Nanomechanical responses of intermetallic phase at the solder joint interface - Crystal orientation and metallurgical effects

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題名:	Nanomechanical responses of intermetallic phase at the solder joint interface - Crystal orientation and metallurgical effects
作者:	劉正毓;Song, Jenn-Ming;Huang, Bo-Ron;Liu, Cheng-Yi;Lai, Yi-Shao;Chiu, Ying-Ta;Huang, Tzu-Wen
貢獻者:	工學院化學工程與材料工程學系
關鍵詞:	Anisotropy;Applied sciences;Brazing. Soldering;Condensed matter: structure, mechanical and thermal properties;Cross-disciplinary physics: materials science;rheology;Exact sciences and technology;Hardness;Intermetallics;Joining, thermal cutting: metallurgical aspects;Materials science;Mechanical Properties;Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology;Metals. Metallurgy;Microalloying;Phase transformation;Physics;Soldering;Solid solution, precipitation, and dispersion hardening;aging;Structure of solids and liquids;crystallography;Structure of specific crystalline solids;Treatment of materials and its effects on microstructure and properties
日期:	2012-02-01
上傳時間:	2026-04-21 13:50:59 (UTC+8)
出版者:	Elsevier BV;Kidlington: Elsevier B.V
摘要:	摘要： ► Textural and alloying effects on mechanical behavior of Cu6Sn5 are explored. ► Orientation dependence on elastic behavior of Cu6Sn5 is verified and explained. ► Allotropic transition and plastic ability for Cu6Sn5 are linked. ► How alloying affects the hexagonal to monoclinic transition of Cu6Sn5 is proposed. In this study, the relationships between crystal structures, metallurgical effects, and mechanical properties of the most common intermetallic compound formed at the interface of solder joints, Cu6Sn5, were investigated using nanoindentation. Experimental results show that the (112¯0) oriented hexagonal Cu6Sn5 exhibited anisotropic mechanical behavior compared to those with random growth directions. The closest atomic packing density of the (112¯0) plane in hexagonal Cu6Sn5 resulted in higher hardness and notably, greater stiffness. Subjected to long time aging at 150°C, hexagonal Cu6Sn5 was transformed into the equilibrium monoclinic structure, resulting in a reduced modulus and thus inferior ability for plasticity. Alloying of Ni, Mn and rare earth elements (La and Ce) had various contributions to the allotropic transition and thus nanoindentation responses. It was found that the differences in atomic radius between the solute elements and Cu affected the kinetics of the allotropic transformation and also the mechanical performance of Cu6Sn5. There exists a critical value for the modulus/hardness ratio (E/H) of about 17.3–17.5, below which the indent morphology showed a brittle characteristic. 出版者： Kidlington: Elsevier B.V 出版日期： 2012-02-01 出處： Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2012-02, Vol.534, p.53-59 版權： 2011 Elsevier B.V. 版權： 2015 INIST-CNRS 識別號： ISSN: 0921-5093 識別號： EISSN: 1873-4936 識別號： DOI: 10.1016/j.msea.2011.11.037
顯示於類別:	[化學工程與材料工程學系 ] 期刊論文

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