摘要： As current-stressing a Cu/Sn joint interface, the Cu atoms in the interfacial cathode Cu-Sn compound would experience the direct electromigration force and chemical potential force simultaneously, which have never been decoupled. In this work, a triple-junction Cu-Sn-Cu joint was designed and current-stressed to separate the above electromigration and chemical forces imposed on the Cu atoms in the Cu-Sn compound. In addition, by obtaining the individual value of the electromigration Cu flux in the cathode Cu6Sn5 compound layer, the effective charge number (Z*) of Cu atoms in the Cu6Sn5 compound can be determined to be 35.6. 其他題名： ECS Solid State Lett 出版者： The Electrochemical Society 出版日期： 2012-08-29 出處： ECS solid state letters, 2012-08, Vol.1 (5), p.P73-P75 版權： 2012 The Electrochemical Society 識別號： ISSN: 2162-8742 識別號： EISSN: 2162-8750 識別號： DOI: 10.1149/2.006205ssl
