| 摘要(英) |
ABSTRACT
In this paper, we recalculate the characteristic parameters of wafer maps in different orientations for the classified wafer maps in previous research. We analyze the difference between new parameters and original wafer parameters, and what effect does it have on the randomness test of wafer maps?
In the past, we used Number of Bad Die (NBD) and Number of Contiguous Line (NCL) to generate Boomerang. We propose B-score as a standard for judging wafer maps. At that time, we always fixed the same orientation of wafer maps when calculating NCL. Now, we generate wafer maps in seven different orientations by rotating and flipping the wafer map. In essence, the seven wafers are still the same as the original wafer. However, due to the way NCL is calculated, it may cause numerical changes. Eventually, the randomness test may also be different.
In this paper, we explore whether the seven clones and the original wafer is consistent in the randomness test to ensure that our test is reliable. |
| 參考文獻 |
參考文獻
[1] J.E. Chen, M.J. Wang, Y.S. Chang, S.C. Shyu, and Y.Y. Chen, “Yield Improvement by Test Error Cancellation ”, Proceedings of the Fifth Asian Test Symposium (ATS’96), pp.258-262, Nov. 1996.
[2] C.K. Hsu, F. Lin, K.T. Cheng, W. Zhang, X. Li, J.M. Carulli, and K.M. Butler, “Test data analytics - Exploring spatial and test-item correlations in production test data”, in International Test Conference (ITC), pp.1-10, Sep. 2013.
[3] M.J. Wu, J.S.R. Jang, and J.L. Chen, “Wafer Map Failure Pattern Recognition and Similarity Ranking for Large-scale Datasets”, in IEEE Transactions on Semiconductor Manufacturing, vol.28, no.1, pp.1-12, Feb. 2015.
[4] F. Lin, Hsu, C. - K., and Cheng, K. - T. Tim, “Learning from Production Test Data: Correlation Exploration and Feature Engineering”, in Test Symposium (ATS), pp.236-241, Nov. 2014.
[5] F. Lin, C.K. Hsu, and K.T. Cheng, “Feature engineering with canonical analysis for effective statistical tests screening test escapes”, in International Test Conference (ITC), pp.1-10, Oct. 2014.
[6] 林正田,“Wafer Map Analysis from a Random-Defect-Source Perspective”,碩士論文﹐中央大學﹐2012.
[7] 曾國銓, “A Non-uniformly Distributed Defect Map Analysis by Quantification Model” , 碩士論文﹐中華大學﹐2013
[8] 蕭寶威,“Wafer Map Analysis from Random Distributed Defects”, 碩士論文﹐中央大學﹐2016.
[9] 葉昱緯,“Application of Boomerang Chart to Real-World Mass Production Wafer Maps”, 碩士論文﹐中央大學﹐2016.
[10] 吳雅軒,“Wafer Map Partition Analysis to Enhance Systematic Error Resolution”, 碩士論文﹐中央大學﹐2018.
[11] 林敬儒,“Identification of the Classifier for the Pattern of Spatial Randomness”, 碩士論文﹐中央大學﹐2018. |
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