摘要： Comparative study on the interfacial reactions between lead-free Sn-Ag-Cu solder and Ni(P) bond pads (with columnar or layered microstructure) has been performed. The microstructure of the columnar Ni(P) is vertical, while the microstructure of the layered Ni(P) tends to be parallel to the solder/Ni(P) interface. The consumption rate of the columnar Ni(P, 7 at.%) layer is larger than that of the layered Ni(P, 7 at.%). We believe that the faster Ni(P) consumption rate of the columnar Ni(P, 7 at.%) layer is due to the orientation of the grains. Spalling of the interfacial (Cu,Ni) 6 Sn 5 compound can be seen at the reaction interfaces for the columnar Ni(P, 7 at.%) layer. On the contrary, no spalling can be seen for the case of the reacted layered Ni(P). 其他題名： Journal of Elec Materi 出版者： Boston: Springer US 出版日期： 2014-01 出處： Journal of electronic materials, 2014-01, Vol.43 (1), p.277-283 資源來源： EBSCOhost OmniFile Full Text Select 版權： TMS 2013 版權： TMS 2014 識別號： ISSN: 0361-5235 識別號： EISSN: 1543-186X 識別號： DOI: 10.1007/s11664-013-2786-6 識別號： CODEN: JECMA5
