Study of Sn and SnAgCu Solders Wetting Reaction on Ni/Pd/Au Substrates

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Title:	Study of Sn and SnAgCu Solders Wetting Reaction on Ni/Pd/Au Substrates
Authors:	劉正毓;Liu, C. Y.;Wei, Y. S.;Lin, E. J.;Hsu, Y. C.;Tang, Y. K.
Contributors:	工學院化學工程與材料工程學系
Keywords:	Characterization and Evaluation of Materials;Chemistry and Materials Science;Electronics and Microelectronics;Instrumentation;Lead free solders;Materials Science;Metals;Optical and Electronic Materials;Solid State Physics;Studies
Date:	2016-12-01
Issue Date:	2026-04-21 14:57:31 (UTC+8)
Publisher:	Springer New York;New York: Springer US
Abstract:	摘要： Wetting reactions of pure Sn and Sn-Ag-Cu solder balls on Au(100 Å and 1000 Å)/Pd(500 Å)/Ni substrates were investigated. The (Au, Pd)Sn 4 phase formed in the initial interfacial reaction between pure Sn and Au(100 Å and 1000 Å)/Pd(500 Å)/Ni substrates. Then, the initially formed (Au, Pd)Sn 4 compound layer either dissolved or spalled into the molten Sn solder with 3 s of reflowing. The exposed Ni under-layer reacted with Sn solder and formed an interfacial Ni 3 Sn 4 compound. We did not observe spalling compound in the Sn-Ag-Cu case, either on the thin Au (100 Å) or the thick Au (1000 Å) substrates. This implies that the Cu content in the Sn-Ag-Cu solder can efficiently suppress the spalling effect and really stabilize the interfacial layer. Sn-Ag-Cu solder has a better wetting than that of the pure Sn solder, regardless of the Au thickness of the Au/Pd/Ni substrate. For both cases of pure Sn and Sn-Ag-Cu, the initial wetting (<3-s reflowing) on the thin Au (100 Å) substrate is better than that of the thick Au (1000 Å) substrate. Over 3-s reflowing, the wetting on the thicker Au layer (1000 Å) substrate becomes better than the wetting on the thinner Au layer (100 Å) substrate. 其他題名： Journal of Elec Materi 出版者： New York: Springer US 出版日期： 2016-12-01 出處： Journal of electronic materials, 2016-12, Vol.45 (12), p.6079-6085 資源來源： EBSCOhost OmniFile Full Text Select 版權： The Minerals, Metals & Materials Society 2016 版權： Journal of Electronic Materials is a copyright of Springer, 2016. 識別號： ISSN: 0361-5235 識別號： EISSN: 1543-186X 識別號： DOI: 10.1007/s11664-016-4941-3 識別號： CODEN: JECMA5
Appears in Collections:	[Department of Chemical and Materials Engineering] journal & Dissertation

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