Evolution of residual stress and qualitative analysis of Sn whiskers with various microstructures

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Title:	Evolution of residual stress and qualitative analysis of Sn whiskers with various microstructures
Authors:	吳子嘉;Chen, Hao;Lee, Hsin Yi;Ku, Ching Shun;Wu, Albert T
Contributors:	工學院化學工程與材料工程學系
Keywords:	Analysis;Annealing;Axial stress;Characterization and Evaluation of Materials;Chemistry and Materials Science;Classical Mechanics;Compressive properties;Crystallography and Scattering Methods;Evolution;Grain size;Grains;Intermetallic compounds;Materials Science;Microstructure;Original Paper;Particle accelerators;Polymer Sciences;Qualitative analysis;Residual stress;small cereal grains;Solid Mechanics;Stresses;Synchrotron radiation;Thick films;Thin films;tin;X-radiation
Date:	2016-04-01
Issue Date:	2026-04-21 14:50:35 (UTC+8)
Publisher:	Springer Netherlands;New York: Springer US
Abstract:	摘要： This paper discusses how the microstructures of Sn films affect the kinetics of spontaneous Sn whisker growth. Thin films and those with small grains grew longer whiskers at higher rates than did thick films and those with large grains. Biaxial stresses in the films were measured using synchrotron radiation X-ray; the stress evolution during annealing was correlated with the growth kinetics. An incubation period was observed, in which the compressive stresses in the films built up and the whiskers nucleated. The results indicate that thickness has a greater effect on whisker growth than grain size has. 其他題名： J Mater Sci 出版者： New York: Springer US 出版日期： 2016-04-01 出處： Journal of materials science, 2016-04, Vol.51 (7), p.3600-3606 資源來源： EBSCOhost OmniFile Full Text Select 版權： Springer Science+Business Media New York 2015 版權： COPYRIGHT 2016 Springer 版權： Journal of Materials Science is a copyright of Springer, (2015). All Rights Reserved. 識別號： ISSN: 0022-2461 識別號： EISSN: 1573-4803 識別號： DOI: 10.1007/s10853-015-9680-y
Appears in Collections:	[Department of Chemical and Materials Engineering] journal & Dissertation

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