參考文獻 |
參考文獻
[1] Pendeoepitaxy of gallium nitride thin films
Kevin Linthicum,Thomas Gehrke, Darren Thomson, Eric Carlson, Pradeep Rajagopal, Tim Smith, Dale Batchelor, and Robert Davis
Appl. Phys. Lett. 75, 196 (1999)
[2] Increase in the extraction efficiency of GaN-based light-emitting diodes via surface roughening
T. Fujii,Y. Gao, R. Sharma, E. L. Hu, S. P. DenBaars,and S. Nakamura
Appl. Phys. Lett. 84, 855 (2004)
[3] Improved light-output and electrical performance of InGaN-based light-emitting diode by microroughening of the p-GaN surface
Chul Huh,Kug-Seung Lee, Eun-Jeong Kang, and Seong-Ju Park
J. Appl. Phys. 93, 9383 (2003)
[4] http://www.cree.com/ftp/pub/Cpr3bd.pdf
[5] High-power AlGaInN flip-chip light-emitting diodes
J. J. Wierer,D. A. Steigerwald, M. R. Krames, J. J. O'Shea, M. J. Ludowise, G. Christenson,Y.-C. Shen, C. Lowery, P. S. Martin, S. Subramanya, W. Götz, N. F. Gardner, R. S. Kern, and S. A. Stockman
Appl. Phys. Lett. 78, 3379 (2001)
[6] GaInN/GaN multiple quantum wells green LEDs
M. Koike, N. Koide, S. Asami, J. Umezaki, S. Nagai, S. Yamasaki,
N. Shibata, H. Amano, and I. Akasaki, in Proc. SPIE International Society for Optical Engineering,vol. 3002, pp. 36–39, (1997)
[7] P-Type Conduction in Mg-Doped GaN Treated with Low-Energy Electron Beam Irradiation (LEEBI)
Hiroshi Amano, Masahiro Kito, Kazumasa Hiramatsu and Isamu Akasaki Jpn. J. Appl. Phys Part 2-Letters 28 , 2112 (1989)
[8] Hole Compensation Mechanism of P-Type GaN Films
S. Nakamura, N. Iwasa, M. Senoh, and T. Mukai, Jpn. J. Appl. Phys. 31,1258 (1992)
[9] Room-temperature photoenhanced wet etching of GaN
M. S. Minsky, M. White, and E. L. Hu
Appl. Phys. Lett. 68, 1531 (1996)
[10] Smooth n-type GaN surfaces by photoenhanced wet etching
C. Youtsey , I. Adesida , L. T. Romano and G. Bulman
Appl. Phys. Lett. 72, 560 (1997)
[11] Investigation of the mechanism for Ohmic contact formation in Al and Ti/Al contacts to n-type GaN
B. P. Luther, S. E. Mohney, T. N. Jackson, M. Asif Khan, Q. Chen, and J. W. Yang
Appl. Phys. Lett. 70, 57 (1996)
[12] Microstructure of Ti/Al and Ti/Al/Ni/Au Ohmic contacts for n-GaN
S. Ruvimov, Z. Liliental-Weber, J. Washburn, K. J. Duxstad, E. E. Haller, Z.-F. Fan, S. N. Mohammad, W. Kim, A. E. Botchkarev, and H. Morkoç
Appl. Phys. Lett. 69, 1556 (1996)
[13] The effect of thermal annealing on the Ni/Au contact of p-type GaN
J. K. Sheu , Y. K. Su ,G. C. Chi ,W. C. Chen, C. Y. Chen, C. N. Huang,J. M. Hong,Y. C. Yu, C. W. Wang, and E. K. Lin
J. Appl. Phys. 83, 3172 (1998)
[14] Microstructural investigation of oxidized Ni/Au ohmic contact to p-type GaN
Li-Chien Chen, Fu-Rong Chen, Ji-Jung Kai,Li Chang,Jin-Kuo Ho, Charng-Shyang Jong, Chien C. Chiu, Chao-Nien Huang, Chin-Yuen Chen, and Kwang-Kuo Shih
J. Appl. Phys. 86, 3826 (1999)
[15] Low-resistance ohmic contacts to p-type GaN
Jin-Kuo Ho, Charng-Shyang Jong, Chien C. Chiu, Chao-Nien Huang, Chin-Yuen Chen, and Kwang-Kuo Shih
Appl. Phys. Lett. 74, 1275 (1999)
[16] Effects of surface treatments and metal work functions on electrical properties at p-GaN/metal interfaces
Hidenori Ishikawa, Setsuko Kobayashi, Y. Koide,S. Yamasaki, S. Nagai, J. Umezaki, M. Koike and Masanori Murakami
J. Appl. Phys. 81, 1315 (1997)
[17] Handbook of Chemistry and Physics
David R. Lide editor in chief
82nd Edition page 12-133
[18] Low-resistance and thermally stable ohmic contact on p-type GaN using Pd/Ni metallization
Ho Won Jang, Ki Hong Kim, Jong Kyu Kim, Soon-Won Hwang,Jung Ja Yang,Kang Jae Lee, Sung-Jin Son, and Jong-Lam Lee
Appl. Phys. Lett. 79, 1822 (2001)
[19] Modeling of a GaN-based light-emitting diode for uniform current spreading
Hyunsoo Kim, Ji-Myon Lee, Chul Huh, Sang-Woo Kim, Dong-Joon Kim, Seong-Ju Park,and Hyunsang Hwang
Appl. Phys. Lett. 77, 1903 (2000)
[20] Lateral current transport path, a model for GaN-based light-emitting diode: Application to practical device designs
Hyunsoo Kim, Seong-Ju Park,and Hyunsang Hwang
Appl. Phys. Lett. 81, 1326 (2002)
[21] Current crowding in GaN/InGaN light-emitting diodes on insulating substrates
X. Guo and E. F. Schubert
J. Appl. Phys. 90, 4191 (2001)
[22] Development of High Efficiency GaN-Based Multiquantum-Well Light-Emitting Diodes and Their Applications
Masayoshi Koike, Naoki Shibata, Hisaki Kato, and Yuji Takahashi
IEEE JOURNAL ON SELECTED TOPICS IN QUANTUM ELECTRONICS, VOL. 8, NO. 2, MARCH/APRIL 2002
[23] Low-resistance and highly reflective Zn–Ni solid solution/Ag ohmic contacts for flip-chip light-emitting diodes
June-O Song, Dong-Seok Leem,J. S. Kwak, O. H. Nam, Y. Park and Tae-Yeon Seong
Appl. Phys. Lett. 83, 4990 (2003)
[24] Highly Reflective and Low-Resistant Ni/Au/ITO/Ag Ohmic Contact on p-Type GaN
Soo Young Kim and Jong-Lam Lee
Electrochemical and Solid State Letters, 7(5) G102-104 (2004)
[25] Ⅲ-Nitride Light-Emitting Device with Increased Light Generating Capability
Krames et al.
United States Patent US 6521914 B2 (2003)
[26] Low resistance high reflectance contacts to p-GaN using oxidized Ni/Au and Al or Ag
D. L. Hibbard, S. P. Jung, C. Wang, D. Ullery, Y. S. Zhao, H. P. Lee,W. So and H. Liu
Appl. Phys. Lett. 83, 311 (2003)
[27] 高反射p型氮化鎵歐姆接觸之研究
方啟鑫
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