參考文獻 |
[1] Chang, T.C.; Lee, S.; Fuh, Y.K.; Peng, Y.C.; Lin, Z.H. PCM based heat sinks of Paraffin/nanoplatelet graphite composite for thermal management of IGBT. Appl. Therm. Eng. 2017, 112, 1129-1136.
[2] Garimella, S.V.; Fleischer, A.S.; Murthy, J.Y.; Keshavarzi, A.; Prasher, R.; Patel, C.; Bhavnani, S.H.; Venkatasubramanian, R.; Mahajan, R.; Joshi, Y.; Sammakia, B.; Myers, B.A.; Chorosinski, L.; Baelmans, M.; Sathyamurthy, P.; Raad, P.E. Thermal challenges in next-generation electronic systems. IEEE.T. Compon. Pack. T. 2008, 31, 801–815.
[3] Skuriat, R.; Li, J. F.; Agyakwa, P.A.; Mattey, N.; Evans, P.; Johnson, C.M. Degradation of Thermal Interface Materials for High-Temperature Power Electronics Applications. Microelectron. Reliab. 2013, 53, 1933–1942.
[4] Schelling, P.K.; Shi, L. Goodson, K.E. Managing heat for electronics. Mater. Today. 2005, 8, 30–35.
[5] Kim, S.; Drzal, L.T. High latent heat storage and high thermal conductive phase change materials using exfoliated graphite nanoplatelets. Sol. Energ. Mat. Sol. C. 2009, 93, 136-42.
[6] Xiang, J.; Drzal, L.T. Thermal Conductivity of Exfoliated Graphite Nanoplatelet Paper. Carbon. 2011, 49, 773–778.
[7] Prasher, R.S.; Shipley, J.; Prstic, S.; Koning, P.; Wang, J.L. Thermal resistance of particle laden polymeric thermal interface materials. J. Heat. Transf. 2003, 125, 1170–1177.
[8] Y. Sugawara. Recent progress in SiC power device developments and application studies. Proceedings. 2003.10-18.
[9] Mayorga, J.V.; Gutshall, C.P.; Phan, K.M.; Mantooth, H.A. Reese, B.; Schupbach, M.; Lostetter A. High-Temperature Silicon-on-Insulator Gate Driver for SiC-FET Power Modules. IEEE Transactions on Power Electronics. 2012,27,4417-4424.
[10] Renteria, J.D.; Nika, D.L.; Balandin, A.A. Graphene Thermal Properties: Applications in Thermal Management and Energy Storage. Appl. Sci. 2014,525-547.
[11] Chang, T.C.; Fuh, Y.K.; Lee ,R.Z. Screen Printed Nanostructured Composites as Thermal Interface Materials for IGBT heat dissipation applications, J. Micro/Nanolith. MEMS MOEMS. 2016, 15, 2353-2357.
[12] Elgafy, A.; Lafdi, K.; Effect of carbon nanofiber additives on thermal behavior of phase change materials. Carbon. 2005, 43, 3067-3074.
[13] Wang, L.W.; Tamainot-Telto, Z.; Thorpe, R.; Critoph, R.E.; Metcalf, S.J.; Wanga, R.Z. Study of thermal conductivity, permeability, and adsorption performance of consolidated composite activated carbon adsorbent for refrigeration. Renewable Energy. 2011, 36, 2062-2066.
[14] Xu, Y.S.; Chung, D.D.L. Increasing the thermal conductivity of boron nitride and aluminum nitride particle epoxy-matrix composites by particle surface treatments. Compos.Interface. 2000, 7, 243–256.
[15] Song, W.L.; Ping, W.; Cao, L.; Ankoma, A. Mohammed, J.M. Andrew, J.F. Ping YS‘Polymer/Boron Nitride Nanocomposite Materials for Superior Thermal Transport Performance. Angew. Chem Int Ed. 2012, 51, 6498–6501.
[16] Khan, A.; Savi, P.; Quaranta, S.; Rovere, M.; Giorcelli, M.; Tagliaferro, A.; Rosso, C.; Jia, C. Low-Cost Carbon Fillers to Improve Mechanical Properties and Conductivity of Epoxy Composites. Polymers 2017, 9(12), 642.
[17] Janowska, I.; Vigneron, F.; Bégin, D.; Ersen, O.; Bernhardt, P.; Romero, T.; Ledoux, M.J.; Pham-Huu, C. Mechanical thinning to make few-layer graphene from pencil lead. Carbon 2012, 50(8), 3106-3110.
[18] Prasher, R.; Thermal interface materials: historical perspective, status, and future directions. Proc. IEEE. 2006, 94, 1571–1586.
[19] Chen, H.Y.; Ginzburg, V.V.; Yang, J.; Yang, Y.F. Liu, W.; Huang, Y.; Du, L.B.; Chen, B. Thermal conductivity of polymer-based composites:Fundamentals and applications. Progress in Polymer Science. 2016, 59,41-85.
[20] De, S.; King, P.J.; Lyons, P.E. Khan, U.; Coleman, J.N. Size Effects and the Problem with Percolation in Nanostructured Transparent Conductors. ACS Nano. 2014, 4(12), 7064-72.
[21] Delogu, F.; Gorrasi, Giuliana.; Sorrentino, A. Fabrication of polymer nanocomposites via ball milling: Present status and future perspectives. Progress in Materials Science. 2017, 86, 75-126.
[22] Chang, T.C.; Fuh, Y.K.; Lin, Z.Y.; Liao, C.A.; Ball milled dispersed network of graphene platelets as thermal interface materials for high-efficiency heat dissipation of electronic devices. JM3 2018, 17(2), 02400.
[23] Gu, J.W.; Li, N.; Tian, L.D.; Lv, Z.Y.; Zhang, Q.Y. High thermal conductivity graphite nanoplatelet/UHMWPE nanocomposites. RSC Advances. 2015, 5, 36334-36339.
[24] Chang, T.C.; Fuh, Y.K.; Lin, Z.Y.; Liao, C.A. Highly stretchable thermal interface materials with uniformly dispersed network of exfoliated graphite nanoplatelets via ball milled processing route. Microsystem Technologies. 2018, 1-9.
[25] Tian, X.J.; Itkis, M.E.E.; Bekyarova, B.; Haddon, R.C. Anisotropic Thermal and Electrical Properties of Thin Thermal Interface Layers of Graphite Nanoplatelet-Based Composites. Sci. Rep. 2013, 3, 1710.
[26] Bhowmik, R.N. Ferromagnetism in lead graphite-pencils and magnetic composite with CoFe2O4 particles. Composites Part B. 2012, 43, 503-509. |