Effects of Cu content on thermal stability and wear behavior of Al-12.5Si-1.0Mg alloy

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Title:	Effects of Cu content on thermal stability and wear behavior of Al-12.5Si-1.0Mg alloy
Authors:	李勝隆;Chen, Wen-Chi;Wu, Chih-Ting;Bor, Hui-Yun;Lee, Sheng-Long
Contributors:	工學院材料科學與工程研究所
Keywords:	Applied sciences;Characterization and Evaluation of Materials;Chemistry and Materials Science;Contact of materials. Friction. Wear;Corrosion and Coatings;Engineering Design;Exact sciences and technology;Materials Science;Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology;Metals. Metallurgy;Quality Control;Reliability;Safety and Risk;Tribology
Date:	2013-12-01
Issue Date:	2026-04-23 11:32:26 (UTC+8)
Publisher:	Springer New York;Boston: Springer US
Abstract:	摘要： This study investigates how Cu content affects thermal stability and wear behavior of Al-12.5Si-1.0Mg alloy, by adding 2.55 and 4.53 wt.% Cu. The low-Cu and high-Cu alloys were isothermally heat-treated at 300 °C for 100 h. The results indicated that the amount of eutectic Al 2 Cu and Al 5 Cu 2 Mg 8 Si 6 particles in the high-Cu alloy was more than that in the low-Cu alloy. These hard particles retained in the Al matrices during isothermal heat treatment, maintaining a relatively stable hardness. Therefore, the hardness of the high-Cu alloy was superior to that of the low-Cu alloy in as-cast condition and after isothermal heat treatment. For wear behavior, both isothermal heat-treated alloys showed the same wear rate with 10 N normal load. The wear rate of Al-12.5Si-1.0Mg alloy was independent on the copper content under 10 N load, but the wear rate at a load of 40 N decreased with increasing Cu content in Al-12.5Si-1.0Mg alloy. 其他題名： J. of Materi Eng and Perform 出版者： Boston: Springer US 出版日期： 2013-12-01 出處： Journal of materials engineering and performance, 2013-12, Vol.22 (12), p.3854-3859 資源來源： EBSCOhost OmniFile Full Text Select 版權： ASM International 2013 版權： 2015 INIST-CNRS 識別號： ISSN: 1059-9495 識別號： EISSN: 1544-1024 識別號： DOI: 10.1007/s11665-013-0634-8
Appears in Collections:	[Institute of Materials Science and Engineering] journal & Dissertation

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