Springer New York;Boston: Springer Science and Business Media LLC
摘要:
摘要： Ni diffusion in Cu 6 Sn 5 intermetallic compound was investigated. First, we successfully fabricated preferred-orientation Cu 6 Sn 5 crystal by liquid-phase electroepitaxy (LPEE). Then, Ni/Cu 6 Sn 5 diffusion couples were produced by sputtering from a Ni thin film onto the Cu 6 Sn 5 crystal. Ni/Cu 6 Sn 5 diffusion couples were annealed at different temperatures of 120°C, 160°C, 200°C, 255°C, 290°C, and 320°C for 2 h in a vacuum. The Ni atomic profile across the Ni/Cu 6 Sn 5 interface was obtained by electron spectroscopy for chemical analysis (ESCA). From the Ni atomic profiles, the Matano method was used to evaluate the Ni interdiffusion coefficients ( ) in the Cu 6 Sn 5 crystal obtained with different annealing temperatures, which then yields the activation energy for Ni diffusion in the Cu 6 Sn 5 crystal at a particular Ni content. We found that, as Ni diffuses in the ternary Cu 6− x Ni x Sn 5 compound phase, the activation energy of Ni interdiffusion decreases with the Ni content. 其他題名： Journal of Elec Materi 出版者： Boston: Springer Science and Business Media LLC 出版日期： 2012-01-01 出處： Journal of Electronic Materials, 2012-01, Vol.41 (1), p.172-175 資源來源： EBSCOhost OmniFile Full Text Select 版權： TMS 2011 版權： 2015 INIST-CNRS 識別號： ISSN: 0361-5235 識別號： EISSN: 1543-186X 識別號： DOI: 10.1007/s11664-011-1821-8 識別號： CODEN: JECMA5
