| 摘要(英) |
In recent years, electronic components are developing rapidly, and their efficacy is becoming more and more sophisticated while pursuing the product orientation of shrinking, light, thin, and short. The decrease in mass and volume and the increase in power per unit density bring heat concentration. The accumulated heat causes key components to overheat, failing and damaging the components and affecting the life span. Due to the limitation of heat dissipation space and area, research on high-density thermal energy transport technology has become essential. To ensure the product life cycle and functional stability, mastering the heat transfer path to perform heat flow analysis, with the guideline of designing a practice suitable for research and development, testing, assembly, and production cannot be overlooked. It is also vital to adopt a standard process to build a model and use experimental data to verify the reliability of the model. Based on the model, one can propose a design optimization plan, formulate improvement goals for product functional characteristics and usage scenarios, and expect to improve the overall heat dissipation performance and ease of production.
In this study, the computational fluid dynamics method is used to simulate the conjugate heat transfer using the COMSOL simulation software. The four modules composed of identical casings are the main structure and heat transfer path. The internal core heat source in each module directly contacts and transfers heat to the cold plate from top to bottom through the casing body. The cold plate is filled with pure water as the working fluid for water-cooled internal circulation as a heat dissipation solution. Therefore, the design of the internal flow channel of the cold plate becomes a critical controlling factor that affects the heat source temperature.
The flow field in the cold plate is judged to be turbulent by calculating the Reynolds number. Considering the high-gradient flow field of the viscous boundary layer that cannot be ignored, SST(shear stress transport) model is selected as the turbulent flow model in this study. By refining the grids size and retaining the y plus as small across the boundary, the flow velocity gradient is resolved in the boundary layer. The model is moderately adjusted to maintain the grid quality while improving the numerical convergence. The grid independence test is performed. The temperature of the heat source and the average velocity are adopted as the characteristics of the simulation experiment to shorten the simulation analysis time cost.
In addition, we apply the contact thermal resistance at each interface of the model defined according to the experimental test data. The mesh of each heat source is moderately replaced by the thermal resistance, which saves computational time without reducing the resulting
authenticity, which conforms to the experiment. We use the model as the foundation for optimizing the effectiveness of the cold plate, testing various flow channel designs, and adjusting the flow direction and geometry by analyzing the heat source′s position. In addition, multiple types of vortex generators are tested to generate flow disturbance, which helps the boundary layer mixing effect between heat transfer paths. We study the temperature change of the heat source and discuss the pressure drop and the manufacturing process to evaluate the performance and explore the feasibility of developing advanced configurations. |
| 參考文獻 |
1. T.-Y. Lee, "Design optimization of an integrated liquid-cooled IGBT power module using CFD technique," IEEE Transactions on Components and Packaging Technologies , Vol. 23(1) , 55-60(2000).
2. T. Y. T. Lee, J. Andrews, P. Chow and D. Saums, "Compact liquid cooling system for small,moveable electronic equipment," IEEE Transactions on Components, Hybrids, and Manufacturing Technology , Vol. 15(5), 786-793(1992).
3. V. Aga, "Experimental investigation of the influence of flow structure on compound angled film cooling performance," ETH Zurich, 2009.
4. L. Zhang, S. Balachandar, D. Tafti and F. Najjar, "Heat transfer enhancement mechanisms in inline and staggered parallel-plate fin heat exchanger," International Journal of Heat and Mass Transfer, Vol. 40(10), 2307-2325(1997).
5. J. M. Wu, W. Q. Tao, "Numerical study on laminar convection heat transfer in a rectangular channel with longitudinal vortex generator. Part A: Verification of field synergy principle," International Journal of Heat and Mass Transfer, Vol. 51(5), 1179-1191(2008).
6. D.B. Tuckerman, R. F. W. Pease, "High-performance heat sinking for VLSI," IEEE Electron Device Letters, Vol. 2(5), 126–129(1981).
7. H. C. Chiu, J. H. Jang, H. W. Yeh and M. S. Wu, "The heat transfer characteristics of liquid cooling heatsink containing microchannels," International Journal of Heat and Mass Transfer, Vol. 54(1), 34–42(2011).
8. Y. Peles, A. Koşar, Ali, C. Mishra, C.-J. Kuo and B. Schneider, "Forced convective heat transfer across a pin fin micro heat sink," International Journal of Heat and Mass Transfer, Vol. 48(17), 3615–3627(2005).
9. T. Izci, M. Koz, A. Koşar, "The effect of micro pin-fin shape on thermal and hydraulic performance of micro pin-fin heat sinks," Heat Transfer Engineering, Vol. 36(17), 1447–1457(2015).
10. I. A. Ghani, N. A. C. Sidik, N. Kamaruzaman, "Hydrothermal performance of microchannel heat sink: The effect of channel design," International Journal of Heat and Mass Transfer, Vol. 107, 21-44(2017).
11. H.-C. Chiu, M.-J. Youh, R.-H. Hsieh, J.-H. Jang and B. Kumar, "Numerical investigation on the temperature uniformity of micro-pin-fin heat sinks with variable density arrangement," Case Studies in Thermal Engineering, Vol. 44, 10285(2023).
12. Z. Brodnianská, S. Kotšmíd, "Heat transfer enhancement in the novel wavy shaped heat exchanger channel with cylindrical vortex generators," Applied Thermal Engineering, Vol. 220, 119720(2023).
13. E. Rasouli, C. Naderi, V. Narayanan, "Pitch and aspect ratio effects on single-phase heat transfer through microscale pin fin heat sinks," International Journal of Heat and Mass Transfer, Vol. 118(C), 416-428(2018).
14. C. S. Sharma, S. Zimmermann, M. K. Tiwari , B. Michel and D. Poulikakos, "Optimal thermal operation of liquid-cooled electronic chips," International J,ournal of Heat and Mass Transfer, Vol. 55(7-8), 1957-1969(2012).
15. C. A. Rubio-Jimenez, S. G. Kandlikar, A. Hernandez-Guerrero, "Numerical analysis of novel micro pin fin heat sink with variable fin density," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. 2(5), 825–833(2012).
16. A. Alkhazaleh, F. Alnaimat, M. Y. E. Selim, B. Mathew, "Liquid cooling of microelectronic chips using MEMS heat sink: Thermohydraulic characteristics of wavy microchannels with pin-fins," International Journal of Thermofluids, Vol. 18, 100313(2023). |
[Endnote RIS 格式]
[相關文章]
[文章引用]
[完整記錄]
[館藏目錄]
[檢視]
plurk
funp
live
udn
HD
myshare
netvibes
friend
youpush
delicious
baidu
Google bookmarks
del.icio.us
hemidemi
facebook
twitter
google
reddit