超音波與磁場複合輔助遮罩式電化學加工微孔陣列之研究

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林孟威(Meng-Wei Lin) 查詢紙本館藏

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機械工程學系

論文名稱

超音波與磁場複合輔助遮罩式電化學加工微孔陣列之研究
(A Study on Ultrasonic combined Magnetic Field assisted Through-Mask Electrochemical Machining of Micro-hole Arrays)

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摘要(中)

當採用陣列電極進行電化學加工微孔陣列時，因具有無法同時旋轉多個電極及無法於電極內設計流道，導致電解液供給不良，造成加工精度不良或無法加工之情形。為了克服前述各項困難點，本論文採用超音波與磁場複合輔助進行遮罩式電化學加工微孔陣列之研究，利用磁場與超音波振動輔助一體式刀具電極對SUS 304不銹鋼試片進行遮罩式電化學加工微孔陣列，並探討超音波功率等級、工作電壓、脈衝休止時間及刀具電極進給速率等不同加工參數對平均對角線長、對角線長全距及微孔入出口之錐角等各種加工特性之影響。
實驗結果顯示，使用超音波輔助振動刀具電極會造成電解液產生快速的壓力變化，形成泵吸作用與空蝕作用，而添加磁場會與電場相互作用產生勞倫茲力，上述這些輔助方式會促使加工間隙中的電解液更新，快速排除加工區域中的反應熱及不導電之深褐色金屬氧化物，進而提升加工能力及材料移除率並降低微孔陣列之平均對角線長。當使用超音波與磁場複合輔助時，相較於單純超音波輔助或磁場輔助，可以得到較佳的平均對角線及表面品質。當採用實驗參數組合為超音波功率等級Level 8(Amplitude：1.30 μm )、工作電壓16 V、脈衝休止時間70 μs及刀具電極進給速率7 μm/s時，可得到最佳平均對角線長546 μm，以及較小的對角線長全距25 μm，並能改善微孔入出口之錐角。

摘要(英)

During the electrochemical machining(ECM) of the micro-hole array by using array electrodes, the poor processing accuracy or inability of the process resulted from the problems of the poor supply of electrolyte which are resulted from the inability to rotate multiple electrodes at the same time and the inability to design a flow channel in the electrodes. To overcome these difficulties, ultrasonic vibration and magnetic field were adapted to assist through-mask electrochemical machining of the micro-hole array in this study. The one-piece array electrode assisted by ultrasonic vibration and a magnetic field was used to produce a micro-hole array on SUS 304 in the ECM process. Discussions follow on the influences of the various processing characteristics, such as average diagonal length, diagonal length range, inlet taper angle, and outlet taper angle, which resulted from the various processing parameters, including ultrasonic power level, working voltage, pulse off time, and electrode feed rate.

The experimental results have shown that the ultrasonic vibration-assisted electrodes quickly changed the pressure of the electrolyte, producing a pumping effect and a cavitation effect, and the interaction between the magnetic field and the electric field generated a Lorentz force. These auxiliary methods promoted the renewal of the electrolyte into the machining gap, which quickly excludes the reaction heat and the non-conductive dark brown metal oxide in the processing area, thereby improving the processing ability and material removal rate and reducing the average diagonal length of the micro-hole array. When ultrasonic and magnetic field assistances were applied simultaneously, better average diagonal and surface qualities were obtained compared with the ultrasonic assistance or magnetic field assistance independently. The experimental parameter combination, including ultrasonic power level 8 (amplitude: 1.30 μm), working voltage 16 V, pulse off time 70 μs, and tool electrode feed rate 7 μm/s, resulted in a minimum average diagonal length of 546 μm and the smallest diagonal length range of 25 μm while improving the inlet and outlet taper angles of the micro-holes.

