carbon film electrode ferrocene-mediated glucose biosensor, Anal. Lett. 38 (2005) 907–920.

B.D. Malhotra, A. Chaubey, Biosensors for clinical diagnostic industry, Sens. Actuators B-Chem. 91 (2003) 117–127.

Manko HH. Solders and soldering materials, design, production and analysis for reliable bonding. 2nd ed. New York: McGraw-Hill; 1979.

Wong CP, Daoqiang Lu. In: Proceedings of the fourth international conference on adhesive joining and coating technology in electronics manufacturing, Espoo: Finland, 2000. p. 121.

Waton IN. US Patent 6416883, July 9, 2002.

Clot P, Zeberli JF, Chenuz JM, Ferrando F, Styblo D. In: Proceedings electronics manufacturing technology symposium, 24th IEEE/CPMT; 1999.

Joshi R. Microelectron J 1998;29:343

Kim HJ, Kwon WS, Paik KW. In: Proceedings of the fifth international conference on electronic materials and packaging. Singapore; 2003.

Yim MJ, Ryu WH, Jeon YD, Lee JH, Ahn SY, Kim JH, Paik KW. IEEE Trans Components Packag Manuf Technol 1999;

指導教授

陳郁文(Yu-wen Chen)

審核日期

2014-8-29

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