| 摘要(英) |
In the modern semiconductor industry, quality control in the die bonding process is critical for ensuring the performance and reliability of the final product. Traditional measurement methods face issues such as the inconvenience of built-in software in equipment and manual calculation errors, in addition to challenges like particle contamination on wafers and incorrect chip placement during the production process. These issues can lead to instability in quality control, necessitating effective solutions to ensure product quality and production efficiency. To address these challenges, this study proposes an integrated solution combining MATLAB and C# tools. Firstly, a MATLAB-based measurement program was developed to tackle the issue of die attach paste height measurement. This program is user-friendly and capable of automatic measurement and calculation, thereby reducing manual calculation errors and enhancing measurement accuracy. Secondly, a C#-based Windows application was developed to address the issues of particle contamination and incorrect chip placement. This application can quickly and accurately detect and handle these problems, improving production efficiency and reducing the risk of compensation.
Furthermore, to enhance measurement speed and accuracy, this study utilized MATLAB′s neural network capabilities for visual training, enabling rapid measurement and automatic result determination based on actual conditions. This innovative solution not only accelerates the assessment of die attach paste height but also provides a solid technical foundation for the future implementation of automated factories. |
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