LED Die-Bonded on the Ag/Cu Substrate by a Sn-BiZn-Sn Bonding System

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题名:	LED Die-Bonded on the Ag/Cu Substrate by a Sn-BiZn-Sn Bonding System
作者:	劉正毓;Tang, Y. K.;Hsu, Y. C.;Lin, E. J.;Hu, Y. J.;Liu, C. Y.
贡献者:	工學院化學工程與材料工程學系
关键词:	Characterization and Evaluation of Materials;Chemistry and Materials Science;Die casting;Electronics and Microelectronics;Instrumentation;Lead free solders;Materials Science;Optical and Electronic Materials;Solid State Physics;Studies
日期:	2016-12-01
上传时间:	2026-04-21 14:57:19 (UTC+8)
出版者:	Springer New York;New York: Springer US
摘要:	摘要： In this study, light emitting diode (LED) chips were die-bonded on a Ag/Cu substrate by a Sn-BixZn-Sn bonding system. A high die-bonding strength is successfully achieved by using a Sn-BixZn-Sn ternary system. At the bonding interface, there is observed a Bi-segregation phenomenon. This Bi-segregation phenomenon solves the problems of the brittle layer-type Bi at the joint interface. Our shear test results show that the bonding interface with Bi-segregation enhances the shear strength of the LED die-bonding joints. The Bi-0.3Zn and Bi-0.5Zn die-bonding cases have the best shear strength among all die-bonding systems. In addition, we investigate the atomic depth profile of the deposited Bi-xZn layer by evaporating Bi-xZn E-gun alloy sources. The initial Zn content of the deposited Bi-Zn alloy layers are much higher than the average Zn content in the deposited Bi-Zn layers. 其他題名： Journal of Elec Materi 出版者： New York: Springer US 出版日期： 2016-12-01 出處： Journal of electronic materials, 2016-12, Vol.45 (12), p.6171-6176 資源來源： EBSCOhost OmniFile Full Text Select 版權： The Minerals, Metals & Materials Society 2016 版權： Journal of Electronic Materials is a copyright of Springer, 2016. 識別號： ISSN: 0361-5235 識別號： EISSN: 1543-186X 識別號： DOI: 10.1007/s11664-016-4885-7 識別號： CODEN: JECMA5
显示于类别:	[化學工程與材料工程學系 ] 期刊論文

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