微米元件之雷射焊料轉印與焊接雛型平台開發與測試

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姓名

顏啟安(Chi-An Yen) 查詢紙本館藏

畢業系所

機械工程學系

論文名稱

微米元件之雷射焊料轉印與焊接雛型平台開發與測試
(Development of Solder Paste Transferring and Laser Bonding Prototype for Micron-scale Components)

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摘要(中)

隨著顯示器技術的演進，較高階的顯示器逐漸採用微型發光二極體(MiniLEDs 與 Micro LEDs)，以直接發光的方式呈現影像和文字，提高對比度和更寬廣的視角，但在製程中也面臨一些挑戰，致使製造成本仍居高不下，挑戰之一來自直接於顯示面板焊合尺寸較小、排列緊密的 Mini LED 和 Micro LED。目前市面上有兩種主要的焊接技術：回焊爐與熱壓焊接技術。這兩種製程的限制是元件與電路載板須有較高的耐熱度，同時要面臨焊接時間冗長、晶片載板因熱膨脹率不同易導致尺寸失準、翹曲和持溫過程的高能耗等問題，造成良率下降和設備製造成本也居高不下，並且在焊接過程中的能耗和廢熱排放很大，難以實現淨零碳排的 ESG 永續目標。本研究以雷射轉印之方式將錫膏進行高精度之定量轉印，以解決傳統網印塗佈方法無法轉印尺寸過小錫膏的問題。藉由自行設計之機構，發揮雷射高度圖案化優勢，以達定量錫膏焊料轉印之目的。

摘要(英)

As display technology evolves, higher-end displays are gradually adopting Mini LEDs and Micro LEDs to directly emit light for images and text presentation. This approach enhances contrast and widens viewing angles. However, the manufacturing process faces challenges that keep production costs elevated. One challenge arises from the small and densely arranged sizes of Mini LEDs and Micro LEDs directly soldered onto the display panel. Currently, there are two main soldering techniques on the market: reflow soldering and thermal compression bonding. Both processes require LED devices and circuit boards with high-temperature resistance. They also suffer from issues such as extended soldering times, potential misalignment due to differing coefficients of thermal expansion between chip and board, warping, and high energy consumption during temperature holding. These factors lead to decreased yield rates and elevated equipment manufacturing costs. Moreover, substantial energy consumption and waste heat discharge during the soldering process hinder the achievement of net-zero carbon emissions in ESG sustainability goals. This study employs laser-assisted transfer to quantitatively transfer solder paste with high precision, addressing the challenge of transferring small-sized solder paste that conventional screen printing methods struggle with. Through self-designed equipment, the advantages of laser patterning are utilized to achieve the quantitative transfer of solder paste for soldering. The research explores three different solder paste transfer techniques. Subsequently, localized heating is applied to the components and substrates to accurately control heating time and area. By melting and solidifying the solder paste, the original LED devices are bonded to the circuit board, and the merits and drawbacks of the methods are discussed and compared. This study aims to minimize damage to both the devices and circuit boards caused by traditional soldering, reduce the energy and time costs associated with conventional soldering, and enhance the quality and efficiency of LED solder bonding.

關鍵字(中)

★ 雷射焊接
★ 雷射錫膏轉印
★ 微米元件焊接

關鍵字(英)

★ Laser bonding
★ Laser induce-forward transfer
★ Bonding of microscale components

論文目次

摘要 i
Abstract ii
致謝 iv
圖目錄 viii
表目錄 xi
第一章緒論 1
1-1. 研究動機與目的 1
1-1-1. 雷射焊料轉印 2
1-1-2. 雷射焊接 2
1-2. 文獻回顧 4
1-2-1. 傳統焊料佈值方式 4
1-2-2. 傳統SMT技術 4
1-2-3. 雷射之高度選擇性 5
1-2-4. 雷射轉印技術（Laser Induced Forward Transfer，LIFT） 6
1-2-5. 以雷射作為熱源焊接 8
1-2-6. 文獻技術傳承與創新 9
1-3. 文章架構 10
第二章實驗設備 11
2-1. 機台設備與機構 12
2-1-1. 雷射源 12
2-1-2. 雷射高速掃描振鏡 13
2-1-3. 相機 14
2-1-4. 下壓機構 15
2-1-5. 下壓系統電路 15
2-2. 電路板支撐機構 16
2-2-1. 多孔性真空陶瓷吸頭 18
2-2-2. 平行度調整機構 19
2-2-3. 加熱平台溫度校正 20
第三章實驗方法 22
3-1. 實驗機台操作 22
3-1-1. 使用者介面 22
3-1-2. 機台操作流程 23
3-2. 實驗材料製備 25
3-2-1. 錫膏種類 25
3-2-2. LED來源基板 26
3-2-3. 錫膏來源基板 26
3-2-4. 電路板 27
3-3. 雷射轉印錫膏 30
3-3-1. LIFT方法 30
3-3-2. SOB方法 31
3-3-3. SOC方法 31
3-4. 雷射焊接實驗 31
3-4-1. 實驗方法 32
3-4-2. 初步雷射參數挑選 32
第四章實驗結果 34
4-1. 錫膏轉印實驗 34
4-1-1. 雷射光斑大小 34
4-1-2. 平均雷射功率大小 35
4-1-3. LIFT方法 36
4-1-4. SOB方法 37
4-1-5. SOC方法 39
4-2. 雷射焊接實驗 44
4-2-1. 雷射直接加熱電極 44
4-2-2. 雷射加熱電極旁防焊窗 44
4-3. 焊接強度測試 47
4-3-1. 推拉測試機 47
4-3-2. LED與電路板 48
4-3-3. 測試結果 48
4-4. 電性測試 51
4-4-1. 量測方法 51
4-4-2. 量測結果 51
第五章結論與未來展望 53
參考文獻 56

參考文獻

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〔2〕SMT回流焊的溫度曲線(Reflow Profile)解說與注意事項: https://www.researchmfg.com/2010/07/reflow-profile/
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〔4〕K. -S. Choi et al., "Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology," 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, 2019, pp. 197-203, doi: 10.1109/ECTC.2019.00037.
［5］Y. Jung et al., "Development of Next Generation Flip Chip Interconnection Technology Using Homogenized Laser-Assisted Bonding," 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, 2016, pp. 88-94, doi: 10.1109/ECTC.2016.76.
［6］Y. -S. EOM, K. -S. JANG, J. JOO and K. -S. CHOI, "Advanced Interconnection technology with Laser Assisted Bonding Process for PET Substrate," 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), Pisa, Italy, 2019, pp. 1-5, doi: 10.23919/EMPC44848.2019.8951858.
［7］Nomura, Ken-ichi et al. “Fine pattern formation with solder paste using screen printing with stainless steel mesh-cut screen mask.” Journal of Micromechanics and Microengineering 30 (2020): n. pag.
［8］Serra, Pere and Alberto Piqué. “Introduction to Laser‐Induced Transfer and Other Associated Processes.” (2018).
［9］Emre Turkoz,Miguel Morales “Laser-induced forward transfer from healing silver paste films.” (2018).
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指導教授

董必正(Tung, Pi-Cheng)

審核日期

2023-8-17

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