| 摘要(英) |
As display technology evolves, higher-end displays are gradually adopting Mini LEDs and Micro LEDs to directly emit light for images and text presentation. This approach enhances contrast and widens viewing angles. However, the manufacturing process faces challenges that keep production costs elevated. One challenge arises from the small and densely arranged sizes of Mini LEDs and Micro LEDs directly soldered onto the display panel. Currently, there are two main soldering techniques on the market: reflow soldering and thermal compression bonding. Both processes require LED devices and circuit boards with high-temperature resistance. They also suffer from issues such as extended soldering times, potential misalignment due to differing coefficients of thermal expansion between chip and board, warping, and high energy consumption during temperature holding. These factors lead to decreased yield rates and elevated equipment manufacturing costs. Moreover, substantial energy consumption and waste heat discharge during the soldering process hinder the achievement of net-zero carbon emissions in ESG sustainability goals. This study employs laser-assisted transfer to quantitatively transfer solder paste with high precision, addressing the challenge of transferring small-sized solder paste that conventional screen printing methods struggle with. Through self-designed equipment, the advantages of laser patterning are utilized to achieve the quantitative transfer of solder paste for soldering. The research explores three different solder paste transfer techniques. Subsequently, localized heating is applied to the components and substrates to accurately control heating time and area. By melting and solidifying the solder paste, the original LED devices are bonded to the circuit board, and the merits and drawbacks of the methods are discussed and compared. This study aims to minimize damage to both the devices and circuit boards caused by traditional soldering, reduce the energy and time costs associated with conventional soldering, and enhance the quality and efficiency of LED solder bonding. |
| 參考文獻 |
〔1〕TrendForce：預期2023年歐美車廠Ford、Jeep車廠擴大應用，Mini LED車用背光顯示器出貨量約45萬片https://www.trendforce.com.tw/presscenter/news/20221220-11504.htmlManufacturing, Extended Abstracts of ISSM, pp. 143-146, June 1994
〔2〕SMT回流焊的溫度曲線(Reflow Profile)解說與注意事項: https://www.researchmfg.com/2010/07/reflow-profile/
〔3〕K. Seyama, S. Wada, Y. Eguchi, T. Nakamura, D. Day and S. Sugawa, "Design and Application of Innovative Multi-table and Bond Head Drive System on Thermal Compression Bonder with UPH Over 2000," 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, 2018, pp. 392-400
〔4〕K. -S. Choi et al., "Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology," 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, 2019, pp. 197-203, doi: 10.1109/ECTC.2019.00037.
［5］Y. Jung et al., "Development of Next Generation Flip Chip Interconnection Technology Using Homogenized Laser-Assisted Bonding," 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, 2016, pp. 88-94, doi: 10.1109/ECTC.2016.76.
［6］Y. -S. EOM, K. -S. JANG, J. JOO and K. -S. CHOI, "Advanced Interconnection technology with Laser Assisted Bonding Process for PET Substrate," 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), Pisa, Italy, 2019, pp. 1-5, doi: 10.23919/EMPC44848.2019.8951858.
［7］Nomura, Ken-ichi et al. “Fine pattern formation with solder paste using screen printing with stainless steel mesh-cut screen mask.” Journal of Micromechanics and Microengineering 30 (2020): n. pag.
［8］Serra, Pere and Alberto Piqué. “Introduction to Laser‐Induced Transfer and Other Associated Processes.” (2018).
［9］Emre Turkoz,Miguel Morales “Laser-induced forward transfer from healing silver paste films.” (2018).
［10］Makrygianni, M.; Zacharatos, F.; Andritsos, K.; Theodorakos, I.; Reppas, D.; Oikonomidis, N.; Spandonidis, C.; Zergioti, I. Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components. Materials 2021,14, 3353.
［11］Shan, Y., Zhang, X., Chen, G., & Li, H. (2019). Laser direct printing of solder paste. AIP Advances.
［12］I. -S. Kye et al., "Interconnection Reliability of Mini LEDs for Display Applications,"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, 2022, pp. 1184-1191, doi: 10.1109/ECTC51906.2022.00190. |
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