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    請使用永久網址來引用或連結此文件: https://ir.lib.ncu.edu.tw/handle/987654321/103312


    題名: A microscopic study of strongly plasmonic Au and Ag island thin films
    作者: 洪緯璿;Pavaskar, Prathamesh;Hsu, I-Kai;Theiss, Jesse;Hsuan Hung, Wei;Cronin, Stephen B.
    貢獻者: 工學院材料科學與工程研究所
    關鍵詞: Electric fields;Gold;Islands;Mathematical models;Nanostructure;Plasmonics;Silver;Thin films;Titanium dioxide
    日期: 2013-01-21
    上傳時間: 2026-04-23 11:27:41 (UTC+8)
    出版者: AIP Publishing
    摘要: 摘要: Thin Au and Ag evaporated films (∼5 nm) are known to form island-like growth, which exhibit a strong plasmonic response under visible illumination. In this work, evaporated thin films are imaged with high resolution transmission electron microscopy, to reveal the structure of the semicontinuous metal island film with sub-nm resolution. The electric field distributions and the absorption spectra of these semicontinuous island film geometries are then simulated numerically using the finite difference time domain method and compared with the experimentally measured absorption spectra. We find surface enhanced Raman scattering (SERS) enhancement factors as high as 108 in the regions of small gaps (≤2 nm), which dominate the electromagnetic response of these films. The small gap enhancement is further substantiated by a statistical analysis of the electric field intensity as a function of the nanogap size. Areal SERS enhancement factors of 4.2 × 104 are obtained for these films. These plasmonic films can also enhance the performance of photocatalytic and photovoltaic phenomena, through near-field coupling. For TiO2 photocatalysis, we calculate enhancement factors of 16 and 19 for Au and Ag, respectively. We study the effect of annealing on these films, which results in a large reduction in electric field strength due to increased nanoparticle spacing.
    出版者: AIP Publishing
    出版日期: 2013-01-21
    出處: Journal of Applied Physics, 2013-01, Vol.113 (3)
    資源來源: AIP Publishing Journals
    識別號: ISSN: 0021-8979
    識別號: EISSN: 1089-7550
    識別號: DOI: 10.1063/1.4775784
    顯示於類別:[材料科學與工程研究所 ] 期刊論文

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