自動化光學檢測之印刷電路板除膠雛型機之開發

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姓名

施庭宇(Ting-Yu Shih) 查詢紙本館藏

畢業系所

機械工程學系

論文名稱

自動化光學檢測之印刷電路板除膠雛型機之開發
(Development of a Prototype Machine for Removing Glue on Printed Circuit Boards by Automated Optical Inspection)

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至系統瀏覽論文 ( 永不開放)

摘要(中)

在工業 4.0 的潮流下，工業自動化勢不可擋。自動化光學檢測(AOI)是現
代工業品管自動化的重點技術，本研究將以印刷電路板(PCB)除膠機為題，
整合一套具自主整合技術的 AOI 自動化 PCB 除膠機，協助國產自動化產業
的自主技術的發展。本研究整合三軸精密平台、線性掃描相機、同軸視覺系
統等三大設備，以 OpenCV 函式庫做為影像處理的核心。運用線性掃描相
機完成 PCB 表面殘膠的粗定位，確定所有殘膠座標後，依序將待消除的殘
膠移至同軸視覺系統的振鏡下方執行精定位除膠。精定位流程將辨識殘膠
的輪廓並規劃雷射除膠路徑，由振鏡快速移動雷射光束去除殘膠。實驗結果
表明該套雛型機已能完成 PCB 表面殘膠的除膠任務，但處理速度仍有待加
強。未來持續優化程式表現後，即可上線運作，提升生產效率。

摘要(英)

Under the Industry 4.0, automated optical inspection (AOI) is the key technology of modern industrial quality on control automation. This research will focus on the system integration technology of printed circuit board (PCB) residual glue removing by AOI system. This technology is autonomous, so it can promote the development of this country’s autonomous technology. This research can be divided three major equipments : precision three-axis granite gantry platform, linear scan camera and coaxial laser vision system. The program of this research uses OpenCV library as the core of image processing. The linear scanning camera is used to detect the rough position of the residual glues on the PCB surface. After all the residual glues coordinates are determined by linear scan camera, the
residual glues will be moved to the central of the coaxial laser vision system sequentially. Then the residual glues will be fine positioning and removed by laser. The precise positioning process will identify the contour of the residual glue firstly. Then it will plan the laser glue removal path, and control the galvanometer quickly
move the laser beam to remove the residual glue. The experimental results show that the prototype machine can complete the goal of removing the glue on the PCB surface, but the processing speed still needs to be strengthened. After the program performance is continuously optimized in the future, it can be put into operation to improve production efficiency.

關鍵字(中)

★ 自動化光學檢測
★ 除膠
★ 印刷電路板
★ 雷射

關鍵字(英)

★ AOI
★ PCB
★ Laser

論文目次

摘要 i
Abstract ii
誌謝 iii
目錄 iv
圖目錄 vii
表目錄 xi
符號說明 xii
一、緒論 1
1-1 研究背景與動機 1
1-2 文獻回顧 2
1-3 研究架構與方法 6
二、雷射除膠機之系統架構介紹 9
2-1 精密移動平台 9
2-2 線性掃描系統 16
2-3 同軸視覺系統 21
2-3-1 雷射源 21
2-3-2 掃描振鏡 25
2-3-3 同軸成像系統 28
2-4 機器視覺函式庫 31
三、系統運作原理 33
3-1 粗定位流程之 PCB 殘膠辨識原理 33
3-1-1 HSV 色彩空間 33
3-1-2 灰階化 35
3-1-3 中值濾波 36
3-1-4 二值化 37
3-1-5 Canny 邊緣辨識 38
3-1-6 邊緣面積與周長挑選 44
3-2 掃描相機與掃描振鏡之間的座標轉換 45
3-3 精定位流程之 PCB 殘膠辨識原理 47
四、系統程式架構與運行結果 52
4-1 系統程式架構 52
4-1-1 粗定位程式架構 53
4-1-2 精定位程式架構 57
4-2 運行結果 59
4-2-1 粗定位程式運行結果 59
4-2-1-1 ROI 遮罩 59
4-2-1-2 中值濾波與 HSV 顏色過濾 61
4-2-1-3 灰階化與二值化 63
4-2-1-4 Canny 邊緣辨識與邊緣篩選 64
4-2-1-5 座標轉換 65
4-2-2 精定位程式運行結果 66
五、結論與未來展望 79
5-1 結論 79
5-2 未來展望 80
六、參考文獻 81

參考文獻

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指導教授

董必正(Pi-Cheng Tung)

審核日期

2021-10-12

推文