關鍵字(中)

★ 遮罩式電化學加工
★ 微孔陣列
★ 超音波輔助振動
★ 磁場輔助

關鍵字(英)

★ Through mask Electrochemical Machining
★ Micro Hole Array
★ Ultrasonic Assisted Vibration
★ Magnetic Field Assisted

論文目次

摘要 I
ABSTRACT II
誌謝 IV
目錄 V
圖目錄 IX
表目錄 XIII
第一章緒論 1
1-1 研究背景 1
1-2 研究動機及目的 3
1-3 文獻回顧 5
1-4 論文架構 12
第二章實驗基礎原理 13
2-1 電化學加工基礎理論 13
2-1-1 電化學反應機制 13
2-1-2 法拉第電解定律(Faraday’s Laws of Electrolysis) 14
2-1-3 電化學加工速率 15
2-1-4 平衡間隙 16
2-1-5 歐姆定律(Ohm’s Law) 16
2-1-6 電極電位-金屬與溶液界面雙電層理論(Electrical Double Layer Theory) 17
2-1-7 陽極極化曲線及其特徵 18
2-1-8 電流密度與電流效率 20
2-1-9 脈衝占空比 21
2-2-1 泵吸作用(Pumping Effect) 22
2-2-2 空蝕作用(Cavitation) 23
2-2-3 超音波振動電極之運動分析 23
2-3氣泡影響電化學加工之理論(氣泡與導電度關係理論) 26
2-3-1 體積分率(Volume Fraction) 26
2-3-2 導電度(Electrical Conductivity) 26
2-4磁場理論 28
2-4-1 右手開掌定則 28
2-4-2 勞倫茲力(Lorentz’s force) 28
第三章實驗設備與材料 31
3-1 實驗簡介 31
3-2 實驗設備 32
3-2-1 電化學加工機 32
3-2-2 去離子水系統 34
3-2-3 電子天平 35
3-2-4 電磁式加熱攪拌器 36
3-2-5 線切割放電加工機 36
3-2-6 超音波主軸與發振器 37
3-2-7 超音波振幅量刀器 37
3-2-8 直流脈衝電源供應器 38
3-2-9 示波器 38
3-2-10 超音波洗淨機 39
3-2-11 顯微影像量測系統 39
3-2-12 立體電子顯微鏡 40
3-2-13 磁通密度計 40
3-2-14 精密試片切割機 41
3-2-15 金相研磨拋光機 41
3-2-16 掃描式電子顯微鏡(Scanning Electron Microscope，SEM) 42
3-3 實驗材料 43
3-3-1 不鏽鋼試片 43
3-3-2 一體式陣列刀具電極 44
3-3-3 釹鐵硼磁鐵 45
3-3-4 電解液 46
3-4 實驗流程與方法 47
3-4-1 電解液調配 48
3-4-2 試片準備 48
3-4-3 刀具電極製作 48
3-4-4 超音波振幅量測 49
3-4-5 磁通密度量測 50
3-4-6 實驗架設參數設定 51
3-4-7 實驗結果量測與觀察 52
3-4-7-1 微孔量測 52
3-4-7-2 平均對角線長(Average Diagonal Length) 53
3-4-7-3對角線長全距(Diagonal Length Range) 53
3-4-7-4幾何特徵觀察 54
第四章結果與討論 56
4-1 CFD加工區域流場方向分析 56
4-2 傳統遮罩式電化學加工微孔陣列之結果 58
4-3 不同輔助加工(超音波、磁場、超音波與磁場複合)對遮罩式電化學加工微孔陣列之影響 60
4-4直接側面噴流及後方兩側補充電解液對遮罩式電化學加工微孔陣列之影響 64
4-5 超音波功率等級對遮罩式電化學加工微孔陣列之影響 68
4-6 工作電壓對遮罩式電化學加工微孔陣列之影響 75
4-7 脈衝休止時間對遮罩式電化學加工微孔陣列之影響 82
4-8 刀具電極進給速率對遮罩式電化學加工微孔陣列之影響 88
第五章結論 94
未來展望 96
參考文獻 97

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指導教授

崔海平(Hai-Ping Tsui)

審核日期

2022-1-21

推文