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| 題名: | Assembly of Lock-and-Key Colloids Mediated by Polymeric Depletant |
| 作者: | 曹恆光;Chang, Hung-Yu;Huang, Chang-Wei;Chen, Yen-Fu;Chen, Shyh-Yun;Sheng, Yu-Jane;Tsao, Heng-Kwong |
| 貢獻者: | 工學院化學工程與材料工程學系 |
| 關鍵詞: | colloids;Gibbs free energy;osmotic pressure;polymers;solvents |
| 日期: | 2015-11-13 |
| 上傳時間: | 2026-04-21 14:41:07 (UTC+8) |
| 出版者: | American Chemical Society;United States: American Chemical Society |
| 摘要: | 摘要： Polymer-mediated lock-and-key assembly via depletion attraction is purely a shape-recognition process without any molecular bonding. Since the depletion attraction relates to osmotic pressure and excluded volume, the binding tendency in a dispersion of lock-and-key colloids can be controlled by adjusting the characteristics of polymeric depletants. In this work, dissipative particle dynamics accounting for explicit solvents, polymers, and multiple lock–key pairs are performed to investigate the influences of the polymer concentration, chain length, solvent quality, and chain stiffness. As the polymer concentration associated with osmotic pressure is increased, the binding free energy (E b) between a lock–key pair rises linearly and the binding fraction (θLK) in the dispersion grows sigmoidally. Moreover, the increases in the chain length, solvent quality, and chain stiffness lead to the expansion of the polymer size associated with excluded volume and thus both E b and θLK rise accordingly. However, E b and θLK grow to be insensitive to the chain length for long enough polymer coils but still can be enhanced if the polymer becomes rod-like. As the solvent quality is varied, θLK can be dramatically altered, although the radius of gyration of polymers is slightly changed.
其他題名： Langmuir
出版者： United States: American Chemical Society
出版日期： 2015-12-08
出處： Langmuir, 2015-12, Vol.31 (48), p.13085-13093
資源來源： American Chemical Society Journals
版權： Copyright © 2015 American Chemical Society
識別號： ISSN: 0743-7463
識別號： ISSN: 1520-5827
識別號： EISSN: 1520-5827
識別號： DOI: 10.1021/acs.langmuir.5b02527
識別號： PMID: 26566068 |
| 顯示於類別: | [化學工程與材料工程學系 ] 期刊論文
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