應用品質工程分析法改進製程-以消除晶圓殘留物質為例

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姓名

李柔誼(Rou-Yi Li) 查詢紙本館藏

畢業系所

工業管理研究所在職專班

論文名稱

應用品質工程分析法改進製程-以消除晶圓殘留物質為例

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摘要(中)

除了追求產能外，品質第一向來也是每間公司的重要目標，大多數企業皆透過持續改善以達到此要求，而最直觀影響產出的當屬良率問題，近來發現異物汙染成為低良率的最大因素，為提升良率，本研究將以降低異物汙染率為目標，藉此減低生產過程中造成的外觀問題及避免機臺將良品誤判為不良品的情況發生。
本研究利用特性要因分析圖、FMEA、實驗設計及戴明循環的 PDCA作為研究方法，再帶入實務應用做改善，而在實務應用中則分為幾個部分，首先將利用特性要因分析圖找出異物汙染可能造成的原因，包含各種機構作動中造成的異物掉落、靜置等下一個製程的過程中有灰塵掉落、機器內部濾網網格過大……等，接著使用 FMEA 找出製程中 RPN 超過 150 的項目，最終結合使用實驗設計及 PDCA進行改善。
透過執行各個改善措施後，最終數據結果顯示各個項目的異常率可從最高
50000ppm 降至最低為 1000ppm，RPN 可從 175 降至 35-70，整體而言改善幅度非常顯著，最後也建議未來可針對異物成份作分析，以此作為進一步的改善方向。

摘要(英)

Quality First is the goal of a company, and this goal can be achieved by implementing continuous improvement plans. Recently, we found foreign material is one of the common
reason to cause low yield. In the pursuit of quality, this research will focus on foreign material reduction to reduce visual inspection fail rate and production machine overkill rate during production process.
By using fishbone and failure mode & effects analysis (‘FMEA’), this research demonstrates the methods to resolve possible root causes with design of experiment (‘DOE’)
and Plan-Do-Check-Act (‘PDCA’).
The possible root cause includes but not limited to foreign material fall down during
mechanical movement, dirt during waiting process and oversized mesh in oven. The improvement action in practice is using FMEA to sort out the process with risk priority number (‘RPN’) over 150 and implementing improvement plan of DOE and PDCA.
The final results indicates that the fail rate of production process modified with improvement plans could lower to 1000ppm from 50000ppm, and the PRN could lower to 35-
70 from 175.
In conclusion, the result of improvement is obviously, and suggest to focus on the composition of material for the next study.

關鍵字(中)

★ 失效模式與影響分析
★ 實驗設計
★ 特性要因圖
★ PDCA

關鍵字(英)

★ FMEA
★ DOE
★ Fish-bone analysis
★ PDCA

論文目次

中文摘要 ........................................ i
Abstract ........................................ii
致謝 .......................................iii
目錄 ........................................iv
圖目錄 ........................................ v
表目錄 ........................................ vi
第一章緒論........................................ 1
1-1 研究背景與動機................................. 1
1-2 研究目的 .......................................1
1-3 論文架構 .......................................2
第二章文獻探討......................................3
2-1 臺灣半導體產業介紹...............................3
2-1-1 發展歷程...................................... 3
2-1-2 供應鏈........................................ 5
2-2 覆晶封裝製程介紹................................. 5
2-3 特性要因圖介紹....................................7
2-4 實驗設計介紹......................................8
2-5 FMEA介紹 ....................................... 9
2-6 PDCA Cycle 介紹..................................11
第三章研究方法.......................................12
3-1 特性要因圖應用....................................12
3-2 實驗設計應用......................................12
3-3 FMEA應用 ........................................15
3-4 PDCA Cycle 應用..................................17
第四章個案探討.......................................18
4-1 研究架構 .........................................18
4-1-1 問題分析........................................19
4-1-2 問題改善........................................21
4-2 評估改善成果......................................31
4-3 實際驗證成果......................................32
第五章結論與建議 ....................................33
參考文獻 ........................................34

參考文獻

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指導教授

高信培

審核日期

2022-6-24

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