Mass transport phenomena in copper nanowires at high current density

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Please use this identifier to cite or link to this item: https://ir.lib.ncu.edu.tw/handle/987654321/101902

Title:	Mass transport phenomena in copper nanowires at high current density
Authors:	鄭紹良;Huang, Yu-Ting;Huang, Chun-Wei;Chen, Jui-Yuan;Ting, Yi-Hsin;Cheng, Shao-Liang;Liao, Chien-Neng;Wu, Wen-Wei
Contributors:	工學院化學工程與材料工程學系
Keywords:	Atomic/Molecular Structure and Spectra;Biomedicine;Biotechnology;Chemistry and Materials Science;Condensed Matter Physics;CONNECTORS (ELECTRICAL);Copper;CURRENT;Current density;DENSITY;Direct current;Electric fields;ELECTROMIGRATION;Electron microscopy;Gold;Interconnections;Mass transport;Materials Science;MICROSTRUCTURES;MICROWIRE;Migration;Nanostructure;Nanotechnology;Nanowires;Research Article;Studies;Thermomigration;Transmission electron microscopy;Transport;Transport phenomena;传输现象;击穿故障;纳米线;质量;迁移过程;透射电子显微镜;铜互连;高电流密度
Date:	2016-04-01
Issue Date:	2026-04-21 14:50:39 (UTC+8)
Publisher:	Tsinghua University Press;Beijing: Tsinghua University Press
Abstract:	摘要： Electromigration in Cu has been extensively investigated as the root cause of typical breakdown failure in Cu interconnects. In this study Cu nanowires connected to Au electrodes are fabricated and observed using in situ transmission electron microscopy to investigate the electro- and thermo-migration processes that are induced by direct current sweeps. We observe the dynamic evolution of different mass transport mechanisms. A current density on the order of 106 A/cm^2 and a temperature of approximately 400 ℃ are sufficient to induce electro- and thermo-migration, respectively. Observations of the migration processes activated by increasing temperatures indicate that the migration direction of Cu atoms is dependent on the net force from the electric field and electron wind. This work is expected to support future design efforts to improve the robustness of Cu interconnects. 其他題名： Nano Res 其他題名： Nano Research 出版者： Beijing: Tsinghua University Press 出版日期： 2016-04-01 出處： Nano Research, 2016-04, Vol.9 (4), p.1071-1078 版權： Tsinghua University Press and Springer-Verlag Berlin Heidelberg 2016 版權： Nano Research is a copyright of Springer, (2016). All Rights Reserved. 識別號： ISSN: 1998-0124 識別號： EISSN: 1998-0000 識別號： DOI: 10.1007/s12274-016-0998-9
Appears in Collections:	[Department of Chemical and Materials Engineering] journal & Dissertation

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