高導電 高硬度 鋁 銀 銅 金屬薄膜 之 研 製

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姓名

劉承德(Cheng-De Liu) 查詢紙本館藏

畢業系所

機械工程學系

論文名稱

高導電高硬度鋁銀銅金屬薄膜之研製
(The Development of the High-Conductivity High-Hardness AlAgCu Thin Film)

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至系統瀏覽論文 (2029-8-31以後開放)

摘要(中)

隨著3C商品與工業4.0的進步，帶動連接器產業的發展，越來越多研究開始導向以較低的價格提升連接器的效能，傳統連接端子為了增加與外層結合性，先鍍一層純鎳作為基底後，再鍍一層純金膜，這樣一來，由於鎳與金的價格昂貴，整體的成本也會不斷上升，因此使國內外連接器廠轉而開發及研究不同的鍍膜材料，以取代金與鎳。連接端子經常用於機器之間的連接，操作時端子與端子間須具備耐衝擊、耐插拔、低電阻、耐高溫、耐濕、耐腐蝕等特性，對於機械性質、電器性質及環境性質的要求極為重要，因此如何提升端子材料性質為研發上探討的核心項目之一。
非晶質結構相比於一般結晶結構，提供了材料較高的硬度與耐磨耗性能，且因不具有晶界之特點，表現出極強的抗氧化及耐腐蝕特性，若應用於薄膜上將能有效應用作為端子材料。本研究開發鋁-銀-銅(Al -Ag -Cu)基金屬薄膜，嘗試取代昂貴的純金和純鎳薄膜，並利用直流磁控濺鍍法將合金以非晶質結構之形式鍍覆於玻璃基板上，來研究其機械性質及導電度。
實驗結果顯示以直流磁控濺鍍法可以成功將鋁-銀-銅(Al-Ag-Cu)基以非晶質合金結構形式鍍覆於玻璃基板上，鍍膜後之鋁-銀-銅(Al-Ag-Cu)基非晶質合金結構能維持非晶態，薄膜的電阻率量測結果顯示，在經過快速退火熱處理後，Al46Ag35Cu19非晶態薄膜的電阻率將降低至低至98 μΩ∙cm，而Al70Ag15Cu15複合結構則降於39 μΩ∙cm。與純銅的42 μΩ∙cm及純鎳的141 μΩ∙cm相比，有領先的趨勢。透過奈米壓痕分析，Al52Ag31Cu17非晶態薄膜硬度最高到達了6.11GPa之硬度與111.83GPa之楊氏模數，而Al65Ag15Cu20複合結構到達了3.75GPa之硬度與95.37之楊氏模數。非晶質膜的硬度相比於純金膜高出了4倍之多。本研究證明了此方案的可行性，AlAgCu金屬薄膜具有極大的潛力。

摘要(英)

With the advancement of 3C products and Industry 4.0, the connector industry has also been growing. More and more research is focusing on improving the performance of connectors at a lower cost now. Traditionally, terminals connector enhance their bonding with the outer layer by first coating with a layer of pure nickel as a base, followed by a layer of pure gold. However, since the prices of nickel and gold are very high, the overall cost continually increases. As a result, domestic and international connector manufacturers are turning to the development and research of alternative coating materials to replace the nickel and gold parts. In commercial, terminals connector must possess characteristics such as impact resistance, durability under repeated insertion and removal, low electrical resistance, high-temperature resistance and moisture resistance. Consequently, improving the mechanical, electrical, and environmental properties of terminals connector are the core topics.
This study try to develop the aluminum-silver-copper (Al-Ag-Cu) amorphous alloys and use this amorphous alloys to fabricate a thin film to replace the expensive pure gold and pure nickel films. In this study the alloy is coated onto glass substrates to form an amorphous structure film by using DC magnetron sputtering, and then investigate the mechanical properties, electrical conductivity, and corrosion resistance of these thin film.
Compared with conventional crystalline structures, amorphous structure possess higher hardness and wear resistance. Additionally, due to the absence of grain boundaries, they exhibit extremely strong oxidation resistance and corrosion resistance. When applied to thin films, these properties can effectively address existing issues.
The results show that the aluminum-silver-copper (Al-Ag-Cu) based alloy can be successfully deposited onto glass substrates using DC magnetron sputtering. XRD results show that after the deposition the Al-Ag-Cu based alloy retains its amorphous structure.
Rapid thermal annealing at 400℃was performed after deposition, and the resistivity of thin film were measured. The resistivity of the Al46Ag35Cu19 amorphous film reduces to as low as 98 μΩ∙cm, while the Al70Ag15Cu15 composite structure reduces to 39 μΩ∙cm. Compared with pure copper at 42 μΩ∙cm and pure nickel at 141 μΩ∙cm, these results show a promising trend. Through nano-indentation analysis, it was found that the Al52Ag31Cu17 amorphous film achieved a maximum hardness of 6.11 GPa and a Young′s modulus of 111.83 GPa. Meanwhile, the Al65Ag15Cu20 composite structure reached a hardness of 3.75 GPa and a Young′s modulus of 95.37 GPa.
The hardness of the amorphous film is four times higher than that of pure gold film. This study demonstrates the feasibility of this approach, showing that AlAgCu metal thin films have great potential.

