摘要： This study presented the disruption of the Sn and Ag3Sn lattice structures of Sn3.5Ag solder induced by electric current at 5–7 × 103 A/cm2 with a high resolution transmission electron microscope investigation and electron diffraction analysis. The electric current stressing induced a high degree of strain on the alloy, as estimated from the X-ray diffraction (XRD) peak shift of the current stressed specimen. The XRD peak intensity of the Sn matrix and the Ag3Sn intermetallic compound diminished to nearly undetectable after 2 h of current stressing. The electric current stressing gave rise to a high dislocation density of up to 1017/m2. The grain morphology of the Sn matrix became invisible after prolonged current stressing as a result of the coalescence of dislocations. 出版者： Melville: American Institute of Physics 出版日期： 2016-03-21 出處： Journal of applied physics, 2016-03, Vol.119 (11) 資源來源： AIP Journals (American Institute of Physics) 版權： AIP Publishing LLC 版權： 2016 AIP Publishing LLC. 識別號： ISSN: 0021-8979 識別號： EISSN: 1089-7550 識別號： DOI: 10.1063/1.4944033 識別號： CODEN: JAPIAU
