摘要(英) |
In recent years, electronic communication products have gradually become an indispensable part of life. With the improvement of transmission rate and distance, electronic products are developing towards miniaturization and multi-functionality. The accompanying high temperature has become the main problem of electronic communication products. Under long-term operation in a high temperature environment, electronic products are prone to problems such as failure of electronic components, material aging, and internal solder joints falling off. In addition, the development cycle of electronic products is short. In the past, product design was carried out through experience and testing methods, which cost a lot of money and time.Therefore, it is necessary to quickly solve the thermal problem of electronic communication products through systematic design.
In this study, the computational fluid dynamics method is used to simulate the heat transfer phenomenon of fiber optical transceiver using the Flotherm simulation software.The main heat dissipation path of fifer optical transceiver is: Integrated Circuit Thermal Pad Quad Small Form-factor Pluggable Heat sink. The Taguchi method is used for the design of this heat dissipation path, and the temperature is regarded as the quality characteristic.We consider the following control factors, which are the material of thermal pad(A), the material of heat sink(B), the contact thermal resistance between the integrated circuit and thermal pad(C), the contact thermal resistance between the thermal pad and quad small form-factor pluggable(D), the contact thermal resistance between the quad small form-factor pluggable and cage(E), the contact thermal resistance between the quad small form-factor pluggable and heat sink(F), the contact thermal resistance between the cage and heat sink(G). The top three of the importance of thermal design to temperature are: D control factor, C control factor and F control factor. The best factor level combination of Taguchi method is A3B3C1D1E1F1G2, the number is the level of each control factor. After statistical verification, the best factor level is A3B3C1D1E1F1G1. The reason is that the G control factor is not the main heat dissipation path, and its importance to temperature is very low, and in the analysis of Taguchi method, the G control factor is manipulated by the F control factor, so it gives the wrong optimal solution. When thermal problems occur in fiber optical transceiver, the results of this paper can be a reference, providing a fast and effective solution. |
參考文獻 |
1. Lukasik, S. (2010). Why the Arpanet was built. IEEE Annals of the History of Computing, 33(3), 4-21.
2. Postel, J. (1981). NCP/TCP transition plan (No. rfc801).
3. Cerf, V., & Kahn, R. (1974). A protocol for packet network intercommunication. IEEE Transactions on communications, 22(5), 637-648.
4. Berners-Lee, T., Cailliau, R., Luotonen, A., Nielsen, H. F., & Secret, A. (1994). The world-wide web. Communications of the ACM, 37(8), 76-82.
5. Haken, H. (1970). Laser theory. In Light and Matter Ic/Licht und Materie Ic (pp. 1-304). Springer, Berlin, Heidelberg.
6. Chow, W. W., Koch, S. W., & Sargent, M. I. (2012). Semiconductor-laser physics. Springer Science & Business Media.
7. Peng, Z., Guiming, H., & Liwu, Z. (2003, December). 1000Base-T SFP. In Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) (pp. 401-404). IEEE.
8. Kim, D., Shim, J., Keh, Y. C., & Park, M. (2006). Design and fabrication of a transmitter optical subassembly (TOSA) in 10-Gb/s small-form-factor pluggable (XFP) transceiver. IEEE Journal of selected topics in quantum electronics, 12(4), 776-782.
9. Romero, A., & Kipp, S. (2012, May). Cooling 8× 100GbE switch blades with high power optical modules. In 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (pp. 1327-1333). IEEE.
10. Tang, G., Li, C., Zhang, X., & Rhee, D. M. (2015, December). Thermal management solutions and design guidelines for silicon based photonic integrated modules. In 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (pp. 1-6). IEEE.
11. Mack, B., Engineer, S. T., & Graham, T. (2018). Thermal Interface for Pluggable Optics
Modules. Engineering Edge Vol. 7 Iss
12. Baris , D. , Giovanni, G., Mark, N., Ray, N., Anderson, T. ,Attila, A., Jeffery, M., Hasan, A., Chris, K., Vivek, S., Scott, S., Fadi, D., Hani D., Burrell B., Newman, C.,(2021, January) Optimizing QSFP-DD Systems to Achieve at Least 25 Watt Thermal Port Performance
13. Chiang, K. T. (2005). Optimization of the design parameters of Parallel-Plain Fin heat sink module cooling phenomenon based on the Taguchi method. International communications in heat and mass transfer, 32(9), 1193-1201.
14. Huang, D. S., Lin, M. T., Liao, Y. S., Hsu, F. C., Wang, Y. T., & Kuo, F. J. (2014, April). Evaluating heat dissipation in edge-lit LED backlight module using Taguchi method. In 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (pp. 1-5). IEEE.
15. Huang, D. S., Tu, W. B., Zhang, X. M., Tsai, L. T., Wu, T. Y., & Lin, M. T. (2016). Using Taguchi method to obtain the optimal design of heat dissipation mechanism for electronic component packaging. Microelectronics Reliability, 65, 131-141.
16. https://en.wikipedia.org/wiki/Small_form-factor_pluggable_transceiver
17. Mack, B., & Graham, T. (2016, March). Thermal specifications for pluggable optics modules. In 2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) (pp. 133-142). IEEE.
18. Bar-Cohen, A., Iyengar, M., & Kraus, A. D. (2003). Design of optimum plate-fin natural convective heat sinks. J. Electron. Packag., 125(2), 208-216.
19. D. Agonafer, L. Gan-Li and D.B. Spalding. “The LVEL Turbulence Model for
Conjugate Heat Transfer at Low Reynolds Numbers”. EEP-Vol. 18, Application of CAE/
CAD Electronic Systems. ASME 1996.
20. Parker Chomerics. Thermal Interface Materials For Electronics Cooling.
21. Karna, S. K., & Sahai, R. (2012). An overview on Taguchi method. International journal of engineering and mathematical sciences, 1(1), 1-7.
22. https://www.efd.com.tw/simcenter-flotherm.html |