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    請使用永久網址來引用或連結此文件: https://ir.lib.ncu.edu.tw/handle/987654321/100140


    題名: Fabrication of vertical thin-GaN light-emitting diode by low-temperature Cu/Sn/Ag wafer bonding
    作者: 劉正毓;Chen, Y.J.;Chang, C.C.;Lin, H.Y.;Hsu, S.C.;Liu, C.Y.
    貢獻者: 工學院化學工程與材料工程學系
    關鍵詞: Bonding;Copper;Gallium nitrides;Light-emitting diodes;Silicon substrates;Silver;Tin;Wafers
    日期: 2012-02-01
    上傳時間: 2026-04-21 13:50:44 (UTC+8)
    出版者: Elsevier Ltd.;Elsevier Ltd
    摘要: 摘要: Vertical thin-GaN LED was successfully fabricated on the GaN LED epi-layers grown on the patterned-sapphire substrate with the pyramidal pattern by low-temperature Cu/Sn/Ag wafer bonding at 150 °C. An inverted pyramidal pattern formed on the n-GaN surface after the GaN epi-layer was transferred onto Si wafer, which resulted from the pyramidal pattern on the patterned-sapphire substrate. The inverted pyramidal pattern has an equivalent function with roughening the n-GaN surface. With higher inverted pyramidal pattern coverage, the light extraction efficiency can be greatly enhanced. In addition, we found that the 4-fold increase (from 13.6% to 53.8%) in the pyramidal pattern coverage on patterned-sapphire substrate only gives the GaN LED epi-layer about 5.7% enhancement in the internal quantum efficiency.
    出版者: Elsevier Ltd
    出版日期: 2012-02-01
    出處: Microelectronics and reliability, 2012-02, Vol.52 (2), p.381-384
    資源來源: Elsevier ScienceDirect Journals Complete
    版權: 2010 Elsevier Ltd
    識別號: ISSN: 0026-2714
    識別號: DOI: 10.1016/j.microrel.2010.11.010
    顯示於類別:[化學工程與材料工程學系 ] 期刊論文

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