關鍵字(中)

★ 非晶質合金
★ 薄膜
★ 機械性質
★ 連接器
★ 耐候

關鍵字(英)

★ amorphous alloy
★ film
★ mechanical properties
★ connector
★ weather resistance

論文目次

摘要 i
ABSTRACT ii
致謝 iv
總目錄 vi
表目錄 ix
圖目錄 x
第一章緒論 1
1-1 前言 1
1-2 研究目的 2
第二章文獻回顧 3
2-1 非晶質合金之概述 3
2-2 非晶質合金發展之歷程 4
2-3 非晶質合金之設計 6
2-3-1 歸納法則 6
2-4 非晶質合金之製作 7
2-5 非晶質合金之熱力學性質 9
2-5-1 非晶質合金之Tg、Trg、ΔTx 10
2-5-2 γ 值與 γm值 11
2-6 非晶質合金之性質 12
2-6-1 機械性質 12
2-6-2 電磁性質 13
2-6-3 耐腐蝕性 14
2-6-4 抗菌性 14
2-7 非晶質合金薄膜 14
2-7-1 濺鍍法製作金屬玻璃薄膜(sputtering) [64] 15
2-7-2 直流濺鍍(DC sputtering deposition)與射頻濺鍍(RF sputtering deposition) 15
2-7-3 偏壓輔助鍍法(bias) 16
2-7-4 非晶質薄膜應用 16
2-8 薄膜之成長原理[69,70] 17
第三章實驗方法與步驟 27
3-1 玻璃基板之準備 27
3-2 靶材之製成與準備 27
3-2-1 成分計算與配置 27
3-2-2 傾倒式高週波真空感應熔煉法 28
3-3 AlAgCu金屬薄膜的製作 29
3-3-1 直流磁控濺鍍(DC sputtering) 29
3-3-2 快速退火熱處理(rapid thermal annealing, RTA) 29
3-4 非晶質合金性質分析 30
3-4-1 薄膜厚度分析 30
3-4-2 熱性質分析 30
3-4-3 四點探針分析 (Four-Point Probes) 31
3-5 機械性質分析 31
3-5-1 奈米壓痕測試 31
3-6 微觀結構分析 32
3-6-1 低掠角X光繞射分析(DIXRD) 32
3-6-2 原子力顯微鏡分析(AFM) 33
3-6-3 能量散射光譜儀(EDS) 34
3-6-4 掃描式電子顯微鏡(SEM) 34
第四章結果與討論 46
4-1 成分分析 46
4-2 薄膜結構分析 47
4-3 熱性值分析 47
4-4 晶體尺寸分析 48
4-5 表面粗糙度分析 49
4-6 厚度分析 49
4-7 導電度分析 50
4-8 薄膜硬度分析 51
第五章結論 78
第六章參考文獻 79

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指導教授

鄭憲清(Shian-Ching Jang)

審核日期

2024-7-24

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