Copper conductive lines on flexible substrates fabricated at room temperature

NCUIR > Engineering College > Department of Chemical and Materials Engineering > journal & Dissertation > Item 987654321/101792

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Title:	Copper conductive lines on flexible substrates fabricated at room temperature
Authors:	曹恆光;Wu, Cyuan-Jhang;Sheng, Yu-Jane;Tsao, Heng-Kwong
Contributors:	工學院化學工程與材料工程學系
Keywords:	Copper;Durability;ELECTRICAL CONDUCTIVITY;Electrical resistivity;Electrically conductive;Electronic devices;ELECTRONIC PRODUCTS;Electronics;FABRICATION;POLYETHYLENE;SINTERING;Substrates
Date:	2016-01-01
Issue Date:	2026-04-21 14:45:07 (UTC+8)
Publisher:	Royal Society of Chemistry;Royal Society of Chemistry (RSC)
Abstract:	摘要： Flexible electronic devices often comprise conductive Cu patterns and polymeric substrates. In this article, copper conductive patterns are readily fabricated on various soft polymeric substrates at room temperature by reduction-assisted sintering with ascorbic acid (AA). Conductive lines on polyethylene terephthalate exhibit good flexibility, adhesion, electrical conductivity, and robust durability under substantial deformation. According to XRD and XPS characterization, pure Cu is obtained after reduction by AA. The sintering of Cu is demonstrated via the mechanical strength of Cu patterns. The optimal concentration of AA is about 0.5 M, which corresponds to the lowest resistivity of around 7.74 10 4 cm. The sintering of Cu particles at room temperature can be explained by the removal of oxygen associated with reduction by AA, which drives the rearrangement of nearby Cu atoms. Good adhesion may be attributed to the structure of AA, which is like that of l -3,4-dihydroxyphenylalanine. This method may be applied to spray printing technology or paper electronics. Conductive Cu patterns fabricated at room temperature possess good flexibility, mechanical strength, and electrical conductivity. 出版者： Royal Society of Chemistry (RSC) 出版日期： 2016-01-01 出處： Journal of Materials Chemistry C, 2016-01, Vol.4 (15), p.3274-3280 資源來源： Royal Society of Chemistry 識別號： ISSN: 2050-7526 識別號： EISSN: 2050-7534 識別號： DOI: 10.1039/c6tc00234j
Appears in Collections:	[Department of Chemical and Materials Engineering] journal & Dissertation

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