Adsorption and desorption of bis-(3-sulfopropyl) disulfide during cu electrodeposition and stripping at Au electrodes

Please use this identifier to cite or link to this item: https://ir.lib.ncu.edu.tw/handle/987654321/100385

Title:	Adsorption and desorption of bis-(3-sulfopropyl) disulfide during cu electrodeposition and stripping at Au electrodes
Authors:	姚學麟;Chiu, Yong-Da;Dow, Wei-Ping;Krug, Klaus;Liu, Yung-Fang;Lee, Yuh-Lang;Yau, Shueh-Lin
Contributors:	理學院化學學系
Keywords:	adsorption;Chemistry;chlorides;copper;desorption;Electrochemistry;electrodes;Exact sciences and technology;General and physical chemistry;gold;ions;oxidation;reaction mechanisms;scanning electron microscopy;Surface physical chemistry;X-ray photoelectron spectroscopy
Date:	2012-10-09
Issue Date:	2026-04-21 14:00:01 (UTC+8)
Publisher:	American Chemical Society;Washington, DC: American Chemical Society
Abstract:	摘要： The adsorption and desorption of bis-(3-sulfopropyl) disulfide (SPS) on Cu and Au electrodes and its electrochemical effect on Cu deposition and dissolution were examined using cyclic voltammetry stripping (CVS), field-emission scanning electron microscopy (FESEM), and X-ray photoelectron spectroscopy (XPS). SPS dissociates into 3-mercapto-1-propanesulfonate when it is contacted with Au and Cu electrodes, producing Cu(I)- and Au(I)-thiolate species. These thiolates couple with chloride ions and promote not only the reduction of Cu2+ in Cu deposition but also the oxidation of Cu0 to Cu+ in Cu stripping. During Cu electrodeposition on the SPS-modified Au electrode, thiolates transfer from Au onto the Cu underpotential deposition (UPD) layer. The Cu UPD layer stabilizes a large part of the transferred thiolates which subsequently is buried by the Cu overpotential deposition (OPD) layer. The buried thiolates reappear on the Au electrode after the copper deposit is electrochemically stripped off. A much smaller part of thiolates transfers to the top of the Cu OPD layer. In contrast, when SPS preadsorbs on a Cu-coated Au electrode, almost all of the adsorbed SPS leaves the Cu surface during Cu electrochemical stripping and does not return to the uncovered Au surface. A reaction mechanism is proposed to explain these results. 其他題名： Langmuir 出版者： Washington, DC: American Chemical Society 出版日期： 2012-10-09 出處： Langmuir, 2012-10, Vol.28 (40), p.14476-14487 資源來源： American Chemical Society Journals 版權： Copyright © 2012 American Chemical Society 版權： 2015 INIST-CNRS 識別號： ISSN: 0743-7463 識別號： ISSN: 1520-5827 識別號： EISSN: 1520-5827 識別號： DOI: 10.1021/la3025183 識別號： PMID: 22978781 識別號： CODEN: LANGD5
Appears in Collections:	[Department of Chemistry] journal & Dissertation

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