| 摘要(英) |
In this paper, we use Boomerang Chart that we published in the past to analyze the classified wafer maps in a great view, whether the distribution of defects uniform or not and verify it in mass production.
At first, we choose five kinds of size of wafers that we would like to analyze, and simulate basic curve according to these five kinds of size. In this experiment, we will create parameters NBD and NCD from every wafer in every data, and normalize the two parameters to create two new parameters, NNBD and NNCD. We will create Boomerang Chart according to the two parameters and compare with basic curve to observe every failure type’s position on basic curve, we will judge whether a wafer uniform or not and the situation of clustering of bad dice by this. Then, we will view whether there are systematic errors in non-classified data based on the result.
In this experiment, we verify mass production by using Boomerang Chart ,and find out the position and the situation of clustering of every failure type by observing Boomerang Chart ,and confirm the practicability of Boomerang Chart through non-classified data set to get the achievement of increasing yield、testing efficiency and reduce the production cost. |
| 參考文獻 |
[1] Jwu-E Chen, Mill-Jer Wang, Yen-Shung Chang, Shaw Cherng Shyu, and
Yung-Yuan Chen, “ Yield Improvement by Test Error Cancellation ”, in Test
Symposium (ATS), pp.258-260, Nov. 1996.
[2] C. - K. Hsu, Lin, F., Cheng, K. - T. Tim, Zhang, W., Li, X., Carulli, J. M., and
Butler, K. M., “Test data analytics - Exploring spatial and test-item correlations
in production test data”, in Test Conference (ITC), pp.1-10, Sep. 2013.
[3] Ming-Ju Wu, Jyh-Shing Roger Jang, and Jui-Long Chen, “Wafer Map Failure
Pattern Recognition and Similarity Ranking for Large-scale Datasets”, IEEE
Transactions on Semiconductor Manufacturing, vol.28, no.1, pp.1-12, Feb. 2015.
[4] S. Zhang, Lin, F., Hsu, C. - K., Cheng, K. - T. Tim, and Wang, H., “Joint Virtual
Probe: Joint exploration of multiple test items′ spatial patterns for efficient silicon characterization and test prediction”, in Design, Automation and Test in Europe Conference and Exhibition (DATE), pp.1-6, Mar. 2014.
[5] F. Lin, Hsu, C. - K., and Cheng, K. - T. Tim, “Learning from Production Test
Data: Correlation Exploration and Feature Engineering”, in Test Symposium
(ATS), pp.236-241, Nov. 2014.
[6] F. Lin, Hsu, C. - K., and Cheng, K. - T. Tim, “Feature engineering with canonical
analysis for effective statistical tests screening test escapes”, in Test Conference (ITC), pp.1-10, Oct. 2014.
[7] 廖仁男, “Boomerang Equivalence: A Classifier for Uniform Wafer Maps ” , 碩
士論文﹐中央大學﹐2010.
[8] 曾國銓, “A Non-uniformly Distributed Defect Map Analysis by Quantification
Model” , 碩士論文﹐中華大學﹐2013.
[9] 林正田,“Wafer Map Analysis from a Random-Defect-Source Perspective”,
碩士論文﹐中央大學﹐2012.
[10] 邱政文,“Bat-wing : an inductive model for wafer map characterization and generation”, 碩士論文﹐中央大學﹐2006.
[11] MATLAB之工程應用,http://bime-matlab.blogspot.tw/ |
[Endnote RIS 格式]
[相關文章]
[文章引用]
[完整記錄]
[館藏目錄]
至系統瀏覽論文 ( 永不開放)
plurk
funp
live
udn
HD
myshare
netvibes
friend
youpush
delicious
baidu
Google bookmarks
del.icio.us
hemidemi
facebook
twitter
google
reddit