| 摘要(英) |
The radio frequency front-end module industry is a crucial component of global communication technology. This study applies the economic "Structure-Conduct-Performance" (S-C-P) framework to analyze the market structure, firm behavior, and industry performance of the RF front-end chip industry. It evaluates the evolutionary trends and future prospects of RF front-end chips, offering strategic recommendations and insights.
As communication technology advances from 4G to 5G and even 6G, the demand for and technological innovation in the RF front-end chip industry continue to grow. This industry plays a central role in global communication technology, particularly in applications within smartphones, the Internet of Things, and autonomous vehicles. Global policies such as the U.S. CHIPS Act and China’s "Made in China 2025" initiative actively promote the domestication and technological advancement of RF chips, enhancing the competitiveness of local businesses.
In terms of market structure, the market is dominated by major firms from the United States and Japan. However, emerging technologies like millimeter waves offer new entrants opportunities to penetrate the market. Additionally, material innovations such as gallium nitride and silicon carbide are transforming the performance and application scope of RF chips, paving the way for new market opportunities in the future. RF chip manufacturers need to be aware of significant seasonal fluctuations in market demand, which change with new technologies and product launches.
Mergers and acquisitions are also very active in the RF front-end chip industry, where dominant firms expand their technical capabilities and market coverage through strategic acquisitions. This not only strengthens their market position but also enhances their product competitiveness. By acquiring firms with advanced technologies or market channels, dominant firms quickly increase their market share and enhance their global market competitiveness and leadership. To avoid reliance on the mobile communications market, leading firms are expanding into non-smartphone markets such as automotive, IoT, and low Earth orbit satellites, seeking new growth opportunities and reducing dependence on a single market. However, potential and emerging firms, due to the additional capital required for cross-industry market demands, remain focused on the communication networks of smartphones, computers, or tablets.
Overall, the future prospects of the RF front-end chip industry are promising, yet the industry faces intense market competition and the pressure of technological updates. Firms must continually innovate and adapt to market changes, mastering emerging technologies to maintain their competitive edge. Government policies and cross-industry collaboration will be crucial in driving industry development. |
| 參考文獻 |
中文文獻：
1. 朱紹歆 (2017)，「我國化合物半導體產業迎來5G機遇》，《高科技與產業化》，10，54-56。
2. 吳玲 (2020)，「第三代半導體產業發展與趨勢展望」，《科技導報》，39，20-29。
3. 吳漢生 (2020)，《成熟的手機產業之競爭發展策略研究》，國立清華大學科技管理學院高階經營管理在職專班碩士論文。
4. 林椋 (2022)，《6G通訊技術發展與佈局趨勢》，財團法人國家實驗研究院科技政策研究與資訊中心。
5. 康書政 (2018)，《電子製造服務企業供應鏈管理改善-以射頻元件為例》，國立台北科技大學管理學院EMBA碩士論文。
6. 夏雨楠 (2016)，「先進射頻封裝技術發展面臨的挑戰」，《電子與封裝》，16，1-6。
7. 許智超 (2019)，「GaN材料之射頻功率元件應用與市場發展趨勢」，《光連：光電產業與技術情報》，143，38-49。
8. 詹文浩 (2017)，「手機射頻前端發展狀況及技術分析」，《移動通訊》，7，5-9。
9. 鄭暢 (2015)，《半導體資訊》，中國半導體產業協會分立器件分會。
10. 蕭睿中 (2022)，《高頻元件技術發展趨勢》，工研院產科國際所，。
英文文獻：
1. Atom, O. (2020), A Review of 5G Front-End Systems Package Integration, PREPRINT SEPTEMBER 2020.
2. Balteanu, F. (2023), Circuits for 5G RF front-end modules, Skyworks Solutions Inc., 5260 California Avenue, Irvine, CA 92617, USA.
3. Brown, G. (2016), Exploring 5G New Radio: Use Cases, Capabilities and Timeline, Heaving Reading — Qualcomm, White Paper.
4. Chen, W. C. (2020), 5G mmWAVE Technology Design Challenges and Development Trends, 2020 International Symposium on VLSI Design, Automation and Test (VLSI-DAT).
5. Hindle, P. (2018), 5G Semiconductor Solutions - Infrastructure and Fixed Wireless Access, Qorvo.
6. IMARC Group (2023), RF Front End Module Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028.
7. Kibaroglu, K., M. Sayginer, and G. M. Rebeiz, A 28 GHz transceiver chip for 5G beamforming data links in SiGe BiCMOS, in 2017 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 2017, 74–77.
