Effect of metal bond-pad configurations on the solder microstructure development of flip-chip solder joints

NCU Institutional Repository > 工學院 > 化學工程與材料工程學系 > 期刊論文 > Item 987654321/100919

jsp.display-item.identifier=請使用永久網址來引用或連結此文件: https://ir.lib.ncu.edu.tw/handle/987654321/100919

题名:	Effect of metal bond-pad configurations on the solder microstructure development of flip-chip solder joints
作者:	劉正毓;Hu, Y. J.;Hsu, Y. C.;Huang, T. S.;Lu, C. T.;Wu, Albert T.;Liu, C. Y.
贡献者:	工學院化學工程與材料工程學系
关键词:	Characterization and Evaluation of Materials;Chemistry and Materials Science;Electronics;Electronics and Microelectronics;Instrumentation;Joint strength;Lead free solders;Materials Science;Microstructure;Optical and Electronic Materials;Solid State Physics
日期:	2014-01-01
上传时间:	2026-04-21 14:18:23 (UTC+8)
出版者:	Springer New York;Boston: Springer US
摘要:	摘要： Various microstructural zones were observed in the solidified solder of flip-chip solder joints with three metal bond-pad configurations (Cu/Sn/Cu, Ni/Sn/Cu, and Cu/Sn/Ni). The developed microstructures of the solidified flip-chip solder joints were strongly related to the associated metal bond pad. A hypoeutectic microstructure always developed near the Ni bond pad, and a eutectic or hypereutectic microstructure formed near the Cu pad. The effect of the metal bond pads on the solder microstructure alters the Cu solubility in the molten solder. The Cu content (solubility) in the molten Sn(Cu) solder eventually leads to the development of particular microstructures. In addition to the effect of the associated metal bond pads, the developed microstructure of the flip-chip solder joint depends on the configuration of the metal bond pads. A hypereutectic microstructure formed near the bottom Cu pad, and a eutectic microstructure formed near the top Cu pad. Directional cooling in the flip-chip solder joint during the solidification process causes the effects of the metal bond-pad configuration. Directional cooling causes the Cu content to vary in the liquid Sn(Cu) phase, resulting in the formation of distinct microstructural zones in the developed microstructure of the flip-chip solder joint. 其他題名： Journal of Elec Materi 出版者： Boston: Springer US 出版日期： 2014-01 出處： Journal of electronic materials, 2014-01, Vol.43 (1), p.170-175 資源來源： EBSCOhost OmniFile Full Text Select 版權： TMS 2013 版權： TMS 2014 識別號： ISSN: 0361-5235 識別號： EISSN: 1543-186X 識別號： DOI: 10.1007/s11664-013-2784-8 識別號： CODEN: JECMA5
显示于类别:	[化學工程與材料工程學系 ] 期刊論文

文件中的档案:

档案	描述	大小	格式	浏览次数
index.html		0Kb	HTML	17	检视/开启

在NCUIR中所有的数据项都受到原著作权保护.

社群 sharing

数据加载中.....