摘要(英) |
Quartz possesses desirable properties such as piezoelectricity, insulation, transparency, high hardness, and thermal stability. These characteristics make it suitable for frequency control components, and quartz crystals exhibit various oscillation modes depending on the cut angle. Among them, AT-cut quartz demonstrates minimal frequency variation with temperature changes, providing precise frequency control. Consequently, AT-cut quartz has become the primary choice for frequency control devices.
In the era of the Internet of Things (IoT) and the rapid development of the 5G industry, electronic products are designed to be compact, lightweight, and feature-rich. Quartz frequency control components play a crucial role in communication devices, automotive applications, and various electronic products by providing stable frequency and clock control.
However, the traditional mechanical manufacturing processes are no longer sufficient to meet the design requirements for miniaturization. To address this challenge, Seiko Epson in Japan pioneered the concept of Quartz with Micro Electro Mechanical Systems (QMEMS) by integrating semiconductor fabrication techniques into the quartz industry. This approach enables the creation of special structures in quartz crystals that meet the market demands for high frequency and miniaturization.
Despite leveraging the experience gained from semiconductor wafer processing, applying semiconductor wafer-level processes to quartz frequency control component fabrication still requires substantial research efforts to overcome existing challenges.
ii
This study aims to apply the Inductively Coupled Plasma-Reactive Ion Etching (ICP-RIE) system to perform dry etching processes on AT-cut quartz wafers. The process can be divided into four stages. Firstly, under fixed process parameters, the composition ratios of two etching gases will be varied to identify the gas combination that yields the highest etching rate. Subsequently, within the stable process range of the equipment, an orthogonal array experiment using the Taguchi method will be conducted to analyze the impact of each parameter on the etching response. The effects of each factor will then be validated through a full-factorial experiment. Finally, machine learning techniques will be utilized to optimize the process parameters, aiming to achieve high etching rates and vertical sidewall structures. |
參考文獻 |
[1] A. M. Nicholson, “Generating and transmitting electric currents”. USA 專利: 2212845, 10 4 1918.
[2] K. L. Lueth, “State of the IoT 2020: 12 billion IoT connections, surpassing non-IoT for the first time,” IoT Analytics, 編號 12, 2020.
[3] 陳梅鈴, “眺望 2020 系列|5G 大頻寬:全球 5G 電信與垂直應用 發展趨勢,” IEK 產業情報網 , 24 10 2019.
[4] EPSON, “Epson crystal device TopInformationQ-MEMS,” EPSON, 2010. [線上]. Available: https://www5.epsondevice.com/en/information/technical_info/qmems/.
[5] TXC 台灣晶技, “產品製程,” TXC 台灣晶技, [線上]. Available: http://www.txccorp.com/index_tw.php?action=c_technology_1&cid=4.
[6] 希華晶體科技, “石英元件的起點,從人工水晶的生長開始,” 希華 晶體科技, [線上]. Available: https://www.siward.com.tw/cn/support/coability/%E4%BA%BA%E5% B7%A5%E6%B0%B4%E6%99%B6.
[7] 津綻石英科技股份有限公司, “石英震盪器原理,” 津綻石英科技股 份有限公司, 2011. [線上]. Available: https://www.nsk.com.tw/quality_tw_4.php.
[8] 岡野庄太郎, 頻率控制石英水晶製品, 1998.
[9] R. D. Mindlin, ““Thickness-Shear and Flexural Vibrations of Crystal
Plates”,” Journal of Applied Physics , pp. 316-323, 1951.
[10] 蕭宏, 半導體製程技術導論, 全華圖書 , 2014.
[11] Yu-Hsiang Tang ; Yu-Hsin Lin ; Ming-Hua Shiao ; Chih-Sheng Yu , “Development of thin quartz glass utilising through-glass-via (TGV) formation by dry etching technology,” IEEE-NEMS , 10 2016.
[12] Yu-Hsiang Tang, Mao-Jung Huang, Yu-Hsin Lin, Ming-Hua Shiao, “Micro Fabrication on Quartz Glass by Inductively,” 科儀新知, 4 2013.
[13] A. B. M. K. Alam, “Etching Process Development of SiO2 Etching Using Inductively,” Department of Physics and Mathematics University of Eastern Finland, 2015.
[14] A. A. Osipova ; S. E. Aleksandrova ; A. A. Osipovb, and V. I. Berezenkoc, “Development of Process for Fast Plasma-Chemical Through Etching of Single-Crystal Quartz in SF6/O2 Gas Mixture,” INORGANIC SYNTHESIS AND INDUSTRIAL, 23 3 2018.
[15] Artem A. Osipov,Gleb A. Iankevich,Sergey E. Alexandrov, “Monocrystalline Quartz ICP Etching: Road to High-Temperature Dry Etching,” Plasma Chemistry & Plasma Processing, 1 2020.
[16] Gigalane, “ICP Etch system,Seniconductor Equipment Manufacturing,Products,” Gigalane, 2018. [線上]. Available: http://www.gigalane.com/cn/product_sem01_06.html.
[17] Keyence, “Keyence VK-X3000,” Keyence, 2023. [線上]. Available: https://www.keyence.com.tw/products/microscope/laser-microscope/vk- x3000/index_pr.jsp.
[18] 閎康科技, “SU8220,材料分析,SEM,” 閎康科技, 2020. [線上]. Available: https://www.matek.com/zh-TW/services/index/SEM.
[19] 李輝煌, 田口方法: 品質設計的原理與實務, 高立圖書有限公司, 2011.
[20] H.-T. LIN, LEARNING FROM DATA, 全華圖書 , 2012.
[21] M. Stone, “Cross-Validatory Choice and Assessment of Statistical Predictions,” Journal of the Royal Statistical Society. Series B (Methodological), pp. 111-147 , 1974.
[22] Kennedy, J. and Eberhart, R., “ELMAN Neural Network with Modified Grey Wolf Optimizer for Enhanced Wind Speed Forecasting,” 於 IEEE International Conference on Neural Networks, 1995.
[23] 徐國瑞, “DeltaMOOCx 課程,” 台達電子文教基金會, 2021. [線上]. Available: https://www.delta-foundation.org.tw/project/17.
[24] 陳威宇, “以粒子群演算法求解流線型製造單元排程,” 2011.
[25] K. Nojiri, Dry Etching Technology for Semiconductors, Springer, 2015. |