銀輔助化學蝕刻多孔矽梯度結構製備與其濕潤性研究

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王柏盛(Po-Sheng Wang) 查詢紙本館藏

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能源工程研究所

論文名稱

銀輔助化學蝕刻多孔矽梯度結構製備與其濕潤性研究
(Fabrication and Wettability of gradient porous silicon by silver metal assisted chemical etching)

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摘要(中)

隨著時代的發展，奈米科技已經成為我們生活周遭不可或缺的技術，多年來隨著技術的發展成熟，多孔矽奈米技術已經成為半導體製程及能源產業中舉足輕重的重要角色。而金屬輔助化學蝕刻可利用兩步法(Two-step method)製程製備出多孔矽結構，其製程簡易及成本較低等優點於近年研究中得到相當的注目。在生醫方面，微流道為備受關注的主題，其中研究微流體需要探討流體於材料的親疏水之濕潤性質，若需要在微小流體上進行遷移動作，可以透過改變物體表面之微奈米結構改變其濕潤性。

本文利用金屬輔助化學蝕刻，其製程簡易且不需在高壓或高溫環境下即可進行實驗之特點，先以無電鍍沉積法進行銀粒子沉積，再利用蝕刻液使銀粒子於矽表面發生氧化反應從而進行非等向性蝕刻，研究其蝕刻液於常溫及變溫情況下，對於蝕刻深度及結構之影響。實驗結果顯示於適當蝕刻溫度可給予蝕刻結構深度與孔隙率良好之助力，再將蝕刻後之試片進行接觸角量測，探討不同表面結構對於液珠接觸角之影響。

最後綜合上述實驗結果，以將矽試片拉出蝕刻液之方法，製備出具有梯度結構之多孔矽試片，並觀察其接觸角與液珠滑動之情形。實驗結果顯示，液珠於梯度結構表面之驅動力過小，但透過一頃斜平台轉動角度使液珠滑動可得知，液珠於大接觸角端所需滑動之臨界角度小於小接觸角端之滑動臨界角，並且其液珠加速度之提升更為快速。

摘要(英)

In recent years, nanoporous silicon plays an important role in the semiconductor industry and energy industry. Two-step metal assisted chemical etching method has the advantages of low cost and simple processes. In biomedical and microfluidic systems, the hydrophobicity of materials must be considered. We can control a fluid drop to move on a solid surface by changing the hydrophobicity of surface material with nano structures.

We deposit silver particles with electro-less plating deposition method, followed by the anisotropic etch of the silicon surface by oxidation of etchant and silver particles. We apply different temperature to see how it affects the etching depths and the structures. Appropriate temperature helps to achieve best etching depth and porousity. We also determine the effects of different surface structures on droplet contact angles.

We find that the driving force to make the droplet move is too small on the nano porous silicon surface we made. So we use a tilt platform to increase the driving force to observe the effects easily. The critical angle at the larger contact angle side is smaller than the one at the smaller contact angle side, and is faster in the increase of the acceleration of the droplet.

關鍵字(中)

★ 金屬輔助化學蝕刻
★ 多孔矽
★ 濕潤性

關鍵字(英)

★ Metal-Assisted Chemical Etching
★ porous silicon
★ wettability

論文目次

摘要 i
Abstract ii
誌謝 iii
目錄 iv
圖目錄 vi
表目錄 xv
第一章緒論 1
1-1 研究背景 1
1-2 文獻回顧 2
1-2-1 金屬輔助化學蝕刻 2
1-2-2 表面結構對於液體濕潤性 6
1-3 研究動機與目的 9
1-4 論文架構 10
第二章理論基礎 11
2-1 奈米線結構製備 11
2-1-1 一維奈米線結構合成種類 11
2-2 金屬輔助化學蝕刻製程 20
2-2-1 無電鍍金屬沉積 20
2-2-2 金屬輔助化學蝕刻 21
2-3 濕潤理論 23
2-3-1 楊氏方程式(Young’s equation) 23
2-3-2 溫佐模型(Wenzel Model) 27
2-3-3 卡西模型(Cassie and Baxter Model) 28
第三章研究方法 30
3-1 研究架構 30
3-2 實驗製程 32
3-2-1 實驗藥品與器材 32
3-2-2 實驗步驟 33
3-3 量測儀器與分析 38
3-3-1 場發射掃描電子顯微鏡 38
3-3-2 原子力顯微鏡 39
3-3-3 接觸角與液珠滑動分析 40
第四章結果與討論 43
4-1 奈米銀粒子沉積結果 43
4-1-1 SEM圖及其二值化 44
4-1-2 AFM圖及其分析 46
4-2 多孔矽結構蝕刻結果 48
4-2-1 氧化層影響 48
4-2-2 常溫下蝕刻結果與分析 50
4-2-3 變溫蝕刻下結果與分析 65
4-2-4 蝕刻梯度結構結果與分析 76
4-3 接觸角量測與分析 88
4-3-1 變溫蝕刻試片 88
4-3-2 梯度結構試片 92
4-4 阿瑞尼斯方程式(Arrhenius equation) 97
4-5 梯度結構液珠滑動分析 98
第五章結論與未來展望 109
5-1 結論 109
5-2 未來展望 110
參考文獻 111

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指導教授

洪銘聰(Ming-Tsung Hung)

審核日期

2019-3-7

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