8. Saha, S. (2023), Radio Frequency (RF) Front End Module Market Outlook, Future Market Inside.
9. Sahu, A. (2019), Advanced Technologies for Next-generation RF Front-end Modules, RF and Microwave Computer-aided Engineering, Volume 29, Issue 6.
10. Schnaufer, D., T. Nguyen, B. Thomas, A. Mariani, P. Cooper, B. Peterson, and P. Warder (2017), 5G RF – 2nd Qorvo Special Edition, e-Book.
11. Shekhar, S., K. J. Vinoy, and G. K. Ananthasuresh (2017), Surface-Micromachined Capacitive RF Switches with Low Actuation Voltage and Steady Contact, Journal Microelectromechanical System, 26, 643–652.
12. Sun, Z., W. Bian, J. Zhao (2022), A Zero Static Power Consumption Bi-stable RF MEMS Switch Based on Inertial Generated Timing Sequence Method, Journal Microsystem Technology, 28, 973–984.
13. Westberg, E. (2019), 5G Infrastructure RF Solutions: Challenges and Opportunities, IEEE Microwave Magazine, 12, 51-58.
網路資訊：
1. 江明晏 (2024)，「iPhone稱霸天下或曇花一現？蘋果市占超車三星關鍵」，《經濟日報》，https://money.udn.com/money/story/5612/7722260。
2. 江泰傑 (2019)，「半導體原料分析：砷化鎵、氮化鎵產業雙星」，《鉅亨網》， https://news.cnyes.com/news/id/4360657。
3. 江泰傑 (2020) ，「解析5G射頻前端發展與趨勢」，《鉅亨網》， https://news.cnyes.com/news/id/4468628。
4. 林妤柔(2021)，「第三代半導體到底紅什麼？4 張圖秒懂 GaN、SiC 這一項關鍵技術」，《科技新報》，https://technews.tw/2021/09/22/wide-band-gap-gan-sic/。
5. 楊日興、涂志豪 (2023)，「終止產能保障協議 唯捷創芯賠聯電1.2億」，《工商時報》https://www.ctee.com.tw/news/20230407700353-430801。
6. 遠見雜誌 (2019) ，「穩懋半導體 砷化鎵晶圓產量世界第一」， https://www.gvm.com.tw/article/68905。
7. 劉潘 (2023)，「2023年全球及中國射頻前端晶片產業現狀及發展趨勢分析，5G通信技術的發展將為市場帶來商機」《華經情報網》， https://www.huaon.com/channel/trend/939784.html。
8. Feng, J. (2022), How are Washington and Beijing Utilizing Industrial Policy to Bolster Domestic Semiconductor Manufacturing, CSIS, https://www.csis.org/blogs/new-perspectives-asia/how-are-washington-and-beijing-utilizing-industrial-policy-bolster
9. Mordor Intelligence (2023), RF Front End Module Industry Size & Share Analysis - Growth Trends & Forecasts (2024 – 2029), https://www.mordorintelligence.com/industry-reports/rf-front-end-module-market
10. MBA智庫百科， https://wiki.mbalib.com/zh-tw/%E4%BA%A7%E4%B8%9A%E7%BB%93%E6%9E%84
11. Popal (2023)，Smartphone Market Insights, IDC, https://www.idc.com/promo/smartphone-market-share
12. Shirer, M. (2024), Apple Grabs the Top Spot in the Smartphone Market in 2023 along with Record High Market Share Despite the Overall Market Dropping 3.2%, According to IDC Tracker, IDC, https://www.idc.com/getdoc.jsp?containerId=prUS51776424
13. Telit Cinterion (2024), Everything You Need to Know about 5G mmWave and Sub-6 Antennas, https://www.telit.com/blog/faq-mmwave-sub6/
14. The White House (2022), https://www.whitehouse.gov/briefing-room/statements-releases/2022/08/09/fact-sheet-chips-and-science-act-will-lower-costs-create-jobs-strengthen-supply-chains-and-counter-china/
15. United States Trade Representative (2018), https://ustr.gov/about-us/policy-offices/press-office/press-releases/2018/june/ustr-issues-tariffs-chinese-products
16. U.S. Department of Commerce (2020), https://2017-2021.commerce.gov/news/press-releases/2020/05/commerce-addresses-huaweis-efforts-undermine-entity-list-restricts.html
17. Woolston, C. (2023), What China’s leading position in natural sciences means for global research, NATURE, https://www.nature.com/articles/d41586-023-02159-7。 |
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