Anisotropic dissolution behavior of the second phase in SnCu solder alloys under current stress

NCUIR > Engineering College > Department of Chemical and Materials Engineering > journal & Dissertation > Item 987654321/100622

Please use this identifier to cite or link to this item: https://ir.lib.ncu.edu.tw/handle/987654321/100622

Title:	Anisotropic dissolution behavior of the second phase in SnCu solder alloys under current stress
Authors:	吳子嘉;Chen, Wei-Yu;Chiu, Tsung-Chieh;Lin, Kwang-Lung;Wu, Albert T.;Jang, Wei-Luen;Dong, Chung-Li;Lee, Hsin-Yi
Contributors:	工學院化學工程與材料工程學系
Keywords:	Dissolution;Electromigration;Intermetallic compounds;Recrystallization;Synchrotron radiation
Date:	2013-03-01
Issue Date:	2026-04-21 14:08:56 (UTC+8)
Publisher:	Elsevier Ltd.;Elsevier Ltd
Abstract:	摘要： The microstructural evolution of the intermetallic compound (Cu6Sn5) in Sn–xCu solder matrix under current stress was investigated by scanning electron microscopy (SEM) and in situ synchrotron X-ray diffraction (XRD). The phase evolution of the Cu6Sn5 was also investigated under thermal aging for comparison. The only XRD crystalline peak (3¯14) of Cu6Sn5 that was detected disappeared under current stress, but not under thermal aging. Ex situ SEM observation of the Cu6Sn5 crystal revealed an anisotropic dissolution behavior. The kinetics of the anisotropic dissolution was also investigated. 出版者： Elsevier Ltd 出版日期： 2013-03 出處： Scripta Materialia, 2013-03, Vol.68 (5), p.317-320 版權： 2012 Acta Materialia Inc. 識別號： ISSN: 1359-6462 識別號： EISSN: 1872-8456 識別號： DOI: 10.1016/j.scriptamat.2012.11.001
Appears in Collections:	[Department of Chemical and Materials Engineering] journal & Dissertation

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