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姓名	賴昱沅(Yu-Yuan Lai)  查詢紙本館藏	畢業系所	化學工程與材料工程學系
論文名稱	應用於低溫電子構裝製程之錫鉍/錫銀銅複合銲料
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檔案	[Endnote RIS 格式]    [Bibtex 格式]    [相關文章]   [文章引用]   [完整記錄]   [館藏目錄]   至系統瀏覽論文 (2027-7-31以後開放)
摘要(中)	近年來隨著三維構裝興起，低溫製程能有效地減緩基板翹曲，提升系統長期可靠度。Sn-58Bi 銲料具有良好地濕潤性、抗潛變能力以及139℃的低熔點溫度，對於先進電子構裝來說非常具有吸引力。文獻指出Sn-58Bi 於長時間熱時效處理後，將會生成一連續脆性富Bi 層於基板處界金屬化合物上方，介金屬化合物與基板間有孔洞生成，大幅降低銲料機械性質。本研究透過加入SAC0307 於Sn-56.8Bi-1Ag-0.2Cu 下方形成一複合結構，觀察複合銲料於熱時效處理後微結構變化與機械性質改變。由剛迴焊完橫截面結果發現，SAC0307 層的添加有效降低整體銲料富Bi 區域。由SnBiAgCu/SAC 彼此間液相/固相動力學分析結果確認了Sn 溶解速率隨迴焊溫度提升而加快。經由熱效處理後，於下層SAC 區域發現大量細小Bi 顆粒析出於其中，並於後續機械性質探討中，對複合銲料推力值與破斷模式隨老化溫度提升和老化時長拉長而改變進行一系列探討。
摘要(英)	Low-temperature bonding approach has become an inevitable trend in advanced electronics packaging technology. Low reflow temperature process can enhance the reliability of devices by minimizing warpage. SnBi eutectic solder is considered as one of the best candidates due to the advantages of good wettability, creep resistance and low melting point. A continuous Bi-rich layer formed between solder matrix and Cu6Sn5 layer after aging significantly decreases the strength of solder joint. In this study, a SAC layer was added between SnBiAgCu and Cu substrate to create a composite structure. The addition of SAC layer reduces the ratio of Bi-rich phases in the SnBiAgCu matrix. Small Bi precipitates are distributed uniformly in the SAC layer after long-term aging. Cross-section images are examined to analyze the kinetics of phase transformation. Shear test and fracture surface are adopted to analyze the joint strength and failure mode. The results show that the mechanical properties of the solder joint are improved by the composite structure of the solder.
關鍵字(中)	★ 無鉛銲料 ★ 錫鉍 ★ 錫銀銅 ★ 低溫構裝	關鍵字(英)
論文目次	中文摘要 i Abstract ii 致謝 iii 目錄 v 圖目錄 vii 表目錄 xiii 第一章 緒論 1 1-1 前言 1 1-2 半導體製程與構裝層級 2 1-3 電子構裝技術 4 1-3-1 表面黏著技術 (Surface Mount Technology) 5 1-3-2 通孔插裝技術 (Pin-through-Hole Technology) 6 1-3-3 覆晶構裝技術 (Flip Chip Technology) 7 1-3-4 三維積體電路構裝技術 (Three-dimensional Integrated Circuits) 8 1-4 翹曲現象 10 第二章 文獻回顧 12 2-1 電子構裝材料簡介 12 2-2 錫鉍 (Sn-Bi) 銲料 13 2-2-1 錫鉍添加第三相元素 19 2-3 錫銀銅 (Sn-Ag-Cu) 銲料 25 2-3-1 錫銀銅添加Bi元素 (Sn-Ag-Cu-xBi) 28 2-4 研究動機 33 第三章 實驗方法 34 3-1 銲料與樣品製備 34 3-2 試片長時間熱時效處理 36 3-2-1 真空封管技術 36 3-2-2 固相擴散反應 37 3-3 液相/固相交互反應 37 3-4 試片分析 39 3-4-1 掃描式電子顯微鏡 (Scanning Electron Microscope, SEM) 39 3-4-2 能量散射光譜 (Energy Dispersive Spectrometer, EDS) 39 3-5 推力測試 40 第四章 結果與討論 42 4-1 SnBiAgCu/SAC0307複合銲料微結構樣貌 42 4-2 SnBiAgCu/SAC0307液相/固相反應動力學探討 46 4-3 SnBiAgCu/SAC0307 固相/固相交互擴散反應 51 4-3-1 SnBiAgCu/SAC0307 錫帽熱時效微結構樣貌 51 4-3-2 SnBiAgCu/SAC0307熱時效處理後推力值探討 53 4-3-3 SnBiAgCu/SAC0307 熱時效處理後破斷模式探討 73 第五章 結論 86 參考文獻 89
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指導教授	吳子嘉(Albert T Wu)	審核日期	2022-9-22
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