磁場輔助電化學放電加工藍寶石基板之研究

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姓名

李宗陽(Tsung-Yang Lee) 查詢紙本館藏

畢業系所

機械工程學系

論文名稱

磁場輔助電化學放電加工藍寶石基板之研究
(Sapphire Substrate Machining by using Electrochemical Discharge Machining with Magnetic Field Assisting)

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至系統瀏覽論文 (2025-8-1以後開放)

摘要(中)

藍寶石基板具有特殊機械性質如硬脆特性等，特別是於精微加工上，若以傳統之機械加工方法對其加工將非常困難，本研究目的為發展電化學放電加工藍寶石基板數十微米級的微孔加工之技術，採用直徑40 μm之碳化鎢圓柱形工具電極及磁場輔助方式進行，並進行一系列加工之實驗，希望能獲得較佳品質之數十微米級的微孔。本研究係藉由磁場輔助方式進行電化學放電藍寶石基板微孔加工單因子實驗分析，並探討各個加工參數如工作電壓、進給速率、脈衝週期、衝擊係數以及主軸轉速等對於藍寶石基板微孔加工之品質特性影響，加工品質特性包含微孔的入、出口孔徑及工具電極損耗情形。
電化學放電應用於數十微米級的微孔加工時，由於工具電極與工件間之加工間隙相當小，不利於電解液流入電極前端之加工區域，導致加工區域內電解液不足而無法形成絕緣氣膜，造成電極前端撞擊加工工件而斷裂，無法進行藍寶石基板電化學放電微孔加工，因此本研究採用磁場輔助電化學放電加工進行藍寶石基板微孔加工之研究，實驗結果顯示利用磁場輔助方式加工，透過磁場所產生之勞倫茲力作用，可以促進電解液流動循環及工具電極表面之絕緣氣膜薄化，從而改善數十微米級寶石電化學放電微孔加工能力與加工品質，並能夠成功完成厚度50 µm藍寶石基板之通孔加工，於工作電壓43 V、進給速率1/8 µm/sec、脈衝週期20 µs、衝擊係數30 %及主軸轉速100 rpm之最佳加工參數組合下，可獲得微孔入口平均孔徑為 78 μm，以及微孔出口平均孔徑為 41 μm之較佳微孔孔徑。

摘要(英)

Sapphire substrates possess unique mechanical properties, including hardness and brittleness, and therefore, they are particularly challenging to process using conventional mechanical machining methods, especially in terms of microfabrication. In the current study, a microhole fabrication technique involving electrochemical discharge machining (ECDM) was developed to enable fabrication of sapphire substrates at tens of microns scale. A cylindrical tool electrode made of tungsten carbide with a diameter of 40 μm was used, and magnetic field assistance was implemented. A series of experiments were then conducted to identify a means of improving the quality of the tens of microns scale microhole fabrication. This study conducted a single-factor experimental analysis of the effectiveness of using ECDM with magnetic field assistance to fabricate microholes on sapphire substrates. The influences of several machining parameters, including voltage, feed rate, duration time, duty factor, and rotational speed, on the quality characteristics of the microhole fabrication on sapphire substrates were investigated. The quality characteristics included the inlet and outlet diameters of the microholes and the wear of the tool electrode.
Generally, when ECDM is used to fabricate microholes at the tens of microns scale, the small gap between the tool electrode and workpiece is bad for the flow of electrolytes into the machining area near the electrode tip. This insufficient electrolyte flow prevents the formation of an insulating gas film, resulting in collisions between the electrode tip and the workpiece, which in turn leads to fractures and renders the ECDM of microholes on sapphire substrates infeasible. Therefore, in the current study, magnetic-field-assisted ECDM was used to fabricate microholes on sapphire substrates. According to the experimental results, when magnetic field assistance was used, the generated Lorentz force promoted electrolyte circulation and facilitated thinning of the insulating gas film on the surface of the tool electrode. Consequently, the capability and quality of ECDM for microhole fabrication on sapphire substrates at the tens of microns scale were improved. Through holes were successfully fabricated on sapphire substrates with a thickness of 50 µm. When the optimal combination of machining parameters was used, including a voltage of 43 V, feed rate of 1/8 µm/sec, duration time of 20 µs, duty factor of 30%, and a rotational speed of 100 rpm, microholes with average inlet and outlet hole diameters of 78 and 41 μm, respectively, were fabricated.

關鍵字(中)

★ 電化學放電加工
★ 藍寶石基板
★ 磁場輔助
★ 微孔加工

關鍵字(英)

★ electrochemical discharge machining
★ sapphire substrate
★ magnetic field assistance
★ microhole fabrication

論文目次

摘要 i
ABSTRACT ii
致謝 iv
目錄 v
圖目錄 viii
表目錄 xii
第一章緒論 1
1-1 研究背景 1
1-2 研究動機及目的 3
1-3文獻回顧 5
1-4 論文之架構 12
第二章實驗基礎理論 13
2-1 電化學放電加工的基礎理論[42] 13
2-2 電化學放電加工之放電火花產生機制[43] 15
2-3 電化學放電加工之材料移除機制 18
2-4 磁場理論 20
第三章實驗設備與材料 23
3-1 實驗方法 23
3-2 實驗設備 28
3-2-1電化學放電微孔加工設備 28
3-2-2電子天平 29
3-2-3去離子水系統 30
3-2-4電磁加熱攪拌器 31
3-2-5磁通密度儀 32
3-2-6車床 32
3-2-7可程式直流電源供應器 33
3-2-8直接數位合成函數波信號產生器 34
3-2-9金屬氧化物半導體場效電晶體 34
3-2-10斜向式顯微鏡 35
3-2-11示波器 35
3-2-12電流探棒 36
3-2-13超音波洗淨機 36
3-2-14光學顯微影像量測儀 37
3-2-15實體顯微鏡 37
3-2-16雷射共軛焦兼白光干涉儀 38
3-2-17自動濺射鍍膜機 38
3-2-18高解析熱電子型場發射掃描式電子顯微鏡 39
3-3 實驗材料 40
3-3-1藍寶石基板 40
3-3-2圓柱形工具電極 41
3-3-3輔助電極 42
3-3-4釹鐵硼磁鐵 43
3-3-5電解液 44
3-4 實驗流程與方法 45
3-4-1實驗試片製作 45
3-4-2電解液製備流程 46
3-4-3磁通密度量測 47
3-4-4實驗架設參數設定 47
3-4-5微孔孔徑之量測方式[47] 48
第四章結果與討論 50
4-1 有、無磁場輔助方式之加工比較 50
4-2 不同參數下對電化學放電微孔加工之影響 54
4-2-1 不同工作電壓對電化學放電微孔加工之影響 56
4-2-2 不同進給速率對電化學放電微孔加工之影響 64
4-2-3 不同脈衝週期對電化學放電微孔加工之影響 74
4-2-4 不同衝擊係數對電化學放電微孔加工之影響 82
4-2-5 不同主軸轉速對電化學放電微孔加工之影響 91
第五章結論 99
未來展望 102
參考文獻 103

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指導教授

崔海平(Hai-Ping Tsui)

審核日期

2023-7-27

推文