銅電鍍製程於微小結構製作之應用

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姓名

高自強(Chin-Chiang Kao) 查詢紙本館藏

畢業系所

機械工程學系

論文名稱

銅電鍍製程於微小結構製作之應用

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摘要(中)

本研究使用電化學沈積方式製作出微米等級的三維元件，在研究過程中，將陽極軸與電鍍試片之間的距離固定，逐步的調整電源供應器的電流與三軸移載平台的移動速度，以製作出外觀平滑且完整的結構。
在研究過程中，發現鍍浴需要循環。用以將電鍍過程中電化學反應在陽極軸上產生的氣泡沖離陽極軸，並補充在電沈積過程中鍍浴金屬離子的消耗。如果循環量不足，來不及沖走電化學反應產生的氣泡，則製作出的三維結構將會形成不平滑的塊狀組織。
由於電化學沈積的速率非線性，所以無法使三軸移載平台的Ｚ軸配合電化學沈積的速度來移動，因此本研究是先固定電源供應器輸出之電流，然後調整移動速度來配合沈積速度，試圖取得一個平衡點。即使如此電化學沈積的速度與陽極軸移動速度依然會有些微的差距，此時，我們用陽極軸與電鍍試片的間距來彌補電化學沈積的速度與陽極軸移動速度之間的速度差，以解決此現象所延伸出的相關問題。
本研究的目標在於尋求一個可以改善鍍物品質的方法，而在本研究中也已得到初步的解決方案，並且成功的製作出一些可用的結構。未來我們可以嘗試將此製程應用在其他製造領域，進一步的將機構細微化和大幅度降低製造成本。

摘要(英)

Electrochemical deposition method was used in this study to produce three-dimensional structure parts in micron grade. We fixed distance of anode shaft and plated specimen then adjust power of the current supply and speed of triaxial positioning table gradually in order to create the smooth appearance and complete structures.
We found that the cycle of plating bath was needs to wash bubble which generated from electrochemical reaction in plating process away from anode axis and supplied metal ions of planting bath which was consumed in electrochemical process. If the amount of cycle is less than the needs which induced too late to wash away the bubbles generated by electrochemical reactions that will make three-dimensional structures forms rough lumps.
Because of the nonlinear of electrochemical deposition rate, the velocity of Z-axis shift cannot work with it. We fixed the output of power supply, and then adjusted the speed of movement in order to match the deposition rate and trying to strike a balance. However, there was still slight difference between the rate of electrochemical deposition and Z-axis shift. We used the vertical space of anode shaft and plated specimen to compensate for the differential rate and figured out the relevant problem.
The objective of this study is to seek a method which could improve the quality of the plating. In this study we have already found the preliminary solution and produced some of the useful structures successfully. We can try to use this process in other manufacturing field and make mechanism miniaturize and cost down.

關鍵字(中)

★ 微電鍍
★ 電化學沈積
★ 陽極軸

關鍵字(英)

★ micro-electroplated
★ electrochemical deposition
★ anode shaft

論文目次

摘要 i
Abstract ii
誌謝 iii
目錄 iv
圖目錄 vii
表目錄 ix
一、緒論 1
1.1 前言 1
1.2 研究動機與目的 1
1.3 文獻回顧 2
1.4 章節提要 4
二、理論基礎 5
2.1 理論基礎 5
2.1.1 電鍍原理 5
2.1.2 微電鍍原理 7
2.2 其它微製造技術 10
2.2.1 微電鑄技術 11
2.2.2 三維列印技術 13
2.2.3 放電加工技術 16
2.2.4 雷射加工技術 18
三、實驗架構 20
3.1 實驗設備 20
3.1.1 陽極軸 21
3.1.2 電鍍試片 23
3.1.3 鍍浴組成 26
3.1.4 銅線 27
3.1.5 電源供應器 27
3.1.6 循環泵浦 28
3.1.7 控制電腦 28
3.1.8 自動移載滑台 29
3.2 實驗方法及流程 30
3.3 量測儀器 31
3.3.1 工具顯微鏡 31
3.3.2 超音波清洗機 31
3.3.3 三用電錶 31
3.3.4 CHY 24CR LCR METER 32
四、樣本及量測 33
4.1 不同製程條件對於樣本外觀的影響 33
4.2 不同製程電流下理論和實際電阻值之差異 37
4.2.1 量測原理 37
4.2.2 樣本量測 39
五、討論 45
5.1 實驗工具對微電鍍之影響 45
5.1.1 陽極軸材質對電鍍析出之影響 45
5.1.2 電鍍試片絕緣對微電鍍之影響 45
5.2 製程參數對微電鍍之影響 46
5.2.1 製程電流 46
5.2.2 陽極軸移動速度 46
5.2.3 陽極軸移動方向 47
5.2.4 鍍浴的選用 47
5.2.5 鍍浴循環 49
5.2.6 鍍浴濃度 49
5.3 導電特性討論 50
5.3.1 鍍物外觀對於導電性之影響 50
5.3.2 鍍物與一般導體之比較 50
六、結論與未來展望 51
6.1 結論 51
6.2 未來展望 51
參考文獻 52

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指導教授

陳世叡(Shih-Jui Chen)

審核日期

2015-1-30

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