超音波振動輔助啄鑽式藍寶石微孔加工之研究

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姓名

邱品翰(Pin-Han Chiu) 查詢紙本館藏

畢業系所

機械工程學系

論文名稱

超音波振動輔助啄鑽式藍寶石微孔加工之研究
(A Study on Ultrasonic Vibration Assisted Micro-hole Pecking Drilling of Sapphire)

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至系統瀏覽論文 (2024-8-25以後開放)

摘要(中)

藍寶石係屬高硬脆材料，於進行微孔鑽削加工時，刀具的磨損大且加工後的孔周圍會產生大面積脆性破裂，必須加以克服。本研究是利用超音波振動輔助啄鑽加工方式針對藍寶石材料進行微孔加工之研究，探討各種加工方式與參數如進給速度、啄鑽量、超音波功率與主軸轉速對加工品質特性的影響，加工品質特性包括有微孔入出口之破片面積值、刀具切削刃變化量與實際微孔直徑，並利用光學顯微影像量測儀（OM）、雷射共軛焦掃描顯微鏡（LSCM¬）及掃描式電子顯微鏡（SEM）觀察藍寶石在鑽削後加工微孔的直徑、破片面積值與微孔周圍的破裂形貌。
實驗結果顯示，超音波振動輔助啄鑽加工可排除藍寶石材料於加工過程中切屑和加工產生的廢熱，可有效減少加工中的切削力及加工溫度，降低刀具磨耗，進而延長刀具壽命，而根據實驗結果在進給速度0.15 mm/min、啄鑽量15 μm、超音波功率等級Level 2 (Amplitude：0.23 μm)以及主軸轉速10000rpm時，可得到較佳的入口破片面積1877.852 μm²以及較佳的出口破片面積2505.519 μm²，相較於傳統鑽削方式，入口破片面積值減少了344.53%，而出口破片值減少952.04%，且平均孔徑入出口差異值及切削刃圓角變化量較小，提高了刀具壽命。

摘要(英)

Sapphire is a high hard-brittle material. During micro-hole drilling, the tool wear is enormous, and a large area of brittle fracture will occur around the machined hole. To overcome these problems, this research adopted ultrasonic vibration-assisted pecking drilling of the micro-holes on sapphire. The influence of various processing methods and parameters, such as the feed rate, pecking depth, ultrasonic power, and spindle speed, on the machining qualitaty characteristics were discussed. Machining quality characteristics include the value of the chipping area at the inlet and outlet of the micro-hole, the variation of arc radius of the cutting edge, and the average diameter of micro-hole. Optical microscopy (OM), laser scanning confocal microscopy (LSCM), and scanning electron microscopy (SEM) were used to observe the diameter of the micro-hole, the value of the chipping area, and the fracture morphology of micro-holes in sapphire after drilling.
The experimental results indicate that ultrasonic vibration-assisted pecking drilling could remove waste heat from chipping and machining of sapphire material during machining, which can effectively reduce the cutting force and processing temperature during machining, minimizing tool wear, and therefore, extending tool life. According to the experimental results, a better inlet chipping area of 1877.852 μm² and a better outlet chipping area of 2505.519 μm² were obtained under the feed rate of 0.15 mm/ min, pecking depth of 15 μm, ultrasonic power level of 2 (amplitude: 0.23 μm), and spindle speed of 10000 rpm. Compared with the traditional drilling method, the value of the inlet chipping area was reduced by 344.53%, the value of the outlet chipping area was reduced by 952.04%, and the difference value between the inlet and outlet of the average hole diameter and the change of the cutting edge fillet was smaller, which improves the tool life.

關鍵字(中)

★ 藍寶石
★ 超音波振動輔助
★ 啄鑽加工
★ 鑽削

關鍵字(英)

★ sapphire
★ ultrasonic vibration assist
★ pecking drilling
★ drilling

論文目次

摘要 ii
ABSTRACT iii
誌謝 v
目錄 vi
圖目錄 viii
表目錄 xi
第一章緒論 1
1-1 研究背景 1
1-2 研究動機及目的 2
1-3 文獻回顧 4
1-3-1 脆性材料加工特性 4
1-3-2 鑽削加工 4
1-3-3 超音波振動輔助加工 5
1-3-4 深孔啄鑽加工法 8
1-4 論文架構 9
第二章實驗基礎原理 10
2-1 切削加工原理 10
2-1-1 鑽削加工理論 10
2-1-2 啄鑽加工理論 12
2-2 超音波振動輔助原理 13
2-2-1 超音波加工的分類 13
2-3超音波振動輔助鑽削加工原理 15
2-4脆性材料的延性移除與脆性移除關係轉變 16
2-4-1 脆性材料裂紋形成機制 16
2-4-2 高靜壓力下脆性轉變延性 17
2-4-3 臨界切削深度中延性切削轉變脆性切削模式 17
第三章實驗設備與材料 18
3-1 實驗簡介 18
3-2 實驗設備 19
3-3 實驗材料 27
3-4 實驗流程與方法 29
第四章結果與討論 34
4-1 不同的輔助方法對於藍寶石加工之影響 34
4-2 不同的進給速度對於藍寶石材料加工之影響 43
4-3 不同的啄鑽量對於藍寶石材料加工之影響 51
4-4 不同的超音波功率對於藍寶石材料加工之影響 58
4-5 不同的主軸轉速對於藍寶石材料加工之影響 66
4-6 藍寶石加工破裂型態分析 74
4-7 鑽石披覆螺旋鑽針磨耗觀察 78
第五章結論 79
未來展望 82
參考文獻 83

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指導教授

崔海平(Hai-Ping Tsui)

審核日期

2022-9-7

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