摘要： This study sought to clarify the relationship between cracks in surface oxide layers and the growth behavior of tin whiskers. The number, length, and total volume of extrusions were precisely calculated and residual stress was measured using synchrotron radiation x-ray diffractometry. The aim was to elucidate the influence of stress on the driving force and flux involved in atomic diffusion. The distance between weak spots was shown to be the most significant factor involved in the growth of whiskers. The results could explain why increasing the density of the surface weak spots could reduce the number of long whiskers. Measuring the dimensions of whiskers yielded a precise kinetic model capable of describing the migration of atoms to the root of whiskers, resulting in their spontaneous growth. 其他題名： Journal of Elec Materi 出版者： Boston: Springer US 出版日期： 2014-09-01 出處： Journal of electronic materials, 2014-09, Vol.43 (9), p.3290-3295 資源來源： EBSCOhost OmniFile Full Text Select 版權： TMS 2014 版權： 2015 INIST-CNRS 版權： The Minerals, Metals & Materials Society 2014 識別號： ISSN: 0361-5235 識別號： EISSN: 1543-186X 識別號： DOI: 10.1007/s11664-014-3182-6 識別號： CODEN: JECMA5
