摘要： A new ternary solder alloy Sn 62 Bi 32 Ga 6 (in wt.%) with melting point of 128°C, which is 10°C lower than that of eutectic Sn-Bi, has been developed. The composition was obtained by adding the maximum possible amount of Ga without causing Ga segregation and the formation of a liquid phase inside the solder. Solders were reflowed on Cu substrates to investigate their interfacial morphologies during liquid reactions. The only intermetallic compound detected at the interfaces was CuGa 2 , which initially formed with a discrete basin type at the interfaces. As the reflow time was increased, the basin-type compound formed a continuous layer that inhibited Cu dissolution. Solid-state aging tests were also performed on the system, and the activation energy for the formation of CuGa 2 was found to be 2.82 kJ/mol, which is much lower than that of the Cu-Sn compound. 其他題名： Journal of Elec Materi 出版者： New York: Springer US 出版日期： 2016-01 出處： Journal of electronic materials, 2016-01, Vol.45 (1), p.197-202 資源來源： EBSCOhost OmniFile Full Text Select 版權： The Minerals, Metals & Materials Society 2015 版權： The Minerals, Metals & Materials Society 2016 識別號： ISSN: 0361-5235 識別號： EISSN: 1543-186X 識別號： DOI: 10.1007/s11664-015-4142-5 識別號： CODEN: JECMA5
